DE69713185T2 - Zusammensetzung zum Mikroätzen von Kupfer und Kupferlegierungen - Google Patents

Zusammensetzung zum Mikroätzen von Kupfer und Kupferlegierungen

Info

Publication number
DE69713185T2
DE69713185T2 DE69713185T DE69713185T DE69713185T2 DE 69713185 T2 DE69713185 T2 DE 69713185T2 DE 69713185 T DE69713185 T DE 69713185T DE 69713185 T DE69713185 T DE 69713185T DE 69713185 T2 DE69713185 T2 DE 69713185T2
Authority
DE
Germany
Prior art keywords
copper
etching
micro
composition
alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69713185T
Other languages
English (en)
Other versions
DE69713185D1 (de
Inventor
Yoong-Koo Hong
Toshiko Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MEC Co Ltd
Original Assignee
MEC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEC Co Ltd filed Critical MEC Co Ltd
Application granted granted Critical
Publication of DE69713185D1 publication Critical patent/DE69713185D1/de
Publication of DE69713185T2 publication Critical patent/DE69713185T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DE69713185T 1996-03-05 1997-03-03 Zusammensetzung zum Mikroätzen von Kupfer und Kupferlegierungen Expired - Lifetime DE69713185T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04758596A JP3458036B2 (ja) 1996-03-05 1996-03-05 銅および銅合金のマイクロエッチング剤

Publications (2)

Publication Number Publication Date
DE69713185D1 DE69713185D1 (de) 2002-07-18
DE69713185T2 true DE69713185T2 (de) 2002-11-28

Family

ID=12779339

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69713185T Expired - Lifetime DE69713185T2 (de) 1996-03-05 1997-03-03 Zusammensetzung zum Mikroätzen von Kupfer und Kupferlegierungen

Country Status (6)

Country Link
US (1) US5885476A (de)
EP (1) EP0794269B1 (de)
JP (1) JP3458036B2 (de)
KR (1) KR100470812B1 (de)
DE (1) DE69713185T2 (de)
TW (1) TW419532B (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6046110A (en) * 1995-06-08 2000-04-04 Kabushiki Kaisha Toshiba Copper-based metal polishing solution and method for manufacturing a semiconductor device
JPH1126919A (ja) * 1997-06-30 1999-01-29 Fuji Photo Film Co Ltd プリント配線板
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US6331490B1 (en) * 1998-03-13 2001-12-18 Semitool, Inc. Process for etching thin-film layers of a workpiece used to form microelectric circuits or components
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
DE19850530A1 (de) * 1998-11-03 2000-05-25 Eilenburger Elektrolyse & Umwelttechnik Gmbh Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen
US6627553B1 (en) * 1998-11-27 2003-09-30 Showa Denko K.K. Composition for removing side wall and method of removing side wall
US6830627B1 (en) * 1999-03-23 2004-12-14 International Business Machines Corporation Copper cleaning compositions, processes and products derived therefrom
US6147002A (en) * 1999-05-26 2000-11-14 Ashland Inc. Process for removing contaminant from a surface and composition useful therefor
JP2001181868A (ja) * 1999-12-20 2001-07-03 Asahi Denka Kogyo Kk 銅及び銅合金用のマイクロエッチング剤
JP2001181867A (ja) * 1999-12-20 2001-07-03 Asahi Denka Kogyo Kk マイクロエッチング剤
US6627546B2 (en) * 2001-06-29 2003-09-30 Ashland Inc. Process for removing contaminant from a surface and composition useful therefor
US6746547B2 (en) 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper
KR20030080546A (ko) * 2002-04-09 2003-10-17 삼성전기주식회사 다층 인쇄회로기판의 제조방법
KR100853216B1 (ko) * 2002-06-25 2008-08-20 삼성전자주식회사 배선용 식각액, 이를 이용한 배선의 제조 방법, 그 배선을포함하는 박막 트랜지스터 어레이 기판 및 그의 제조 방법
DE10326767B4 (de) 2003-06-13 2006-02-02 Atotech Deutschland Gmbh Verfahren zur Regenerierung von eisenhaltigen Ätzlösungen zur Verwendung beim Ätzen oder Beizen von Kupfer oder Kupferlegierungen sowie eine Vorrichtung zur Durchführung desselben
US7232478B2 (en) 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
US20050067378A1 (en) * 2003-09-30 2005-03-31 Harry Fuerhaupter Method for micro-roughening treatment of copper and mixed-metal circuitry
US9763336B2 (en) 2010-07-06 2017-09-12 Atotech Deutschland Gmbh Methods of treating metal surfaces and devices formed thereby
JP5946827B2 (ja) 2010-07-06 2016-07-06 イーサイオニック コーポレーション プリント配線板を製造する方法
JP5576525B1 (ja) * 2013-03-29 2014-08-20 メルテックス株式会社 銅エッチング液
CN110809805B (zh) * 2017-07-10 2021-10-26 株式会社协成 使用铜银合金的导电性部件、触头引脚以及装置
CN110158071B (zh) * 2019-06-26 2021-11-23 匡云叶 一种铜用表面处理液及表面处理方法
WO2020261995A1 (ja) * 2019-06-28 2020-12-30 株式会社Adeka 組成物及びエッチング方法
KR102258703B1 (ko) * 2020-09-07 2021-06-01 주식회사 근우 전기 전도율 향상을 위한 표면구조를 가지는 버스바 제조방법
KR102258702B1 (ko) * 2020-09-07 2021-06-01 주식회사 근우 전기 전도율 향상을 위한 표면 구조를 가지는 버스바
KR102332286B1 (ko) * 2021-05-17 2021-12-01 주식회사 근우 발열성이 개선된 동 버스바의 제조방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3520746A (en) * 1965-12-21 1970-07-14 Printing Dev Inc Metal etch compositions
US3736197A (en) * 1972-03-29 1973-05-29 Mona Industries Inc Powderless etching bath compositions and additives
JPS5926958B2 (ja) * 1974-07-03 1984-07-02 （有） 大野技術研究所 霧滴の帯電装置
JPS5222192A (en) * 1975-08-13 1977-02-19 Mitsubishi Gas Chem Co Inc Chemical polishing liquid
US4383857A (en) * 1980-05-28 1983-05-17 The United States Of America As Represented By The United States Department Of Energy Attack polish for nickel-base alloys and stainless steels
JPS6379983A (ja) * 1986-09-24 1988-04-09 Sumitomo Special Metals Co Ltd 鉄系金属の化学溶解処理液
GB8829253D0 (en) * 1988-12-15 1989-01-25 Imasa Ltd Method of removing deposits of tin lead or tin/lead alloys from copper substrates and compositions for use therein
JPH04173987A (ja) * 1990-11-02 1992-06-22 Kawasaki Steel Corp 銅接合体用エッチング液
DE4118764A1 (de) * 1991-06-07 1992-12-10 Chema Technologien Gmbh Verfahren zum aetzen von kupfer
JP2781954B2 (ja) * 1994-03-04 1998-07-30 メック株式会社 銅および銅合金の表面処理剤

Also Published As

Publication number Publication date
US5885476A (en) 1999-03-23
EP0794269A1 (de) 1997-09-10
KR970065773A (ko) 1997-10-13
JP3458036B2 (ja) 2003-10-20
EP0794269B1 (de) 2002-06-12
DE69713185D1 (de) 2002-07-18
TW419532B (en) 2001-01-21
JPH09241870A (ja) 1997-09-16
KR100470812B1 (ko) 2005-04-28

Similar Documents

Publication Publication Date Title
DE69713185D1 (de) Zusammensetzung zum Mikroätzen von Kupfer und Kupferlegierungen
DE69612336T2 (de) Verfahren zum Mikroätzen von Kupfer und Kupferlegierungen
DE69700266D1 (de) Oberflächenbehandlungsmittel für Kupfer und Kupferlegierungen
DE742842T1 (de) Gasbehandlung von metallschmelze
DE69404384T2 (de) Mittel zur Oberflächenbehandlung von Kupfer und Kupferlegierungen
DE69516741T2 (de) Verfahren zum Mikroätzen von Kupfer- oder Kupferlegierungsoberflächen
NO20003096D0 (no) Sammensetninger og fremgangsmÕter for behandling av ADD
DE69423660D1 (de) Zusammensetzung und Verfahren zur Oberflächenbehandlung von Kupfer und Kupferlegierungen
HK1024820A1 (en) Driver circuit and method of operating the same
IL127748A0 (en) Electronic coupon and methods for creation and use of same
DE69522993T2 (de) Flussmittel und Verfahren zum Weichlöten
DE69738736D1 (de) Diffusionsschweissen von metallen
DE69731700D1 (de) Arithmetischer Schaltkreis und arithmetisches Verfahren
DE50015794D1 (de) En gewinnung von kupfer and anderen metallen
DE69704540D1 (de) Bandförmige Befestigungsvorrichtung und Verfahren zum Befestigen von gelöteten Drahten
DE69716290D1 (de) Schaltung und verfahren zum betreiben von lampen
DE59608963D1 (de) Verfahren und schaltungsanordnung zum betreiben von kaltkathoden-entladungslampen
DE69403036D1 (de) Verfahren zum Verbinden von Graphit und Metall
DE69701490T2 (de) Verfahren und Ofen zum Hartlöten von Aluminiumwerkstücken
DE69939734D1 (de) Von geschmolzenen metallen
DE69702347D1 (de) Verfahren zur reduktion und zum schmelzen von metall
DE19982268D2 (de) Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen
DE69715804T2 (de) Zusammensetzung zum Mikroätzen von Kupfer und Kupferlegierungen
DE69815968D1 (de) Verfahren zum Löten von Aluminium-Werkstücken und Ofen dafür
DE69513545T2 (de) Verfahren und Schaltungsanordnung zur Verringerung transienter Ströme

Legal Events

Date Code Title Description
8364 No opposition during term of opposition