TW200833746A - Process for surface modification of polyimide resin layers and process for production of metal-clad laminates - Google Patents

Process for surface modification of polyimide resin layers and process for production of metal-clad laminates

Info

Publication number
TW200833746A
TW200833746A TW96129439A TW96129439A TW200833746A TW 200833746 A TW200833746 A TW 200833746A TW 96129439 A TW96129439 A TW 96129439A TW 96129439 A TW96129439 A TW 96129439A TW 200833746 A TW200833746 A TW 200833746A
Authority
TW
Taiwan
Prior art keywords
polyimide resin
metal
clad laminates
resin layers
plasma
Prior art date
Application number
TW96129439A
Other languages
Chinese (zh)
Other versions
TWI433879B (en
Inventor
Ryuzo Shinta
Yasufumi Matsumura
Yuji Matsushita
Yoko Takeyama
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200833746A publication Critical patent/TW200833746A/en
Application granted granted Critical
Publication of TWI433879B publication Critical patent/TWI433879B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/123—Treatment by wave energy or particle radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Abstract

The invention relates to a surface treatment process for enhancing the adhesiveness of polyimide resin layers dramatically by simple surface treatment. This process brings about enhancement in the adhesiveness of polyimide resin layers even to a low-roughness copper foil suitable for fine-pitch pattern formation and can give metal-clad laminates useful as substrates for high-density printed wiring boards and HDD suspension. The process comprises the step (a) of treating the face of a polyimide resin layer with plasma to form a plasma-treated surface and the step (b) of applying a solution of an amino compound in a polar solvent on the plasma-treated surface and drying and heat-treating the resulting coating to form a surface modification layer. A polyimide resin layer obtained by the process which bears a modification layer on the face can advantageously give metal-clad laminates useful as wiring substrates by forming a metal layer on the surface of the modification layer by means of thermocompression bonding or vapor deposition.
TW96129439A 2006-08-10 2007-08-09 Method for surface modification of polyimide resin layer and method for manufacturing sheet metal paste TWI433879B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006218240 2006-08-10
JP2006245372 2006-09-11

Publications (2)

Publication Number Publication Date
TW200833746A true TW200833746A (en) 2008-08-16
TWI433879B TWI433879B (en) 2014-04-11

Family

ID=39032929

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96129439A TWI433879B (en) 2006-08-10 2007-08-09 Method for surface modification of polyimide resin layer and method for manufacturing sheet metal paste

Country Status (3)

Country Link
JP (1) JP5329960B2 (en)
TW (1) TWI433879B (en)
WO (1) WO2008018399A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102008154A (en) * 2009-08-04 2011-04-13 志圣工业股份有限公司 Method for manufacturing footwear materials
TWI494804B (en) * 2012-09-20 2015-08-01 Tpk Touch Solutions Xiamen Inc Touch panel module, touch device and manufacturing method thereof
CN109699124A (en) * 2019-01-28 2019-04-30 青岛九维华盾科技研究院有限公司 A method of transparency electromagnetic wave shield film is prepared by photoetching and chemical reduction method

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4976269B2 (en) * 2007-12-20 2012-07-18 新日鐵化学株式会社 Method for producing polyimide resin layer having adhesive layer and method for producing metal-clad laminate
JP5177395B2 (en) * 2008-03-24 2013-04-03 地方独立行政法人 岩手県工業技術センター Modification method of resin surface
NL1037120C2 (en) 2009-07-15 2011-01-18 Holland Novochem Technical Coatings B V Heat-resistant, chemical resistant, room temperature curable, solvent-free resin compositions to apply as protective coating.
NL1038104C2 (en) 2010-07-14 2012-01-23 Holland Novochem Technical Coatings B V Heat-resistant, chemical resistant, room temperature curable, solvent-free resin compositions to apply as protective coating.
JP5725398B2 (en) * 2010-09-10 2015-05-27 大日本印刷株式会社 Visibility improvement sheet
JP2015093874A (en) * 2013-11-08 2015-05-18 東洋紡株式会社 Polyimide film surface treatment method, polyimide film treated by the surface treatment method, laminate, and multilayer substrate
WO2016009873A1 (en) 2014-07-14 2016-01-21 戸田工業株式会社 Method for producing conductive coating film, and conductive coating film
JP7116889B2 (en) * 2018-08-20 2022-08-12 東洋紡株式会社 Heat-resistant polymer film, method for producing surface-treated heat-resistant polymer film, and heat-resistant polymer film roll
TW202102369A (en) * 2019-03-29 2021-01-16 日商東洋紡股份有限公司 Heat-resistant polymer film laminate and method for producing heat-resistant polymer film laminate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH093221A (en) * 1995-06-20 1997-01-07 Shin Etsu Chem Co Ltd Highly adhesive polyimide film
JPH114055A (en) * 1997-04-18 1999-01-06 Ube Ind Ltd Flexible circuit board
JPH1149880A (en) * 1997-08-06 1999-02-23 P I Gijutsu Kenkyusho:Kk Treatment of surface and its adhesive agent
JP3736600B2 (en) * 1999-02-22 2006-01-18 株式会社カネカ Adhesive film manufacturing method and adhesive film
JP4699059B2 (en) * 2004-03-25 2011-06-08 新日鐵化学株式会社 Copper foil surface treatment method and copper clad laminate production method
JP2006007519A (en) * 2004-06-24 2006-01-12 Bridgestone Corp Composite film having circuit pattern and its manufacturing method
JP2006007518A (en) * 2004-06-24 2006-01-12 Bridgestone Corp Composite film of metal thin film and plastic film and its manufacturing method
JP2006182019A (en) * 2004-11-30 2006-07-13 Nippon Steel Chem Co Ltd Copper-clad laminate
JP2007098791A (en) * 2005-10-05 2007-04-19 Shin Etsu Chem Co Ltd Flexible one side copper-clad polyimide laminated plate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102008154A (en) * 2009-08-04 2011-04-13 志圣工业股份有限公司 Method for manufacturing footwear materials
TWI494804B (en) * 2012-09-20 2015-08-01 Tpk Touch Solutions Xiamen Inc Touch panel module, touch device and manufacturing method thereof
CN109699124A (en) * 2019-01-28 2019-04-30 青岛九维华盾科技研究院有限公司 A method of transparency electromagnetic wave shield film is prepared by photoetching and chemical reduction method
CN109699124B (en) * 2019-01-28 2021-07-27 青岛九维华盾科技研究院有限公司 Method for preparing transparent electromagnetic shielding film by photoetching and chemical reduction method

Also Published As

Publication number Publication date
JPWO2008018399A1 (en) 2009-12-24
TWI433879B (en) 2014-04-11
WO2008018399A1 (en) 2008-02-14
JP5329960B2 (en) 2013-10-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees