DE69612336T2 - Verfahren zum Mikroätzen von Kupfer und Kupferlegierungen - Google Patents

Verfahren zum Mikroätzen von Kupfer und Kupferlegierungen

Info

Publication number
DE69612336T2
DE69612336T2 DE69612336T DE69612336T DE69612336T2 DE 69612336 T2 DE69612336 T2 DE 69612336T2 DE 69612336 T DE69612336 T DE 69612336T DE 69612336 T DE69612336 T DE 69612336T DE 69612336 T2 DE69612336 T2 DE 69612336T2
Authority
DE
Germany
Prior art keywords
copper
micro
etching
alloys
copper alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69612336T
Other languages
English (en)
Other versions
DE69612336D1 (de
Inventor
Yoshiro Maki
Toshiko Nakagawa
Yasushi Yamada
Takashi Haruta
Maki Arimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MEC Co Ltd
Original Assignee
MEC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEC Co Ltd filed Critical MEC Co Ltd
Application granted granted Critical
Publication of DE69612336D1 publication Critical patent/DE69612336D1/de
Publication of DE69612336T2 publication Critical patent/DE69612336T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals
    • C23G1/103—Other heavy metals copper or alloys of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE69612336T 1995-08-01 1996-07-22 Verfahren zum Mikroätzen von Kupfer und Kupferlegierungen Expired - Lifetime DE69612336T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7196637A JP2923524B2 (ja) 1995-08-01 1995-08-01 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法

Publications (2)

Publication Number Publication Date
DE69612336D1 DE69612336D1 (de) 2001-05-10
DE69612336T2 true DE69612336T2 (de) 2001-09-20

Family

ID=16361086

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69612336T Expired - Lifetime DE69612336T2 (de) 1995-08-01 1996-07-22 Verfahren zum Mikroätzen von Kupfer und Kupferlegierungen

Country Status (7)

Country Link
US (1) US5807493A (de)
EP (1) EP0757118B1 (de)
JP (1) JP2923524B2 (de)
KR (1) KR100409189B1 (de)
CN (1) CN1090686C (de)
DE (1) DE69612336T2 (de)
TW (1) TW366368B (de)

