TW373197B - Electronic device having electric wires and the manufacturing method thereof - Google Patents

Electronic device having electric wires and the manufacturing method thereof

Info

Publication number
TW373197B
TW373197B TW087106154A TW87106154A TW373197B TW 373197 B TW373197 B TW 373197B TW 087106154 A TW087106154 A TW 087106154A TW 87106154 A TW87106154 A TW 87106154A TW 373197 B TW373197 B TW 373197B
Authority
TW
Taiwan
Prior art keywords
easy
electric wire
electronic device
layer made
electrodes
Prior art date
Application number
TW087106154A
Other languages
English (en)
Inventor
Takaomi Toi
Tetsuya Morinaga
Masahiro Bando
Tetsuo Hatanaka
Kazuo Kasahara
Koki Sasaki
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP12410297A external-priority patent/JP3552189B2/ja
Priority claimed from JP08178098A external-priority patent/JP3196718B2/ja
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Application granted granted Critical
Publication of TW373197B publication Critical patent/TW373197B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/045—Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)
TW087106154A 1997-05-14 1998-04-22 Electronic device having electric wires and the manufacturing method thereof TW373197B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12410297A JP3552189B2 (ja) 1997-05-14 1997-05-14 ワイヤを有する電子部品
JP08178098A JP3196718B2 (ja) 1998-03-27 1998-03-27 コイル部品の製造方法

Publications (1)

Publication Number Publication Date
TW373197B true TW373197B (en) 1999-11-01

Family

ID=26422790

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087106154A TW373197B (en) 1997-05-14 1998-04-22 Electronic device having electric wires and the manufacturing method thereof

Country Status (3)

Country Link
US (2) US6027008A (zh)
CN (1) CN1098618C (zh)
TW (1) TW373197B (zh)

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CN100378877C (zh) * 1998-03-13 2008-04-02 松下电器产业株式会社 复合元件及其制造方法
DE69918663T2 (de) * 1999-03-31 2005-07-28 Em Microelectronic-Marin S.A., Marin Verfahren zum Verbinden von einer Spule mit einer Mikroschaltung oder einer kleinen elektronischen Einheit durch Schweissen
JP3262107B2 (ja) * 1999-08-26 2002-03-04 株式会社村田製作所 コイル部品及びその製造方法
EP1207539A1 (en) * 2000-11-18 2002-05-22 Joseph M.E. Hsu Glazing covered ferrite core electrode terminal of a surface mounting inductor
JP3755488B2 (ja) * 2001-08-09 2006-03-15 株式会社村田製作所 巻線型チップコイルおよびその特性調整方法
US6837751B2 (en) 2002-07-25 2005-01-04 Delphi Technologies, Inc. Electrical connector incorporating terminals having ultrasonically welded wires
US6588646B2 (en) * 2001-11-24 2003-07-08 Delphi Technologies, Inc. Ultrasonic welding of wires through the insulation jacket thereof
JP2005327876A (ja) * 2004-05-13 2005-11-24 Tdk Corp コイル部品及びその製造方法
JP4777100B2 (ja) * 2006-02-08 2011-09-21 太陽誘電株式会社 巻線型コイル部品
JP4875991B2 (ja) * 2006-02-28 2012-02-15 日特エンジニアリング株式会社 チップコイルの製造装置及び製造方法
KR100958890B1 (ko) 2007-09-14 2010-05-20 두성산업 주식회사 표면 실장용 도전성 접촉 단자
CN101546684B (zh) * 2009-04-30 2011-11-16 福州大学 抗氧化复合薄膜电极
JP2011029111A (ja) * 2009-07-29 2011-02-10 Molex Inc コネクタ
EP2471439B1 (en) * 2009-08-28 2016-10-19 Olympus Corporation Receiver system
CN102097200B (zh) * 2010-12-20 2013-06-19 深圳顺络电子股份有限公司 一种绕线类贴装电子元件的芯柱部件及其制造方法
JP6004568B2 (ja) * 2012-07-25 2016-10-12 日特エンジニアリング株式会社 チップコイルの製造方法
DE102012216926A1 (de) * 2012-09-20 2014-03-20 Jumatech Gmbh Verfahren zur Herstellung eines Leiterplattenelements sowie Leiterplattenelement
CN102945728A (zh) * 2012-11-06 2013-02-27 杭州康磁电子有限公司 一种高温焊接溅射电感骨架
JP2014170783A (ja) * 2013-03-01 2014-09-18 Murata Mfg Co Ltd 電子部品
JP6303341B2 (ja) * 2013-09-03 2018-04-04 Tdk株式会社 コイル部品
JP6015689B2 (ja) 2014-02-19 2016-10-26 Tdk株式会社 コイル部品及びこれに用いる端子部品
CN105825997B (zh) * 2015-01-22 2019-03-22 株式会社村田制作所 线圈部件
US9877399B2 (en) * 2015-09-11 2018-01-23 Nec Space Technologies, Ltd. Lead solder joint structure and manufacturing method thereof
JP7034613B2 (ja) * 2017-06-29 2022-03-14 太陽誘電株式会社 セラミック電子部品及びその製造方法、並びに電子部品実装基板
JP6981119B2 (ja) 2017-09-11 2021-12-15 Tdk株式会社 コイル装置
US10912940B2 (en) * 2017-09-22 2021-02-09 Advanced Bionics Ag Connection joints for joining wires and pads constructed of different conductive materials and methods of making the same
JP2020141077A (ja) * 2019-02-28 2020-09-03 太陽誘電株式会社 コイル部品及び電子機器

