TW397883B - Panel connecting structure - Google Patents
Panel connecting structure Download PDFInfo
- Publication number
- TW397883B TW397883B TW088106325A TW88106325A TW397883B TW 397883 B TW397883 B TW 397883B TW 088106325 A TW088106325 A TW 088106325A TW 88106325 A TW88106325 A TW 88106325A TW 397883 B TW397883 B TW 397883B
- Authority
- TW
- Taiwan
- Prior art keywords
- panel
- panels
- sealing material
- head
- connection structure
- Prior art date
Links
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 239000003566 sealing material Substances 0.000 claims description 47
- 238000009434 installation Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 22
- 239000011162 core material Substances 0.000 description 15
- 230000002093 peripheral effect Effects 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 238000002485 combustion reaction Methods 0.000 description 3
- 230000009970 fire resistant effect Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 235000015170 shellfish Nutrition 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000002079 cooperative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910001504 inorganic chloride Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/66—Sealings
- E04B1/68—Sealings of joints, e.g. expansion joints
- E04B1/6813—Compressable seals of hollow form
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/38—Connections for building structures in general
- E04B1/388—Separate connecting elements
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Building Environments (AREA)
- Joining Of Building Structures In Genera (AREA)
- Finishing Walls (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15407298A JP3585088B2 (ja) | 1998-06-03 | 1998-06-03 | パネルの連結構造 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW397883B true TW397883B (en) | 2000-07-11 |
Family
ID=15576289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW088106325A TW397883B (en) | 1998-06-03 | 1999-04-20 | Panel connecting structure |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3585088B2 (ja) |
| KR (1) | KR20000005639A (ja) |
| TW (1) | TW397883B (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200207662Y1 (ko) * | 2000-07-14 | 2000-12-15 | 주식회사파트너 | 비상등 안정기 회로 |
| JP3811917B2 (ja) * | 2002-04-11 | 2006-08-23 | 正次 佐藤 | 冷凍倉庫用パネル、冷凍倉庫用壁体構造、冷凍倉庫 |
| KR100955228B1 (ko) | 2007-11-02 | 2010-04-29 | 김성주 | 천정재 고정구 |
| KR100955229B1 (ko) * | 2007-11-02 | 2010-04-29 | 김성주 | 천정재 고정구 |
| JP5176203B2 (ja) * | 2007-12-27 | 2013-04-03 | コマニー株式会社 | クリーンルームのパネル連結構造 |
| KR101117410B1 (ko) * | 2010-02-04 | 2012-02-29 | 박현준 | 건축용 패널 |
| JP6903257B2 (ja) * | 2016-11-17 | 2021-07-14 | 清水建設株式会社 | 耐火パネルの連結構造 |
-
1998
- 1998-06-03 JP JP15407298A patent/JP3585088B2/ja not_active Expired - Fee Related
-
1999
- 1999-04-20 TW TW088106325A patent/TW397883B/zh not_active IP Right Cessation
- 1999-05-04 KR KR1019990015988A patent/KR20000005639A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11350618A (ja) | 1999-12-21 |
| KR20000005639A (ko) | 2000-01-25 |
| JP3585088B2 (ja) | 2004-11-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |