TW366368B - Microetching composition for copper or copper alloy - Google Patents

Microetching composition for copper or copper alloy

Info

Publication number
TW366368B
TW366368B TW085108076A TW85108076A TW366368B TW 366368 B TW366368 B TW 366368B TW 085108076 A TW085108076 A TW 085108076A TW 85108076 A TW85108076 A TW 85108076A TW 366368 B TW366368 B TW 366368B
Authority
TW
Taiwan
Prior art keywords
copper
composition
amount
ion source
microetching composition
Prior art date
Application number
TW085108076A
Other languages
English (en)
Inventor
Yoshiro Maki
Toshiko Nakagawa
Yasushi Yamada
Takashi Haruta
Maki Arimura
Original Assignee
Mec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mec Co Ltd filed Critical Mec Co Ltd
Application granted granted Critical
Publication of TW366368B publication Critical patent/TW366368B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals
    • C23G1/103—Other heavy metals copper or alloys of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW085108076A 1995-08-01 1996-07-04 Microetching composition for copper or copper alloy TW366368B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7196637A JP2923524B2 (ja) 1995-08-01 1995-08-01 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法

Publications (1)

Publication Number Publication Date
TW366368B true TW366368B (en) 1999-08-11

Family

ID=16361086

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085108076A TW366368B (en) 1995-08-01 1996-07-04 Microetching composition for copper or copper alloy

Country Status (7)

Country Link
US (1) US5807493A (zh)
EP (1) EP0757118B1 (zh)
JP (1) JP2923524B2 (zh)
KR (1) KR100409189B1 (zh)
CN (1) CN1090686C (zh)
DE (1) DE69612336T2 (zh)
TW (1) TW366368B (zh)

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TW374802B (en) * 1996-07-29 1999-11-21 Ebara Densan Ltd Etching composition, method for roughening copper surface and method for producing printed wiring board
US6146701A (en) * 1997-06-12 2000-11-14 Macdermid, Incorporated Process for improving the adhension of polymeric materials to metal surfaces
US6162503A (en) * 1997-06-12 2000-12-19 Macdermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US5869130A (en) * 1997-06-12 1999-02-09 Mac Dermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
JPH1187928A (ja) * 1997-07-08 1999-03-30 Ibiden Co Ltd 多層プリント配線板
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
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JP4063475B2 (ja) * 1999-11-10 2008-03-19 メック株式会社 銅または銅合金のエッチング剤
US6383272B1 (en) 2000-06-08 2002-05-07 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6419784B1 (en) 2000-06-21 2002-07-16 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
DE10066028C2 (de) * 2000-07-07 2003-04-24 Atotech Deutschland Gmbh Kupfersubstrat mit aufgerauhten Oberflächen
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US6554948B1 (en) 2000-08-22 2003-04-29 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
KR100379824B1 (ko) * 2000-12-20 2003-04-11 엘지.필립스 엘시디 주식회사 식각용액 및 식각용액으로 패턴된 구리배선을 가지는전자기기용 어레이기판
JP4309602B2 (ja) 2001-04-25 2009-08-05 メック株式会社 銅または銅合金と樹脂との接着性を向上させる方法、ならびに積層体
US6627546B2 (en) * 2001-06-29 2003-09-30 Ashland Inc. Process for removing contaminant from a surface and composition useful therefor
US6746547B2 (en) 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper
US7232478B2 (en) 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
US20050067378A1 (en) * 2003-09-30 2005-03-31 Harry Fuerhaupter Method for micro-roughening treatment of copper and mixed-metal circuitry
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US7393461B2 (en) * 2005-08-23 2008-07-01 Kesheng Feng Microetching solution
EP1780309B8 (en) * 2005-10-25 2010-12-15 ATOTECH Deutschland GmbH Composition and method for improved adhesion of polymeric materials to copper or copper alloy surfaces
US7875558B2 (en) 2005-12-21 2011-01-25 Kesheng Feng Microetching composition and method of using the same
US7456114B2 (en) * 2005-12-21 2008-11-25 Kesheng Feng Microetching composition and method of using the same
US8518281B2 (en) * 2008-06-03 2013-08-27 Kesheng Feng Acid-resistance promoting composition
EP2241653B1 (en) 2009-04-15 2017-09-06 ATOTECH Deutschland GmbH Composition and method for micro etching of copper and copper alloys
US8758634B2 (en) 2010-05-26 2014-06-24 Atotech Deutschland Gmbh Composition and method for micro etching of copper and copper alloys
CN102985596B (zh) * 2010-06-18 2016-08-10 三菱瓦斯化学株式会社 用于包含铜层和钼层的多层结构膜的蚀刻液
US9763336B2 (en) 2010-07-06 2017-09-12 Atotech Deutschland Gmbh Methods of treating metal surfaces and devices formed thereby
US9345149B2 (en) 2010-07-06 2016-05-17 Esionic Corp. Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards
CN102181865A (zh) * 2011-04-29 2011-09-14 广州市天承化工有限公司 可循环再用铜和铜合金表面微蚀刻处理剂及处理系统
JP5219008B1 (ja) 2012-07-24 2013-06-26 メック株式会社 銅のマイクロエッチング剤及びその補給液、並びに配線基板の製造方法
SG11201408660QA (en) 2012-09-28 2015-01-29 Mec Co Ltd Microetching agent for copper, supplementary liquid for same, and manufacturing method for circuit board
CN104694909B (zh) * 2014-07-03 2017-01-25 广东丹邦科技有限公司 一种铜表面粗化剂
EP3034654B1 (en) 2014-12-19 2017-10-25 ATOTECH Deutschland GmbH Composition and method for micro etching of copper and copper alloys
WO2017141799A1 (ja) 2016-02-19 2017-08-24 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
JP6218000B2 (ja) 2016-02-19 2017-10-25 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
KR102663554B1 (ko) * 2016-06-10 2024-05-08 삼성디스플레이 주식회사 식각액 조성물 및 이를 이용한 박막 트랜지스터 표시판의 제조 방법
CN108930038B (zh) * 2017-05-22 2021-03-16 东友精细化工有限公司 银薄膜蚀刻液组合物、蚀刻方法和金属图案的形成方法
JP6338232B1 (ja) 2017-09-22 2018-06-06 メック株式会社 銅表面の粗化方法および配線基板の製造方法
CN110408932A (zh) * 2018-04-27 2019-11-05 惠州市鸿宇泰科技有限公司 用于线路板夹具除铜的除铜剂
CN109267127B (zh) * 2018-08-30 2023-09-05 扬州虹扬科技发展有限公司 一种铜基材处理液及预处理工艺
CN113170585B (zh) 2020-06-02 2023-04-04 Mec股份有限公司 微蚀刻剂和配线基板的制造方法
CN113881993A (zh) * 2021-09-29 2022-01-04 新阳硅密（上海）半导体技术有限公司 一种可优化电镀填孔能力的工艺方法
CN115110085A (zh) * 2021-10-23 2022-09-27 赵晓峰 一种铜及合金过氧化氢化学抛光体系中改进脱膜工序的新方法
CN114457335B (zh) * 2022-02-15 2023-10-27 江西省科学院应用物理研究所 一种铜铁碳合金金相浸蚀剂及其使用方法

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Also Published As

Publication number Publication date
KR100409189B1 (ko) 2004-06-04
DE69612336T2 (de) 2001-09-20
JP2923524B2 (ja) 1999-07-26
US5807493A (en) 1998-09-15
CN1147025A (zh) 1997-04-09
KR970011017A (ko) 1997-03-27
EP0757118A1 (en) 1997-02-05
CN1090686C (zh) 2002-09-11
EP0757118B1 (en) 2001-04-04
JPH0941163A (ja) 1997-02-10
DE69612336D1 (de) 2001-05-10

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