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TW374802B (en) * 1996-07-29 1999-11-21 Ebara Densan Ltd Etching composition, method for roughening copper surface and method for producing printed wiring board
US5869130A (en) * 1997-06-12 1999-02-09 Mac Dermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6146701A (en) * 1997-06-12 2000-11-14 Macdermid, Incorporated Process for improving the adhension of polymeric materials to metal surfaces
US6162503A (en) * 1997-06-12 2000-12-19 Macdermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
KR100361565B1 (ko) * 1997-07-08 2002-11-22 이비덴 가부시키가이샤 인쇄 배선판 및 이의 제조방법
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US6284309B1 (en) 1997-12-19 2001-09-04 Atotech Deutschland Gmbh Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
US6331490B1 (en) * 1998-03-13 2001-12-18 Semitool, Inc. Process for etching thin-film layers of a workpiece used to form microelectric circuits or components
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JP4063475B2 (ja) * 1999-11-10 2008-03-19 メック株式会社 銅または銅合金のエッチング剤
US6383272B1 (en) 2000-06-08 2002-05-07 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6419784B1 (en) 2000-06-21 2002-07-16 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
DE10066028C2 (de) * 2000-07-07 2003-04-24 Atotech Deutschland Gmbh Kupfersubstrat mit aufgerauhten Oberflächen
US6506314B1 (en) * 2000-07-27 2003-01-14 Atotech Deutschland Gmbh Adhesion of polymeric materials to metal surfaces
US6554948B1 (en) 2000-08-22 2003-04-29 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
KR100379824B1 (ko) * 2000-12-20 2003-04-11 엘지.필립스 엘시디 주식회사 식각용액 및 식각용액으로 패턴된 구리배선을 가지는전자기기용 어레이기판
JP4309602B2 (ja) 2001-04-25 2009-08-05 メック株式会社 銅または銅合金と樹脂との接着性を向上させる方法、ならびに積層体
US6627546B2 (en) * 2001-06-29 2003-09-30 Ashland Inc. Process for removing contaminant from a surface and composition useful therefor
US6746547B2 (en) * 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
US20050067378A1 (en) * 2003-09-30 2005-03-31 Harry Fuerhaupter Method for micro-roughening treatment of copper and mixed-metal circuitry
JP2005150554A (ja) * 2003-11-18 2005-06-09 Ngk Spark Plug Co Ltd 配線基板の製造方法
US7393461B2 (en) * 2005-08-23 2008-07-01 Kesheng Feng Microetching solution
ATE482303T1 (de) * 2005-10-25 2010-10-15 Atotech Deutschland Gmbh Zusammensetzung und verfahren zur haftfähigkeitsverbesserung der polymerischen materialien auf kupfer- oder kupferlegierungsoberflächen
US7456114B2 (en) * 2005-12-21 2008-11-25 Kesheng Feng Microetching composition and method of using the same
US7875558B2 (en) * 2005-12-21 2011-01-25 Kesheng Feng Microetching composition and method of using the same
US8518281B2 (en) * 2008-06-03 2013-08-27 Kesheng Feng Acid-resistance promoting composition
EP2241653B1 (de) 2009-04-15 2017-09-06 ATOTECH Deutschland GmbH Zusammensetzung und Verfahren zur Mikroätzung von Kupfer und Kupferlegierungen
KR101628434B1 (ko) * 2010-05-26 2016-06-08 아토테크더치랜드게엠베하 구리 및 구리 합금의 마이크로 에칭을 위한 조성물 및 방법
JP5682624B2 (ja) * 2010-06-18 2015-03-11 三菱瓦斯化学株式会社 銅層及びモリブデン層を含む多層構造膜用エッチング液
EP2591645B1 (de) 2010-07-06 2018-09-05 Namics Corporation Verfahren zur behandlung von kupferflächen für erhöhte haftung an organischen substraten zur verwendung für leiterplatten
KR102042940B1 (ko) 2010-07-06 2019-11-27 아토테크 도이칠란드 게엠베하 인쇄회로기판
CN102181865A (zh) * 2011-04-29 2011-09-14 广州市天承化工有限公司 可循环再用铜和铜合金表面微蚀刻处理剂及处理系统
JP5219008B1 (ja) 2012-07-24 2013-06-26 メック株式会社 銅のマイクロエッチング剤及びその補給液、並びに配線基板の製造方法
SG11201408660QA (en) 2012-09-28 2015-01-29 Mec Co Ltd Microetching agent for copper, supplementary liquid for same, and manufacturing method for circuit board
CN104694909B (zh) * 2014-07-03 2017-01-25 广东丹邦科技有限公司 一种铜表面粗化剂
EP3034654B1 (de) 2014-12-19 2017-10-25 ATOTECH Deutschland GmbH Zusammensetzung und Verfahren zur Mikroätzung von Kupfer und Kupferlegierungen
WO2017141799A1 (ja) 2016-02-19 2017-08-24 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
JP6218000B2 (ja) 2016-02-19 2017-10-25 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
KR102663554B1 (ko) * 2016-06-10 2024-05-08 삼성디스플레이 주식회사 식각액 조성물 및 이를 이용한 박막 트랜지스터 표시판의 제조 방법
CN108930038B (zh) * 2017-05-22 2021-03-16 东友精细化工有限公司 银薄膜蚀刻液组合物、蚀刻方法和金属图案的形成方法
JP6338232B1 (ja) 2017-09-22 2018-06-06 メック株式会社 銅表面の粗化方法および配線基板の製造方法
CN110408932A (zh) * 2018-04-27 2019-11-05 惠州市鸿宇泰科技有限公司 用于线路板夹具除铜的除铜剂
CN109267127B (zh) * 2018-08-30 2023-09-05 扬州虹扬科技发展有限公司 一种铜基材处理液及预处理工艺
KR102404620B1 (ko) 2020-06-02 2022-06-15 멕크 가부시키가이샤 마이크로 에칭제 및 배선 기판의 제조 방법
CN113881993A (zh) * 2021-09-29 2022-01-04 新阳硅密（上海）半导体技术有限公司 一种可优化电镀填孔能力的工艺方法
CN115110085A (zh) * 2021-10-23 2022-09-27 赵晓峰 一种铜及合金过氧化氢化学抛光体系中改进脱膜工序的新方法
CN114457335B (zh) * 2022-02-15 2023-10-27 江西省科学院应用物理研究所 一种铜铁碳合金金相浸蚀剂及其使用方法

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Also Published As

Publication number Publication date
EP0757118B1 (de) 2001-04-04
US5807493A (en) 1998-09-15
KR100409189B1 (ko) 2004-06-04
CN1147025A (zh) 1997-04-09
KR970011017A (ko) 1997-03-27
TW366368B (en) 1999-08-11
EP0757118A1 (de) 1997-02-05
CN1090686C (zh) 2002-09-11
DE69612336D1 (de) 2001-05-10
JPH0941163A (ja) 1997-02-10
JP2923524B2 (ja) 1999-07-26

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