ATE553415T1 - Lichtempfindliche polyimid-precursor- zusammensetzungen - Google Patents
Lichtempfindliche polyimid-precursor- zusammensetzungenInfo
- Publication number
- ATE553415T1 ATE553415T1 AT01955055T AT01955055T ATE553415T1 AT E553415 T1 ATE553415 T1 AT E553415T1 AT 01955055 T AT01955055 T AT 01955055T AT 01955055 T AT01955055 T AT 01955055T AT E553415 T1 ATE553415 T1 AT E553415T1
- Authority
- AT
- Austria
- Prior art keywords
- polyimide precursor
- photosensitive polyimide
- precursor compositions
- cyclohexenediamine
- mercaptobenzimidazole
- Prior art date
Links
- 239000004642 Polyimide Substances 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 title abstract 2
- 229920001721 polyimide Polymers 0.000 title abstract 2
- 239000002243 precursor Substances 0.000 title abstract 2
- KJUGUADJHNHALS-UHFFFAOYSA-N 1H-tetrazole Chemical compound C=1N=NNN=1 KJUGUADJHNHALS-UHFFFAOYSA-N 0.000 abstract 2
- SOMKOFZJHWCRCJ-UHFFFAOYSA-N 3h-benzimidazole-5-thiol Chemical compound SC1=CC=C2NC=NC2=C1 SOMKOFZJHWCRCJ-UHFFFAOYSA-N 0.000 abstract 1
- YTBASYPYRHIICN-UHFFFAOYSA-N acetic acid;cyclohexene-1,2-diamine;hydrate Chemical compound O.CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O.NC1=C(N)CCCC1 YTBASYPYRHIICN-UHFFFAOYSA-N 0.000 abstract 1
- 238000004132 cross linking Methods 0.000 abstract 1
- 239000003112 inhibitor Substances 0.000 abstract 1
- 230000005764 inhibitory process Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/886,626 US6511789B2 (en) | 2000-06-26 | 2001-06-20 | Photosensitive polyimide precursor compositions |
| PCT/US2001/041188 WO2003001293A1 (en) | 2001-06-20 | 2001-06-28 | Photosensitive polyimide precursor compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE553415T1 true ATE553415T1 (de) | 2012-04-15 |
Family
ID=25389410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT01955055T ATE553415T1 (de) | 2001-06-20 | 2001-06-28 | Lichtempfindliche polyimid-precursor- zusammensetzungen |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6511789B2 (de) |
| EP (1) | EP1405139B1 (de) |
| JP (1) | JP3827238B2 (de) |
| KR (1) | KR20030079913A (de) |
| AT (1) | ATE553415T1 (de) |
| WO (1) | WO2003001293A1 (de) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7129318B2 (en) * | 2003-09-02 | 2006-10-31 | I.S.T. (Ma) Corporation | RTM and RI processable polyimide resins |
| JP2006227387A (ja) * | 2005-02-18 | 2006-08-31 | Hitachi Chemical Dupont Microsystems Ltd | 感光性樹脂組成物、レリーフパターンの形成方法及び電子部品 |
| KR100969014B1 (ko) * | 2005-07-14 | 2010-07-09 | 미쓰이 가가쿠 가부시키가이샤 | 포지티브형 감광성 수지 조성물 및 패턴 형성방법 |
| US7515231B2 (en) * | 2005-09-30 | 2009-04-07 | Teledyne Scientific & Imaging, Llc | Low temperature nematic liquid crystal alignment material and LCD compensator incorporating the liquid crystal alignment material |
| WO2008020469A1 (fr) | 2006-08-14 | 2008-02-21 | Hitachi Chemical Dupont Microsystems, Ltd. | Composition de résine photosensible positive, procédé de préparation d'un motif et composant électronique |
| JP2009019105A (ja) * | 2007-07-11 | 2009-01-29 | Nitto Denko Corp | ポリイミドからなる光半導体素子封止用樹脂 |
| TWI383251B (zh) * | 2008-01-16 | 2013-01-21 | Eternal Chemical Co Ltd | 感光型聚醯亞胺 |
| JP4911116B2 (ja) * | 2008-05-22 | 2012-04-04 | 日立化成デュポンマイクロシステムズ株式会社 | 半導体装置及びその製造方法、感光性樹脂組成物並びに電子部品 |
| JP5571990B2 (ja) * | 2009-06-04 | 2014-08-13 | 旭化成イーマテリアルズ株式会社 | ネガ型感光性樹脂組成物、硬化レリーフパターン形成・製造方法、並びに半導体装置 |
| KR101021947B1 (ko) * | 2009-08-28 | 2011-03-16 | 주식회사 엘지화학 | 저온 경화성 감광성 수지 조성물 및 이를 이용하여 제조된 드라이 필름 |
| JP6643824B2 (ja) * | 2015-07-08 | 2020-02-12 | 旭化成株式会社 | 感光性樹脂組成物、硬化レリーフパターンの製造方法、並びに半導体装置 |
| US10658199B2 (en) * | 2016-08-23 | 2020-05-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method |
| TWI758415B (zh) * | 2017-02-20 | 2022-03-21 | 日商富士軟片股份有限公司 | 感光性樹脂組成物、含雜環聚合物前體、硬化膜、積層體、硬化膜的製造方法及半導體裝置 |
| CN113479924B (zh) * | 2021-07-29 | 2022-09-30 | 桂林理工大学 | 一种用于工业副产物石膏制备α高强石膏的转晶剂 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2437348B2 (de) | 1974-08-02 | 1976-10-07 | Ausscheidung in: 24 62 105 | Verfahren zur herstellung von reliefstrukturen |
| US4548891A (en) | 1983-02-11 | 1985-10-22 | Ciba Geigy Corporation | Photopolymerizable compositions containing prepolymers with olefin double bonds and titanium metallocene photoinitiators |
| US5399460A (en) | 1991-12-04 | 1995-03-21 | E. I. Du Pont De Nemours And Company | Negative photoresists containing aminoacrylate salts |
| US5834581A (en) | 1997-04-15 | 1998-11-10 | Olin Microelectronic Chemicals, Inc. | Process for making polyimide-polyamic ester copolymers |
| WO1999013381A1 (en) | 1997-09-11 | 1999-03-18 | Arch Specialty Chemicals, Inc. | A negatively acting photoresist composition based on polyimide precursors |
| US6160081A (en) * | 1997-10-31 | 2000-12-12 | Nippon Zeon Co., Ltd. | Photosensitive polyimide resin composition |
-
2001
- 2001-06-20 US US09/886,626 patent/US6511789B2/en not_active Expired - Lifetime
- 2001-06-28 JP JP2003507627A patent/JP3827238B2/ja not_active Expired - Lifetime
- 2001-06-28 AT AT01955055T patent/ATE553415T1/de active
- 2001-06-28 KR KR10-2003-7002477A patent/KR20030079913A/ko not_active Application Discontinuation
- 2001-06-28 EP EP01955055A patent/EP1405139B1/de not_active Expired - Lifetime
- 2001-06-28 WO PCT/US2001/041188 patent/WO2003001293A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| US6511789B2 (en) | 2003-01-28 |
| EP1405139A1 (de) | 2004-04-07 |
| US20020025494A1 (en) | 2002-02-28 |
| EP1405139B1 (de) | 2012-04-11 |
| EP1405139A4 (de) | 2006-06-28 |
| WO2003001293A1 (en) | 2003-01-03 |
| KR20030079913A (ko) | 2003-10-10 |
| JP2005500561A (ja) | 2005-01-06 |
| JP3827238B2 (ja) | 2006-09-27 |
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