TW376550B - Apparatus for and method of cleaning objects to be processed - Google Patents

Apparatus for and method of cleaning objects to be processed

Info

Publication number
TW376550B
TW376550B TW086114099A TW86114099A TW376550B TW 376550 B TW376550 B TW 376550B TW 086114099 A TW086114099 A TW 086114099A TW 86114099 A TW86114099 A TW 86114099A TW 376550 B TW376550 B TW 376550B
Authority
TW
Taiwan
Prior art keywords
processed
cleaning objects
occurrence
diw
cleaning apparatus
Prior art date
Application number
TW086114099A
Other languages
English (en)
Inventor
Yuji Kamikawa
Satoshi Nakashima
Kinya Ueno
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TW376550B publication Critical patent/TW376550B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW086114099A 1996-09-27 1997-09-26 Apparatus for and method of cleaning objects to be processed TW376550B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25663696 1996-09-27

Publications (1)

Publication Number Publication Date
TW376550B true TW376550B (en) 1999-12-11

Family

ID=17295366

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086114099A TW376550B (en) 1996-09-27 1997-09-26 Apparatus for and method of cleaning objects to be processed

Country Status (6)

Country Link
US (1) US6045624A (zh)
EP (1) EP0833375B1 (zh)
KR (1) KR100432270B1 (zh)
DE (1) DE69736378T2 (zh)
SG (1) SG63753A1 (zh)
TW (1) TW376550B (zh)

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TW583734B (en) * 1999-04-28 2004-04-11 Winbond Electronics Corp Wafer cleaning equipment with function of preventing gas supply pipeline wall from being obstructed
AU5446000A (en) * 1999-05-27 2000-12-18 Lam Research Corporation Wafer drying apparatus and method
JP3448613B2 (ja) * 1999-06-29 2003-09-22 オメガセミコン電子株式会社 乾燥装置
FR2801815B1 (fr) * 1999-12-07 2002-02-15 St Microelectronics Sa Dispositif de rincage de plaquettes semiconductrices
US6379226B1 (en) 1999-12-08 2002-04-30 Memc Electronic Materials, Inc. Method for storing carrier for polishing wafer
JP2001176833A (ja) * 1999-12-14 2001-06-29 Tokyo Electron Ltd 基板処理装置
US6539960B1 (en) * 2000-05-01 2003-04-01 United Microelectronics Corp. Cleaning system for cleaning ink in a semiconductor wafer
KR100691241B1 (ko) * 2000-08-24 2007-03-12 삼성전자주식회사 습식 세정 장치의 건조 장치 및 건조 방법
KR100419561B1 (ko) * 2001-02-01 2004-02-19 에이펫(주) 웨이퍼 세정 및 건조 장치
KR100853000B1 (ko) * 2001-03-16 2008-08-19 신에쯔 한도타이 가부시키가이샤 실리콘 웨이퍼 보관용수 및 보관방법
KR100647485B1 (ko) * 2001-03-30 2006-11-17 삼성전자주식회사 기판의 건조방법
US6564469B2 (en) * 2001-07-09 2003-05-20 Motorola, Inc. Device for performing surface treatment on semiconductor wafers
KR100785454B1 (ko) * 2001-08-08 2007-12-13 씨앤지하이테크 주식회사 반도체 웨이퍼 건조를 위한 아이.피.에이 증발장치
US6457479B1 (en) * 2001-09-26 2002-10-01 Sharp Laboratories Of America, Inc. Method of metal oxide thin film cleaning
CN101499413B (zh) * 2001-11-02 2011-05-04 应用材料股份有限公司 单个晶片的干燥装置和干燥方法
US20030136429A1 (en) * 2002-01-22 2003-07-24 Semitool, Inc. Vapor cleaning and liquid rinsing process vessel
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
KR20040008059A (ko) * 2002-07-15 2004-01-28 한주테크놀로지 주식회사 기판 세정 방법 및 이를 이용한 기판 세정 장치
JP4493649B2 (ja) * 2004-04-02 2010-06-30 東京エレクトロン株式会社 基板処理装置、基板処理方法、記録媒体およびソフトウエア
JP2006310767A (ja) * 2005-03-28 2006-11-09 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4176779B2 (ja) * 2006-03-29 2008-11-05 東京エレクトロン株式会社 基板処理方法，記録媒体及び基板処理装置
US20080053486A1 (en) * 2006-08-10 2008-03-06 Applied Materials, Inc. Semiconductor substrate cleaning apparatus
JP5248058B2 (ja) * 2006-09-26 2013-07-31 大日本スクリーン製造株式会社 基板処理装置
US8596336B2 (en) * 2008-06-03 2013-12-03 Applied Materials, Inc. Substrate support temperature control
CN101718487B (zh) * 2009-12-04 2013-07-31 有研半导体材料股份有限公司 一种硅片清洗后的快速干燥方法和装置
CN107710388B (zh) * 2015-06-15 2021-08-24 株式会社Jet 基板处理装置
JP6990720B2 (ja) * 2018-01-09 2022-01-12 東京エレクトロン株式会社 洗浄装置、洗浄方法及びコンピュータ記憶媒体
US11515178B2 (en) 2020-03-16 2022-11-29 Tokyo Electron Limited System and methods for wafer drying
CN214060923U (zh) * 2020-11-13 2021-08-27 苏州市多利伦蚕丝有限公司 一种用于蚕丝生产的清洗装置

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NL8601939A (nl) * 1986-07-28 1988-02-16 Philips Nv Werkwijze voor het verwijderen van ongewenste deeltjes van een oppervlak van een substraat.
JPS6481230A (en) * 1987-09-24 1989-03-27 Hitachi Ltd Treatment device
JPH01287928A (ja) * 1987-12-29 1989-11-20 Mitsubishi Electric Corp 蒸気乾燥方法及びその装置
NL8900480A (nl) * 1989-02-27 1990-09-17 Philips Nv Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof.
JPH0723559B2 (ja) * 1989-06-12 1995-03-15 ダイセル化学工業株式会社 スタンパー洗浄装置
US5180438A (en) * 1989-10-11 1993-01-19 Hockh Metall-Reinigungsanlagen Gmbh Cleaning and drying system
US4977688A (en) * 1989-10-27 1990-12-18 Semifab Incorporated Vapor device and method for drying articles such as semiconductor wafers with substances such as isopropyl alcohol
US5371950A (en) * 1990-02-23 1994-12-13 S & K Products International, Inc. Isopropyl alcohol vapor dryer system
US5488964A (en) * 1991-05-08 1996-02-06 Tokyo Electron Limited Washing apparatus, and washing method
KR0155390B1 (ko) * 1991-05-08 1998-12-01 이노우에 아키라 세정 장치
US5156173A (en) * 1991-05-14 1992-10-20 Envirosolv High-efficiency, low-emissions cleaning method and apparatus
JP2902222B2 (ja) * 1992-08-24 1999-06-07 東京エレクトロン株式会社 乾燥処理装置
JP3003016B2 (ja) * 1992-12-25 2000-01-24 東京エレクトロン株式会社 処理装置及び処理方法
JP3347814B2 (ja) * 1993-05-17 2002-11-20 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理方法並びにその処理装置
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JPH08189768A (ja) * 1994-11-07 1996-07-23 Ryoden Semiconductor Syst Eng Kk 蒸気乾燥装置、それを組込んだ洗浄装置および蒸気乾燥方法
US5571337A (en) * 1994-11-14 1996-11-05 Yieldup International Method for cleaning and drying a semiconductor wafer
US5715612A (en) * 1995-08-17 1998-02-10 Schwenkler; Robert S. Method for precision drying surfaces
US5815942A (en) * 1996-12-13 1998-10-06 Kabushiki Kaisha Toshiba Vapor drying system and method
US5806544A (en) * 1997-02-11 1998-09-15 Eco-Snow Systems, Inc. Carbon dioxide jet spray disk cleaning system

Also Published As

Publication number Publication date
KR100432270B1 (ko) 2004-10-26
DE69736378T2 (de) 2007-07-26
EP0833375B1 (en) 2006-07-26
KR19980025067A (ko) 1998-07-06
DE69736378D1 (de) 2006-09-07
SG63753A1 (en) 1999-03-30
EP0833375A3 (en) 2001-05-23
US6045624A (en) 2000-04-04
EP0833375A2 (en) 1998-04-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees