GB1154015A - Etching of Printed Circuit Components - Google Patents
Etching of Printed Circuit ComponentsInfo
- Publication number
- GB1154015A GB1154015A GB3754066A GB3754066A GB1154015A GB 1154015 A GB1154015 A GB 1154015A GB 3754066 A GB3754066 A GB 3754066A GB 3754066 A GB3754066 A GB 3754066A GB 1154015 A GB1154015 A GB 1154015A
- Authority
- GB
- United Kingdom
- Prior art keywords
- ethylene thiourea
- copper
- printed circuit
- amino
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
1,154,015. Etching. PHOTO ENGRAVERS RESEARCH INSTITUTE, Inc. 22 Aug., 1966, No. 37540/66. Heading B6J. [Also in Division H1] Printed circuit components comprising a metal more noble than copper deposited on copper are etched to remove undesired copper in an etchant consisting of aqueous ferric chloride containing ethylene thiourea or substituted ethylene thiourea and a film modifier of the formula wherein W, X, Y and Z are each selected from nitraso, amino, lower alkyl substituted amino, acid radical of a lower fatty acid, hydroxy and hydrogen, at least two of W, X, Y and Z being other than hydrogen and being in ortho or para relation. Suitable substituted ethylene thiourea are those in which one or more hydrogen atoms of ethylene thiourea are replaced by an alkyl or aryl group or those in which an acyl group is joined to the sulphur atom. Examples of suitable groups are methylethylpropyl, isopropylphenol, diphenol and acetylbutyral. Suitable film modifiers are pyrogallal, 2,4- diaminophenol dihydrochloride, tannic acid, hydroquinone, p-benzoquinon, catechol, α- benzoquinone, picric acid, 2,4-dinitrophenol, 4 - amino - 2 - nitrophenol, p - phenylene - diamine, o-phenylendiamine and o-aminophenol. In examples printed circuits comprising gold and/or silver on a copper surface (the copper being laminated to a fibreglass reinforced epoxy resin sheet) are etched. Suitabley etching baths contain, per litre of bath, 200-460 grams FeCl 3 , 1-8 grams of ethylene thiourea or substituted ethylene thiourea and 0À1-10g of film modifier. The etchant may be sprayed, brushed or directed as a jet on to the printed circuit plates. Preferably, however, the solution is splashed on to the plates by a rotating paddle wheel.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US297147A US3287191A (en) | 1963-07-23 | 1963-07-23 | Etching of printed circuit components |
| GB3754066A GB1154015A (en) | 1966-08-22 | 1966-08-22 | Etching of Printed Circuit Components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3754066A GB1154015A (en) | 1966-08-22 | 1966-08-22 | Etching of Printed Circuit Components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1154015A true GB1154015A (en) | 1969-06-04 |
Family
ID=10397230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3754066A Expired GB1154015A (en) | 1963-07-23 | 1966-08-22 | Etching of Printed Circuit Components |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1154015A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2127751A (en) * | 1982-10-06 | 1984-04-18 | Plessey Co Plc | Producing narrow features in electrical devices |
| EP1780309A1 (en) * | 2005-10-25 | 2007-05-02 | Atotech Deutschland Gmbh | Composition and method for improved adhesion of polymeric materials to copper or copper alloy surfaces |
| EP2392694A1 (en) | 2010-06-02 | 2011-12-07 | ATOTECH Deutschland GmbH | Method for etching of copper and copper alloys |
| CN112271135A (en) * | 2020-09-25 | 2021-01-26 | 华东光电集成器件研究所 | Wafer-level Au metal film wet etching patterning method |
-
1966
- 1966-08-22 GB GB3754066A patent/GB1154015A/en not_active Expired
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2127751A (en) * | 1982-10-06 | 1984-04-18 | Plessey Co Plc | Producing narrow features in electrical devices |
| EP1780309A1 (en) * | 2005-10-25 | 2007-05-02 | Atotech Deutschland Gmbh | Composition and method for improved adhesion of polymeric materials to copper or copper alloy surfaces |
| WO2007048559A1 (en) * | 2005-10-25 | 2007-05-03 | Atotech Deutschland Gmbh | Composition and method for improved adhesion of polymeric materials to copper or copper alloy surfaces |
| US8192636B2 (en) | 2005-10-25 | 2012-06-05 | Atotech Deutschland Gmbh | Composition and method for improved adhesion of polymeric materials to copper alloy surfaces |
| EP2392694A1 (en) | 2010-06-02 | 2011-12-07 | ATOTECH Deutschland GmbH | Method for etching of copper and copper alloys |
| WO2011151328A1 (en) | 2010-06-02 | 2011-12-08 | Atotech Deutschland Gmbh | Method for etching of copper and copper alloys |
| CN112271135A (en) * | 2020-09-25 | 2021-01-26 | 华东光电集成器件研究所 | Wafer-level Au metal film wet etching patterning method |
| CN112271135B (en) * | 2020-09-25 | 2023-02-28 | 华东光电集成器件研究所 | Wafer-level Au metal film wet etching patterning method |
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