TW509653B - Handling apparatus method for a lead frame processing system - Google Patents

Handling apparatus method for a lead frame processing system Download PDF

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Publication number
TW509653B
TW509653B TW090100710A TW90100710A TW509653B TW 509653 B TW509653 B TW 509653B TW 090100710 A TW090100710 A TW 090100710A TW 90100710 A TW90100710 A TW 90100710A TW 509653 B TW509653 B TW 509653B
Authority
TW
Taiwan
Prior art keywords
storage box
loading
unloading
patent application
scope
Prior art date
Application number
TW090100710A
Other languages
English (en)
Chinese (zh)
Inventor
Kian You Tok
Original Assignee
Yeda Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yeda Electron Ltd filed Critical Yeda Electron Ltd
Application granted granted Critical
Publication of TW509653B publication Critical patent/TW509653B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Branching, Merging, And Special Transfer Between Conveyors (AREA)
  • Intermediate Stations On Conveyors (AREA)
TW090100710A 2001-01-10 2001-01-12 Handling apparatus method for a lead frame processing system TW509653B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200100185A SG102609A1 (en) 2001-01-10 2001-01-10 Handling apparatus & method for a lead frame processing system

Publications (1)

Publication Number Publication Date
TW509653B true TW509653B (en) 2002-11-11

Family

ID=20430719

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090100710A TW509653B (en) 2001-01-10 2001-01-12 Handling apparatus method for a lead frame processing system

Country Status (5)

Country Link
KR (1) KR100683264B1 (ko)
CN (1) CN1224560C (ko)
SG (1) SG102609A1 (ko)
TW (1) TW509653B (ko)
WO (1) WO2002055414A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7506746B2 (en) 2002-08-31 2009-03-24 Applied Materials, Inc. System for transporting substrate carriers
WO2011111886A1 (ko) * 2010-03-10 2011-09-15 (주) 개성엔터프라이즈 반도체 패키지 리드 프레임 매거진의 자동 공급 및 회수 장치
CN103569679B (zh) * 2013-10-22 2017-05-03 杭州东博自动化科技有限公司 自动取坯设备的坯件输送机构
CN110524215B (zh) * 2019-09-10 2021-08-06 珠海格力智能装备有限公司 上料装置及具有其的组装设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3083321B2 (ja) * 1992-11-24 2000-09-04 日立建機株式会社 リードフレームの加工方法
JPH0753009A (ja) * 1993-08-12 1995-02-28 Shinkawa Ltd マガジン搬送装置
JPH07172513A (ja) * 1993-12-20 1995-07-11 Nec Corp マガジン収納機構
JP2882745B2 (ja) * 1994-02-03 1999-04-12 株式会社カイジョー マガジン位置決め排出装置及びこれを具備したボンディング装置
JP3239048B2 (ja) * 1995-07-13 2001-12-17 株式会社新川 マガジン搬送装置
JP3287768B2 (ja) * 1996-05-24 2002-06-04 株式会社新川 マガジン用エレベータ装置の上下動作データ設定方法
JP3354063B2 (ja) * 1996-11-29 2002-12-09 株式会社新川 リードフレーム供給方法及び供給装置

Also Published As

Publication number Publication date
SG102609A1 (en) 2004-03-26
CN1224560C (zh) 2005-10-26
KR20040024538A (ko) 2004-03-20
CN1492826A (zh) 2004-04-28
KR100683264B1 (ko) 2007-02-15
WO2002055414A1 (en) 2002-07-18

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees