TW479915U - Plasma treatment apparatus - Google Patents

Plasma treatment apparatus

Info

Publication number
TW479915U
TW479915U TW090205833U TW90205833U TW479915U TW 479915 U TW479915 U TW 479915U TW 090205833 U TW090205833 U TW 090205833U TW 90205833 U TW90205833 U TW 90205833U TW 479915 U TW479915 U TW 479915U
Authority
TW
Taiwan
Prior art keywords
treatment apparatus
plasma treatment
plasma
treatment
Prior art date
Application number
TW090205833U
Other languages
English (en)
Inventor
Naoki Matsumoto
Original Assignee
Sumitomo Metal Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Ind filed Critical Sumitomo Metal Ind
Publication of TW479915U publication Critical patent/TW479915U/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32247—Resonators
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
TW090205833U 1998-06-19 1999-06-17 Plasma treatment apparatus TW479915U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18981298A JP4014300B2 (ja) 1998-06-19 1998-06-19 プラズマ処理装置

Publications (1)

Publication Number Publication Date
TW479915U true TW479915U (en) 2002-03-11

Family

ID=16247632

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090205833U TW479915U (en) 1998-06-19 1999-06-17 Plasma treatment apparatus

Country Status (6)

Country Link
US (1) US6358361B1 (zh)
EP (1) EP1006761A4 (zh)
JP (1) JP4014300B2 (zh)
KR (1) KR100363820B1 (zh)
TW (1) TW479915U (zh)
WO (1) WO1999066769A1 (zh)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4245771B2 (ja) * 2000-03-21 2009-04-02 東京エレクトロン株式会社 耐プラズマ部材、電磁波透過窓用部材およびプラズマ処理装置
JP3501715B2 (ja) * 2000-03-21 2004-03-02 シャープ株式会社 プラズマプロセス装置
US6847003B2 (en) * 2000-10-13 2005-01-25 Tokyo Electron Limited Plasma processing apparatus
JP4366856B2 (ja) * 2000-10-23 2009-11-18 東京エレクトロン株式会社 プラズマ処理装置
US7445817B2 (en) * 2002-05-08 2008-11-04 Btu International Inc. Plasma-assisted formation of carbon structures
US20060228497A1 (en) * 2002-05-08 2006-10-12 Satyendra Kumar Plasma-assisted coating
US20060233682A1 (en) * 2002-05-08 2006-10-19 Cherian Kuruvilla A Plasma-assisted engine exhaust treatment
US20060237398A1 (en) * 2002-05-08 2006-10-26 Dougherty Mike L Sr Plasma-assisted processing in a manufacturing line
US20050233091A1 (en) * 2002-05-08 2005-10-20 Devendra Kumar Plasma-assisted coating
CN100436763C (zh) * 2002-05-08 2008-11-26 Btu国际公司 等离子体辅助发动机排气处理
US7638727B2 (en) * 2002-05-08 2009-12-29 Btu International Inc. Plasma-assisted heat treatment
US7504061B2 (en) * 2002-05-08 2009-03-17 Leonhard Kurz Gmbh & Co., Kg Method of decorating large plastic 3D objects
US20060057016A1 (en) * 2002-05-08 2006-03-16 Devendra Kumar Plasma-assisted sintering
US7497922B2 (en) * 2002-05-08 2009-03-03 Btu International, Inc. Plasma-assisted gas production
US7189940B2 (en) * 2002-12-04 2007-03-13 Btu International Inc. Plasma-assisted melting
WO2006127037A2 (en) * 2004-11-05 2006-11-30 Dana Corporation Atmospheric pressure processing using microwave-generated plasmas
US10463061B2 (en) 2004-11-19 2019-11-05 Dsm Ip Assets B.V. Modified plant gums for preparations of active ingredients
DE102007028293B4 (de) * 2007-06-20 2009-09-03 Universität Augsburg Plasmareaktor, dessen Verwendung und Verfahren zur Herstellung einkristalliner Diamantschichten
JP5916534B2 (ja) * 2012-06-26 2016-05-11 東京エレクトロン株式会社 成膜装置
US9355821B2 (en) * 2013-06-19 2016-05-31 Institute Of Nuclear Energy Research Atomic Energy Council, Executive Yuan Large-area plasma generating apparatus
US9743465B2 (en) * 2014-05-19 2017-08-22 Raytheon Company Microwave module lid
KR102619949B1 (ko) * 2016-05-16 2024-01-03 삼성전자주식회사 안테나, 그를 포함하는 마이크로파 플라즈마 소스, 플라즈마 처리 장치
US10748745B2 (en) 2016-08-16 2020-08-18 Applied Materials, Inc. Modular microwave plasma source
US10707058B2 (en) * 2017-04-11 2020-07-07 Applied Materials, Inc. Symmetric and irregular shaped plasmas using modular microwave sources
US11037764B2 (en) 2017-05-06 2021-06-15 Applied Materials, Inc. Modular microwave source with local Lorentz force
US10504699B2 (en) 2018-04-20 2019-12-10 Applied Materials, Inc. Phased array modular high-frequency source
US11081317B2 (en) 2018-04-20 2021-08-03 Applied Materials, Inc. Modular high-frequency source
US11393661B2 (en) 2018-04-20 2022-07-19 Applied Materials, Inc. Remote modular high-frequency source
JP2020092195A (ja) * 2018-12-06 2020-06-11 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP7450475B2 (ja) * 2020-06-30 2024-03-15 東京エレクトロン株式会社 プラズマ処理装置

