KR970011017A - 구리 또는 구리합금용 마이크로 엣칭 조성물 - Google Patents

구리 또는 구리합금용 마이크로 엣칭 조성물 Download PDF

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KR970011017A
KR970011017A KR1019960031430A KR19960031430A KR970011017A KR 970011017 A KR970011017 A KR 970011017A KR 1019960031430 A KR1019960031430 A KR 1019960031430A KR 19960031430 A KR19960031430 A KR 19960031430A KR 970011017 A KR970011017 A KR 970011017A
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South Korea
Prior art keywords
acid
copper
group
composition
chloride
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KR1019960031430A
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English (en)
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KR100409189B1 (ko
Inventor
요시로 마키
토시코 나카가와
야수시 야마다
타카시 하루타
마키 아리무라
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마에다 고사쿠
멧쿠 가부시키가이샤
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals
    • C23G1/103—Other heavy metals copper or alloys of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

(a) 제2구리 이온원, (b) 산해리정수(pKa) 5 이하의 유기산, (c) 할라이드 이온원 및 (d) 물을 함유하는 구리 또는 구리 합금용 마이크로 엣칭 조성물. 이 조성물은 프리프레그 및 레지스트와 같은 수지에 대해 우수한 부착력 및 뛰어난 납땜능을 나타내는 구리 또는 구리합금 표면을 생성할 수 있다. 이 조성물은 고집적의 정교한 라인 패턴을 갖는 인쇄회로기판의 제조에 매우 적합하다.

Description

구리 또는 구리합금용 마리크로 엣칭 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. (a) 제2구리 이온원, (b) 산해리정수(pKa) 5 이하의 유기산, (c) 할라이드 이온원 및 (d) 물을 함유하는 구리 또는 구리 합금용 마이크로 엣칭 조성물.
  2. 제1항에 있어서, 제2구리 이온원 화합물이 유기산의 제2구리염, 염화 제2구리, 브롬화 제2구리 및 수산화 제2구리로 구성된 군에서 선택된 화합물인 마이크로 엣칭 조성물.
  3. 제2항에 있어서, 유기산이 포름산, 아세트산, 프로디온산, 부티르산, 발데르산, 카프론산, 아크릴산, 크로톤산, 이소크로톤산, 옥살산, 말론산, 숙신산, 글루타르산, 아디프산, 피멜산 말레산, 벤조산, 프탈산, 신남산, 글리콜산, 젖산, 말산, 시트로산, 술팜산, β-클로로프로피온산, 니코틴산, 아스코르브산, 히드록실 피발산 및 레블린산으로 이루어진 군에서 선택된 것이 특징인 마이크로 엣칭 조성물.
  4. 제1항에 있어서, 유기산이 포름산, 아세트산, 프로피온산, 부티르산, 발레르산, 카프론산, 아크릴산, 크로톤산, 이소크로톤산, 옥살산, 말론산, 숙신산, 글루타르산, 아디프산, 피멜산 말레산, 벤조산, 프탈산, 신남산, 글리콜산, 젖산, 말산, 시트로산, 술팜산, β-클로로프로피온산, 니코틴산, 아스코르브산, 히드록실 피발산 및 레블린산으로 이루어진 군에서 선택된 5 이하의 산해리정수(pKa)를 갖는 것이 특징인 마이크로 엣칭 조성물.
  5. 제1항에 있어서, 할라이드 이온원의 염산, 브롬화수소산, 염화나트륨, 염화칼슘, 염화칼륨, 염화암모늄, 브롬화칼륨, 염화구리, 브롬화구리, 염화아연, 염화철 및 브롬화주석으로 이루어진 군에서 선택된 화합물인 것이 특징인 마이크로 엣칭 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960031430A 1995-08-01 1996-07-30 구리또는구리합금용마이크로엣칭조성물 KR100409189B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP196637/1995 1995-08-01
JP7196637A JP2923524B2 (ja) 1995-08-01 1995-08-01 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法

Publications (2)

Publication Number Publication Date
KR970011017A true KR970011017A (ko) 1997-03-27
KR100409189B1 KR100409189B1 (ko) 2004-06-04

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Country Status (7)

Country Link
US (1) US5807493A (ko)
EP (1) EP0757118B1 (ko)
JP (1) JP2923524B2 (ko)
KR (1) KR100409189B1 (ko)
CN (1) CN1090686C (ko)
DE (1) DE69612336T2 (ko)
TW (1) TW366368B (ko)

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CN113026019B (zh) * 2017-05-22 2024-01-26 东友精细化工有限公司 银薄膜蚀刻液组合物、蚀刻方法和金属图案的形成方法
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JP2781954B2 (ja) * 1994-03-04 1998-07-30 メック株式会社 銅および銅合金の表面処理剤

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EP0757118B1 (en) 2001-04-04
JP2923524B2 (ja) 1999-07-26
DE69612336T2 (de) 2001-09-20
CN1090686C (zh) 2002-09-11
JPH0941163A (ja) 1997-02-10
US5807493A (en) 1998-09-15
EP0757118A1 (en) 1997-02-05
DE69612336D1 (de) 2001-05-10
CN1147025A (zh) 1997-04-09
KR100409189B1 (ko) 2004-06-04

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