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US4792781A (en) * 1986-02-21 1988-12-20 Tdk Corporation Chip-type resistor
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JPS63148646A (ja) * 1986-12-12 1988-06-21 Toshiba Corp 半導体装置
JPS63169006A (ja) * 1987-01-06 1988-07-13 Murata Mfg Co Ltd チツプ型コイル
US4907734A (en) * 1988-10-28 1990-03-13 International Business Machines Corporation Method of bonding gold or gold alloy wire to lead tin solder
US4948030A (en) * 1989-01-30 1990-08-14 Motorola, Inc. Bond connection for components
JPH02271605A (ja) 1989-04-13 1990-11-06 Murata Mfg Co Ltd リード線の接続方法
JP2598826B2 (ja) 1989-10-31 1997-04-09 株式会社村田製作所 チップコイル
JPH05205902A (ja) 1992-01-28 1993-08-13 Ribaa Eretetsuku Kk 角チップ抵抗器及びその製造方法
JP2967666B2 (ja) * 1992-12-08 1999-10-25 株式会社村田製作所 チップ型電子部品
JP3370745B2 (ja) 1993-09-27 2003-01-27 コーア株式会社 チップインダクタおよびその製造方法
JP3097415B2 (ja) * 1993-10-18 2000-10-10 株式会社村田製作所 コイル部品
JPH07161223A (ja) * 1993-12-10 1995-06-23 Murata Mfg Co Ltd 導電性ペーストおよび積層セラミックコンデンサ
US5495976A (en) * 1994-05-27 1996-03-05 Kulicke And Soffa Investments, Inc. Tilted wedge bonding tool
JPH0855738A (ja) * 1994-08-12 1996-02-27 Murata Mfg Co Ltd トランス
JP3285294B2 (ja) * 1995-08-08 2002-05-27 太陽誘電株式会社 回路モジュールの製造方法
JPH09153419A (ja) 1995-11-30 1997-06-10 Taiyo Yuden Co Ltd チップ形巻線回路部品
JP3663786B2 (ja) * 1996-10-14 2005-06-22 ヤマハ株式会社 半導体チップの実装方法と実装構造

Also Published As

Publication number Publication date
US6027008A (en) 2000-02-22
CN1208322A (zh) 1999-02-17
US6552642B1 (en) 2003-04-22
CN1098618C (zh) 2003-01-08

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