GB1294804A - Etchant for cupreous metals - Google Patents
Etchant for cupreous metalsInfo
- Publication number
- GB1294804A GB1294804A GB3391771A GB3391771A GB1294804A GB 1294804 A GB1294804 A GB 1294804A GB 3391771 A GB3391771 A GB 3391771A GB 3391771 A GB3391771 A GB 3391771A GB 1294804 A GB1294804 A GB 1294804A
- Authority
- GB
- United Kingdom
- Prior art keywords
- acid
- chloride
- sodium
- etching
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
1294804 Etching SHIPLEY CO Inc 20 July 1971 [24 July 1970 (3)] 33917/71 Heading B6J An aqueous etching solution for copper comprises (1) a source of cupric ions as an oxidant for copper and (2) at least one non-fuming complexing agent for said cupric ions capable of forming a solution soluble copper (II) complex at solution pH, which is from 4 to 13. There may also be added (3) chloride, bromide, or ammonium ions as an exaltant to increase the etching rate, (4) nitrate ions to remove cuprous sludge and allow continuous etching, and (5) a solution soluble molybdenum, tungsten or vanadium compound, which eliminates undesired etching of tin or lead-tin solder. Examples of the abovementioned five constituents are: (1) cupric sulphate, nitrate, chloride or acetate; (2) glycollic acid, malic acid, tartaric acid, gluconic acid, lactic acid; glycerol, sorbitol, diethylene glycol, mannitol; pyruvic acid, levulinic acid; trimethylamine, tetrahydroxypropylethylene diamine, pentahydroxypropyliethylene triamine, propylene diamine, diglycollic acid; aminoacetic acid, alpha- or betaaminopropionic acid, alpha-amino butyric acid, iminodi- or tri-acetic acid, ethylenediaminotetraacetic acid, trihydroxydiacetic acid; mono- or diethanolamine, mono- or diisopropanolamine; sodium or potassium pyrophosphate; (3) ammonium carbonate, sulphate, chloride or bromide; copper chloride or bromide; sodium chloride, (4) nitric acid, ammonium, sodium, potassium or alkaline earth nitrate, (5) ammonium molybdate, molybdenum trioxide, sodium tungstate, sodium vanadate, vanadium pentoxide, molybdic acid.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5820070A | 1970-07-24 | 1970-07-24 | |
US5817070A | 1970-07-24 | 1970-07-24 | |
US5816070A | 1970-07-24 | 1970-07-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1294804A true GB1294804A (en) | 1972-11-01 |
Family
ID=27369405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3391771A Expired GB1294804A (en) | 1970-07-24 | 1971-07-20 | Etchant for cupreous metals |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5515512B1 (en) |
DE (1) | DE2136919A1 (en) |
FR (1) | FR2101897A5 (en) |
GB (1) | GB1294804A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2143778A (en) * | 1983-06-06 | 1985-02-20 | Psi Star Inc | Etching copper and other metals |
AU601756B2 (en) * | 1986-07-04 | 1990-09-20 | Virotherm Laboratories Ltd. | Medical breathing apparatus |
AT395177B (en) * | 1990-07-05 | 1992-10-12 | Provera Gmbh | RESOLUTION |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5328561A (en) * | 1992-07-10 | 1994-07-12 | Macdermid Incorporated | Microetchant for copper surfaces and processes for using same |
DE4339320A1 (en) * | 1993-11-18 | 1995-05-24 | Elochem Aetztechnik Gmbh | Process for accelerated etching and deposition of metals in ammoniacal etching systems |
JP2923524B2 (en) * | 1995-08-01 | 1999-07-26 | メック株式会社 | Copper and copper alloy microetching agent and microetching method |
JP5874308B2 (en) * | 2011-10-21 | 2016-03-02 | 三菱瓦斯化学株式会社 | Etching solution for multilayer film containing copper and molybdenum |
-
1971
- 1971-07-20 GB GB3391771A patent/GB1294804A/en not_active Expired
- 1971-07-23 FR FR7127142A patent/FR2101897A5/fr not_active Expired
- 1971-07-23 DE DE19712136919 patent/DE2136919A1/en active Pending
- 1971-07-24 JP JP5559171A patent/JPS5515512B1/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2143778A (en) * | 1983-06-06 | 1985-02-20 | Psi Star Inc | Etching copper and other metals |
AU601756B2 (en) * | 1986-07-04 | 1990-09-20 | Virotherm Laboratories Ltd. | Medical breathing apparatus |
AT395177B (en) * | 1990-07-05 | 1992-10-12 | Provera Gmbh | RESOLUTION |
Also Published As
Publication number | Publication date |
---|---|
JPS5515512B1 (en) | 1980-04-24 |
FR2101897A5 (en) | 1972-03-31 |
DE2136919A1 (en) | 1972-02-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |