TW527328B - Method and device for manufacturing brittle substrates - Google Patents

Method and device for manufacturing brittle substrates Download PDF

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Publication number
TW527328B
TW527328B TW090123554A TW90123554A TW527328B TW 527328 B TW527328 B TW 527328B TW 090123554 A TW090123554 A TW 090123554A TW 90123554 A TW90123554 A TW 90123554A TW 527328 B TW527328 B TW 527328B
Authority
TW
Taiwan
Prior art keywords
substrate
fragile
fragile substrate
scribing
platform
Prior art date
Application number
TW090123554A
Other languages
English (en)
Chinese (zh)
Inventor
Ikuyoshi Takamatsu
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Application granted granted Critical
Publication of TW527328B publication Critical patent/TW527328B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Dicing (AREA)
TW090123554A 2000-10-02 2001-09-25 Method and device for manufacturing brittle substrates TW527328B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000302059A JP3787489B2 (ja) 2000-10-02 2000-10-02 脆性基板のブレイク方法及び装置

Publications (1)

Publication Number Publication Date
TW527328B true TW527328B (en) 2003-04-11

Family

ID=18783487

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090123554A TW527328B (en) 2000-10-02 2001-09-25 Method and device for manufacturing brittle substrates

Country Status (5)

Country Link
JP (1) JP3787489B2 (ko)
KR (1) KR100573207B1 (ko)
CN (1) CN1238167C (ko)
HK (1) HK1048280A1 (ko)
TW (1) TW527328B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451523B (zh) * 2009-03-30 2014-09-01 Mitsuboshi Diamond Ind Co Ltd Substrate fixing device
TWI607975B (zh) * 2013-10-16 2017-12-11 三星鑽石工業股份有限公司 Elastic support plate, breaking device and breaking method

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4169565B2 (ja) * 2002-10-11 2008-10-22 三星ダイヤモンド工業株式会社 脆性材料基板のブレーク方法及びその装置並びに加工装置
KR100724474B1 (ko) 2002-10-22 2007-06-04 엘지.필립스 엘시디 주식회사 액정 표시패널의 절단 장치 및 이를 이용한 절단방법
US7426883B2 (en) * 2002-11-22 2008-09-23 Mitsuboshi Diamond Ind Co Ltd Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method
CN100382941C (zh) * 2003-04-18 2008-04-23 鸿富锦精密工业（深圳）有限公司 光学元件的切割方法
EP1630140A4 (en) * 2003-04-28 2006-10-25 Mitsuboshi Diamond Ind Co Ltd SYSTEM AND METHOD FOR SEPARATING FRAGILE PLATES
JP4839007B2 (ja) * 2005-03-17 2011-12-14 株式会社尼崎工作所 合せガラス切断装置
JP5308892B2 (ja) * 2009-04-01 2013-10-09 三星ダイヤモンド工業株式会社 集積型薄膜太陽電池の製造装置
JP5583478B2 (ja) * 2010-05-25 2014-09-03 株式会社シライテック パネルの折割装置
JP5210409B2 (ja) * 2011-04-06 2013-06-12 三星ダイヤモンド工業株式会社 ブレイク装置
JP5210407B2 (ja) * 2011-04-06 2013-06-12 三星ダイヤモンド工業株式会社 ブレイク装置およびブレイク方法
JP5210408B2 (ja) * 2011-04-06 2013-06-12 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置
KR101329819B1 (ko) * 2012-01-31 2013-11-15 주식회사 티이에스 기판 분단 시스템 및 기판 분단 방법
JP5981791B2 (ja) * 2012-07-18 2016-08-31 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置
CN103586985A (zh) * 2012-08-17 2014-02-19 佳友科技有限公司 脆性材料加工方法与系统
JP2015003513A (ja) 2013-05-24 2015-01-08 三星ダイヤモンド工業株式会社 カッターホイール並びにその製造方法
JP6140012B2 (ja) 2013-07-08 2017-05-31 三星ダイヤモンド工業株式会社 貼り合わせ基板のブレイク方法
JP6115438B2 (ja) * 2013-10-16 2017-04-19 三星ダイヤモンド工業株式会社 破断装置及び分断方法
JP2015140289A (ja) * 2014-01-29 2015-08-03 三星ダイヤモンド工業株式会社 ブレイク装置
JP6387695B2 (ja) 2014-06-13 2018-09-12 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置
FR3024136B1 (fr) * 2014-07-24 2021-04-30 Saint Gobain Procede de rompage d'une feuille de verre
JP6005708B2 (ja) * 2014-10-23 2016-10-12 三星ダイヤモンド工業株式会社 イメージセンサ用ウエハ積層体の分断方法及び分断装置
JP3195489U (ja) * 2014-11-05 2015-01-22 株式会社シライテック パネルの折割装置
FR3031102B1 (fr) * 2014-12-31 2017-01-27 Saint Gobain Procede de rompage d'une forme interieure dans une feuille de verre
KR102509143B1 (ko) 2015-06-30 2023-03-13 미쓰보시 다이야몬도 고교 가부시키가이샤 커터 휠 및 그 제조방법
JP6740606B2 (ja) 2015-07-31 2020-08-19 三星ダイヤモンド工業株式会社 カッターホイール
JP6716900B2 (ja) * 2015-12-04 2020-07-01 三星ダイヤモンド工業株式会社 分断装置
JP2017112265A (ja) * 2015-12-17 2017-06-22 株式会社ディスコ ウエーハの加工方法
JP6746128B2 (ja) 2016-05-24 2020-08-26 三星ダイヤモンド工業株式会社 カッターホイール
JP6897951B2 (ja) 2016-12-28 2021-07-07 三星ダイヤモンド工業株式会社 カッターホイール
JP6897950B2 (ja) 2016-12-28 2021-07-07 三星ダイヤモンド工業株式会社 カッターホイール
JP2019038237A (ja) 2017-08-29 2019-03-14 三星ダイヤモンド工業株式会社 ブレイク装置
JP2019038238A (ja) 2017-08-29 2019-03-14 三星ダイヤモンド工業株式会社 ブレイク装置
CN108423981B (zh) * 2018-05-21 2020-12-25 武汉华星光电半导体显示技术有限公司 一种玻璃基板裂片的方法及装置
JP2020083668A (ja) 2018-11-16 2020-06-04 三星ダイヤモンド工業株式会社 ガラスフリット膜付きガラス基板のスクライブ方法
JP2024077175A (ja) * 2022-11-28 2024-06-07 日本電気硝子株式会社 ガラス物品の製造装置、及びガラス物品の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451523B (zh) * 2009-03-30 2014-09-01 Mitsuboshi Diamond Ind Co Ltd Substrate fixing device
TWI607975B (zh) * 2013-10-16 2017-12-11 三星鑽石工業股份有限公司 Elastic support plate, breaking device and breaking method

Also Published As

Publication number Publication date
JP3787489B2 (ja) 2006-06-21
CN1348850A (zh) 2002-05-15
HK1048280A1 (zh) 2003-03-28
CN1238167C (zh) 2006-01-25
KR20020026815A (ko) 2002-04-12
JP2002103295A (ja) 2002-04-09
KR100573207B1 (ko) 2006-04-24

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MM4A Annulment or lapse of patent due to non-payment of fees