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS625600A (ja) 1985-06-28 1987-01-12 住友金属工業株式会社 マイクロ波プラズマ処理装置
JPH0695479B2 (ja) 1985-10-25 1994-11-24 住友金属工業株式会社 マイクロ波プラズマ発生装置
US5134965A (en) 1989-06-16 1992-08-04 Hitachi, Ltd. Processing apparatus and method for plasma processing
US6165311A (en) * 1991-06-27 2000-12-26 Applied Materials, Inc. Inductively coupled RF plasma reactor having an overhead solenoidal antenna
JP2588327B2 (ja) 1991-08-20 1997-03-05 株式会社ピーエフユー プリンタの用紙搬送方法
JP2886752B2 (ja) 1991-11-05 1999-04-26 キヤノン株式会社 無端環状導波管を有するマイクロ波導入装置及び該装置を備えたプラズマ処理装置
US5487875A (en) 1991-11-05 1996-01-30 Canon Kabushiki Kaisha Microwave introducing device provided with an endless circular waveguide and plasma treating apparatus provided with said device
JPH05129095A (ja) 1991-11-06 1993-05-25 Hitachi Ltd プラズマ処理装置
EP0552491B1 (en) * 1992-01-24 1998-07-15 Applied Materials, Inc. Plasma etch process and plasma processing reactor
JPH06112141A (ja) 1992-09-25 1994-04-22 Sumitomo Metal Ind Ltd マイクロ波プラズマ装置
JPH06112138A (ja) 1992-09-30 1994-04-22 Sumitomo Metal Ind Ltd マイクロ波プラズマ処理装置
JPH06232081A (ja) * 1993-02-08 1994-08-19 Yasuhiro Horiike Ｉｃｐプラズマ処理装置
JPH06267863A (ja) * 1993-03-15 1994-09-22 Hitachi Ltd マイクロ波プラズマ処理装置
EP0688038B1 (en) * 1994-06-14 2001-12-19 Sumitomo Metal Industries, Ltd. Microwave plasma processing system
JP3164188B2 (ja) 1994-06-14 2001-05-08 日本電気株式会社 プラズマ処理装置
JP3429391B2 (ja) * 1995-05-22 2003-07-22 株式会社アルバック プラズマ処理方法及び装置
JP3164195B2 (ja) 1995-06-15 2001-05-08 住友金属工業株式会社 マイクロ波プラズマ処理装置
JPH099973A (ja) * 1995-06-27 1997-01-14 Chisso Corp ロードコッカス属細菌由来のニトリルヒドラターゼ遺伝子およびアミダーゼ遺伝子
JPH09167696A (ja) * 1995-12-15 1997-06-24 Sony Corp 誘導結合プラズマ処理装置
KR970071945A (ko) * 1996-02-20 1997-11-07 가나이 쯔도무 플라즈마처리방법 및 장치
JP3082659B2 (ja) 1996-03-18 2000-08-28 株式会社日立製作所 プラズマ処理装置
TW328617B (en) 1996-03-28 1998-03-21 Sumitomo Metal Ind Plasma processing device and plasma processing method
JPH10172792A (ja) * 1996-12-05 1998-06-26 Tokyo Electron Ltd プラズマ処理装置
JPH10242124A (ja) 1997-02-26 1998-09-11 Sumitomo Metal Ind Ltd プラズマ処理装置およびプラズマ処理方法
JP2925535B2 (ja) * 1997-05-22 1999-07-28 キヤノン株式会社 環状導波路を有するマイクロ波供給器及びそれを備えたプラズマ処理装置及び処理方法
JP3912865B2 (ja) 1997-09-22 2007-05-09 東京エレクトロン株式会社 プラズマ処理装置
JP3957374B2 (ja) 1997-10-20 2007-08-15 東京エレクトロン株式会社 マイクロ波プラズマ処理装置
JPH11204295A (ja) 1998-01-12 1999-07-30 Sumitomo Metal Ind Ltd マイクロ波プラズマ処理装置
TW385623B (en) * 1997-10-20 2000-03-21 Sumitomo Metal Ind Apparatus and method for microwave plasma process
JP3093718B2 (ja) 1998-03-25 2000-10-03 キヤノン株式会社 マイクロ波導入装置及び表面処理方法

Also Published As

Publication number Publication date
KR100363820B1 (ko) 2002-12-06
EP1006761A1 (en) 2000-06-07
US6358361B1 (en) 2002-03-19
WO1999066769A1 (fr) 1999-12-23
JP2000012292A (ja) 2000-01-14
KR20010023058A (ko) 2001-03-26
JP4014300B2 (ja) 2007-11-28
EP1006761A4 (en) 2007-05-16

Similar Documents

Publication Publication Date Title
TW479915U (en) Plasma treatment apparatus
EP1096554A4 (en) PLASMIC TREATMENT APPARATUS
EP1099779A4 (en) SURFACE TREATMENT APPARATUS
HK1025241A1 (en) Massaging apparatus
EP1069603A4 (en) MANUFACTURING FACILITY
EP1187187A4 (en) PLASMA TREATMENT APPARATUS
SG63778A1 (en) Plasma processing apparatus
EP1193746A4 (en) APPARATUS FOR PLASMA TREATMENT
GB9620151D0 (en) Plasma processing apparatus
SG67448A1 (en) Substrate treatment apparatus
HK1042255A1 (zh) 廢物處理裝置
SG71809A1 (en) Solution treatment apparatus
GB2346341B (en) Vehicle-lamp-molding apparatus
SG66424A1 (en) Plasma processing apparatus
EP1094505A4 (en) PLASMA APPARATUS
EP1152646A4 (en) PROCESS AND APPARATUS FOR PLASMA PROCESSING
EP1146801A4 (en) DEVICE FOR SEPARATING HAIRSTANDS
GB9722408D0 (en) Plasma processing apparatus
GB2341194B (en) Trousers-fly-serging apparatus
GB9807574D0 (en) Apparatus
GB9812852D0 (en) Plasma processing apparatus
GB2340662B (en) Obstruction-responsive apparatus
GB2340135B (en) Trousers-fly-sewing apparatus
EP1143497A4 (en) plasma etcher
GB9930603D0 (en) Plasma process and apparatus

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model