KR970065773A - 구리 또는 구리합금의 마이크로에칭용 조성물 - Google Patents

구리 또는 구리합금의 마이크로에칭용 조성물 Download PDF

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Publication number
KR970065773A
KR970065773A KR1019970006755A KR19970006755A KR970065773A KR 970065773 A KR970065773 A KR 970065773A KR 1019970006755 A KR1019970006755 A KR 1019970006755A KR 19970006755 A KR19970006755 A KR 19970006755A KR 970065773 A KR970065773 A KR 970065773A
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South Korea
Prior art keywords
acid
copper
composition
unsaturated carboxylic
microetching
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KR1019970006755A
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English (en)
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KR100470812B1 (ko
Inventor
홍영구
도시코 나카자와
Original Assignee
마에다 고사쿠
멧쿠 가부시키가이샤
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Publication of KR970065773A publication Critical patent/KR970065773A/ko
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Publication of KR100470812B1 publication Critical patent/KR100470812B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

본 발명은 (a) 질산 또는 황산, 또는 양자, (b) 질산 제1철 또는 황산 제1철 또는 양자, (c) 불포화 카르복실산, 불포화 카르복실산의 염 및 불포화 카르복실산의 무수물로 이루어진 그룹으로부터 선택된 1종 이상의 성분 및 (d) 물을 포함하는, 구리 또는 구리합금의 마이크로에칭용 조성물에 관한 것이다. 상기 조성물은 프리프레그 또는 레지스트와 같은 수지에 대한 접착력이 우수하고, 납땜성이 우수한 구리 또는 구리합금 표면을 제조할 수 있다. 상기 조성물은 고도로 집적된 미세 라인 패턴을 갖는 프린트-배선 기판을 제작하는데 적합하다.

Description

구리 또는 구리합금의 마이크로에칭용 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. (a) 질산 또는 황산, 또는 양자, (b) 질산 제1철 또는 황산 제1철 또는 양자, (c) 불포화 카르복실산, 불포화 카르복실산의 염 및 불포화 카르복실산의 무수물로 이루어진 군에서 선택된 1종 이상의 성분 및 (d) 물을 포함하는, 구리 또는 구리합금의 마이크로에칭용 조성물.
  2. 제1항에 있어서, 황산 또는 질산, 또는 양자의 함량이 0.5~30중량%인 것을 특징으로 하는 구리 또는 구리합금의 마이크로에칭용 조성물.
  3. 제1항에 있어서, 질산 제1철 또는 황산 제1철, 또는 양자의 함량이 0.5~30중량%인 것을 특징으로 하는 구리 또는 구리합금의 마이크로에칭용 조성물.
  4. 제1항에 있어서, 불포화 카르복실산 아크릴산, 메타크릴산, 크로톤산, 이소크로톤산, 말레인산, 푸말산, 시트라콘산, 이타콘산, 프로피올산, 테트롤산 및 아세틸렌 디카르복실산으로 이루어진 군에서 선택된 것을 특징으로 하는 구리 또는 구리합금의 마이크로에칭용 조성물.
  5. 제1항에 있어서, 염이 나트륨염 또는 칼륨염인 것을 특징으로 하는 마이크로에칭용 조성물.
  6. 제1항에 있어서, 불포화 카르복실산 무수물이 무수말레인산, 무수이타콘산 또는 무수시트라콘산인 것을 특징으로 하는 구리 또는 구리합금의 마이크로에칭용 조성물.
  7. 제1항에 있어서, 불포화 카르복실산, 그 염 또는 그 무수물의 함량이 0.1~20중량%인 것을 특징으로 하는 구리 또는 구리합금의 마이크로에칭용 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970006755A 1996-03-05 1997-02-28 구리또는구리합금의마이크로에칭용조성물 KR100470812B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP04758596A JP3458036B2 (ja) 1996-03-05 1996-03-05 銅および銅合金のマイクロエッチング剤
JP47585/1996 1996-03-05

Publications (2)

Publication Number Publication Date
KR970065773A true KR970065773A (ko) 1997-10-13
KR100470812B1 KR100470812B1 (ko) 2005-04-28

Family

ID=12779339

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970006755A KR100470812B1 (ko) 1996-03-05 1997-02-28 구리또는구리합금의마이크로에칭용조성물

Country Status (6)

Country Link
US (1) US5885476A (ko)
EP (1) EP0794269B1 (ko)
JP (1) JP3458036B2 (ko)
KR (1) KR100470812B1 (ko)
DE (1) DE69713185T2 (ko)
TW (1) TW419532B (ko)

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KR101730983B1 (ko) 2010-07-06 2017-04-27 나믹스 코포레이션 인쇄회로기판에서 사용하기 위한 유기 기판에의 접착을 향상시키는 구리 표면의 처리 방법
JP5576525B1 (ja) * 2013-03-29 2014-08-20 メルテックス株式会社 銅エッチング液
CN110809805B (zh) * 2017-07-10 2021-10-26 株式会社协成 使用铜银合金的导电性部件、触头引脚以及装置
CN110158071B (zh) * 2019-06-26 2021-11-23 匡云叶 一种铜用表面处理液及表面处理方法
WO2020261995A1 (ja) * 2019-06-28 2020-12-30 株式会社Adeka 組成物及びエッチング方法
KR102258702B1 (ko) * 2020-09-07 2021-06-01 주식회사 근우 전기 전도율 향상을 위한 표면 구조를 가지는 버스바
KR102258703B1 (ko) * 2020-09-07 2021-06-01 주식회사 근우 전기 전도율 향상을 위한 표면구조를 가지는 버스바 제조방법
KR102332286B1 (ko) * 2021-05-17 2021-12-01 주식회사 근우 발열성이 개선된 동 버스바의 제조방법

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Also Published As

Publication number Publication date
DE69713185T2 (de) 2002-11-28
JPH09241870A (ja) 1997-09-16
EP0794269A1 (en) 1997-09-10
JP3458036B2 (ja) 2003-10-20
US5885476A (en) 1999-03-23
EP0794269B1 (en) 2002-06-12
KR100470812B1 (ko) 2005-04-28
TW419532B (en) 2001-01-21
DE69713185D1 (de) 2002-07-18

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