ATE482303T1 - Zusammensetzung und verfahren zur haftfähigkeitsverbesserung der polymerischen materialien auf kupfer- oder kupferlegierungsoberflächen - Google Patents
Zusammensetzung und verfahren zur haftfähigkeitsverbesserung der polymerischen materialien auf kupfer- oder kupferlegierungsoberflächenInfo
- Publication number
- ATE482303T1 ATE482303T1 AT05023278T AT05023278T ATE482303T1 AT E482303 T1 ATE482303 T1 AT E482303T1 AT 05023278 T AT05023278 T AT 05023278T AT 05023278 T AT05023278 T AT 05023278T AT E482303 T1 ATE482303 T1 AT E482303T1
- Authority
- AT
- Austria
- Prior art keywords
- copper
- composition
- alloy surfaces
- polymeric materials
- improving adhesion
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 2
- 239000000463 material Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05023278A EP1780309B8 (de) | 2005-10-25 | 2005-10-25 | Zusammensetzung und Verfahren zur Haftfähigkeitsverbesserung der polymerischen Materialien auf Kupfer- oder Kupferlegierungsoberflächen |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE482303T1 true ATE482303T1 (de) | 2010-10-15 |
Family
ID=36072010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05023278T ATE482303T1 (de) | 2005-10-25 | 2005-10-25 | Zusammensetzung und verfahren zur haftfähigkeitsverbesserung der polymerischen materialien auf kupfer- oder kupferlegierungsoberflächen |
Country Status (10)
Country | Link |
---|---|
US (1) | US8192636B2 (de) |
EP (1) | EP1780309B8 (de) |
JP (1) | JP2009512784A (de) |
KR (1) | KR20080072866A (de) |
CN (1) | CN101379219A (de) |
AT (1) | ATE482303T1 (de) |
DE (1) | DE602005023739D1 (de) |
ES (1) | ES2348361T3 (de) |
TW (1) | TWI395837B (de) |
WO (1) | WO2007048559A1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100155260A1 (en) * | 2008-12-22 | 2010-06-24 | Kwan Yiu Fai | Micro-blasting treatment for lead frames |
KR20100091663A (ko) | 2009-02-11 | 2010-08-19 | 삼성전자주식회사 | 표면개질제, 이를 사용하여 제조된 적층 구조, 그 구조의 제조방법 및 이를 포함하는 트랜지스터 |
CN101525745B (zh) * | 2009-04-03 | 2011-03-30 | 四川大学 | 金属表面处理剂及施用该处理剂形成保护膜的印刷线路板 |
EP2241653B1 (de) * | 2009-04-15 | 2017-09-06 | ATOTECH Deutschland GmbH | Zusammensetzung und Verfahren zur Mikroätzung von Kupfer und Kupferlegierungen |
JP5599506B2 (ja) * | 2010-05-26 | 2014-10-01 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 銅および銅合金のマイクロエッチングのための組成物および方法 |
SG11201400767WA (en) * | 2011-09-30 | 2014-04-28 | 3M Innovative Properties Co | Methods of continuously wet etching a patterned substrate |
EP2754732B1 (de) * | 2013-01-15 | 2015-03-11 | ATOTECH Deutschland GmbH | Wässrige Zusammensetzung zur Ätzung von Kupfer und Kupferlegierungen |
EP2862959A1 (de) * | 2013-10-21 | 2015-04-22 | ATOTECH Deutschland GmbH | Verfahren zur selektiven Behandlung von Kupfer in Gegenwart eines weiteren Metalls |
US9472420B2 (en) | 2013-12-20 | 2016-10-18 | Air Products And Chemicals, Inc. | Composition for titanium nitride hard mask and etch residue removal |
CN104294273B (zh) * | 2014-11-08 | 2016-09-21 | 汕头超声印制板(二厂)有限公司 | 一种无毒剥金液及其应用于印制电路板检测的方法 |
TWI585841B (zh) * | 2015-02-06 | 2017-06-01 | 國立台灣科技大學 | 基板及其加工方法與裝置 |
CN104746091A (zh) * | 2015-04-28 | 2015-07-01 | 深圳市崇辉表面技术开发有限公司 | 一种铸造铝合金洗白除垢溶液 |
CN107267971B (zh) * | 2017-05-25 | 2019-11-26 | 中信大锰矿业有限责任公司 | 一种无磷无铬的钝化剂及其制备方法 |
JP6333455B1 (ja) * | 2017-08-23 | 2018-05-30 | メック株式会社 | 銅のマイクロエッチング剤および配線基板の製造方法 |
CN114045494B (zh) * | 2021-10-25 | 2023-02-03 | 深圳前海榕达创途化工科技股份有限公司 | 一种用于pcb板的低酸度蚀刻生产方法以及双液型酸性蚀刻液体系 |
CN114457335B (zh) * | 2022-02-15 | 2023-10-27 | 江西省科学院应用物理研究所 | 一种铜铁碳合金金相浸蚀剂及其使用方法 |
CN118028814A (zh) * | 2023-12-05 | 2024-05-14 | 惠州市新纬亚纳米科技有限公司 | 陶瓷覆铜板表面处理剂及陶瓷覆铜板表面处理工作液 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1154015A (en) * | 1966-08-22 | 1969-06-04 | Photo Engravers Res Inst Inc | Etching of Printed Circuit Components |
JPS5330435A (en) * | 1976-09-02 | 1978-03-22 | Sumitomo Metal Mining Co | Etching liquid |
JPS57164984A (en) * | 1981-04-06 | 1982-10-09 | Metsuku Kk | Exfoliating solution for tin or tin alloy |
US4921571A (en) * | 1989-07-28 | 1990-05-01 | Macdermid, Incorporated | Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces |
DE4118764A1 (de) * | 1991-06-07 | 1992-12-10 | Chema Technologien Gmbh | Verfahren zum aetzen von kupfer |
US5244539A (en) * | 1992-01-27 | 1993-09-14 | Ardrox, Inc. | Composition and method for stripping films from printed circuit boards |
US5741432A (en) * | 1995-01-17 | 1998-04-21 | The Dexter Corporation | Stabilized nitric acid compositions |
US5512201A (en) * | 1995-02-13 | 1996-04-30 | Applied Chemical Technologies, Inc. | Solder and tin stripper composition |
US5505872A (en) * | 1995-05-23 | 1996-04-09 | Applied Electroless Concepts, Inc. | Solder stripper recycle and reuse |
JP3458023B2 (ja) | 1995-08-01 | 2003-10-20 | メック株式会社 | 銅および銅合金のマイクロエッチング剤 |
JP2923524B2 (ja) * | 1995-08-01 | 1999-07-26 | メック株式会社 | 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法 |
US5911907A (en) * | 1995-08-30 | 1999-06-15 | Surface Tek Specialty Products, Inc. | Composition and method for stripping tin and tin-lead from copper surfaces |
JP3547028B2 (ja) * | 1996-02-26 | 2004-07-28 | 四国化成工業株式会社 | 銅及び銅合金の表面処理剤 |
JPH1072682A (ja) * | 1996-08-30 | 1998-03-17 | Mec Kk | 錫および錫合金の剥離液 |
JP4189609B2 (ja) * | 1997-01-31 | 2008-12-03 | テイラー,ジェームズ、エム. | サブストレート材料をプライミングする組成物及び方法 |
JP2000282265A (ja) * | 1999-03-31 | 2000-10-10 | Mec Kk | 銅または銅合金のマイクロエッチング剤およびそれを用いる表面処理法 |
AU2001253308A1 (en) * | 2000-04-11 | 2001-10-23 | Cabot Microelectronics Corporation | System for the preferential removal of silicon oxide |
US20050126588A1 (en) * | 2003-11-04 | 2005-06-16 | Carter Melvin K. | Chemical mechanical polishing slurries and cleaners containing salicylic acid as a corrosion inhibitor |
US7419911B2 (en) * | 2003-11-10 | 2008-09-02 | Ekc Technology, Inc. | Compositions and methods for rapidly removing overfilled substrates |
-
2005
- 2005-10-25 EP EP05023278A patent/EP1780309B8/de not_active Not-in-force
- 2005-10-25 DE DE602005023739T patent/DE602005023739D1/de active Active
- 2005-10-25 ES ES05023278T patent/ES2348361T3/es active Active
- 2005-10-25 AT AT05023278T patent/ATE482303T1/de active
-
2006
- 2006-09-07 TW TW095133091A patent/TWI395837B/zh not_active IP Right Cessation
- 2006-10-23 KR KR1020087012280A patent/KR20080072866A/ko not_active Application Discontinuation
- 2006-10-23 JP JP2008536981A patent/JP2009512784A/ja active Pending
- 2006-10-23 US US12/090,990 patent/US8192636B2/en not_active Expired - Fee Related
- 2006-10-23 CN CNA2006800391032A patent/CN101379219A/zh active Pending
- 2006-10-23 WO PCT/EP2006/010201 patent/WO2007048559A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
TWI395837B (zh) | 2013-05-11 |
ES2348361T3 (es) | 2010-12-03 |
US8192636B2 (en) | 2012-06-05 |
KR20080072866A (ko) | 2008-08-07 |
EP1780309A1 (de) | 2007-05-02 |
WO2007048559A1 (en) | 2007-05-03 |
US20100035435A1 (en) | 2010-02-11 |
EP1780309B1 (de) | 2010-09-22 |
TW200720483A (en) | 2007-06-01 |
JP2009512784A (ja) | 2009-03-26 |
EP1780309B8 (de) | 2010-12-15 |
DE602005023739D1 (de) | 2010-11-04 |
CN101379219A (zh) | 2009-03-04 |
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Legal Events
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UEP | Publication of translation of european patent specification |
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