TW345591B - Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof - Google Patents

Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof

Info

Publication number
TW345591B
TW345591B TW084104531A TW84104531A TW345591B TW 345591 B TW345591 B TW 345591B TW 084104531 A TW084104531 A TW 084104531A TW 84104531 A TW84104531 A TW 84104531A TW 345591 B TW345591 B TW 345591B
Authority
TW
Taiwan
Prior art keywords
epoxy
epoxy resin
resin
composition
printed circuit
Prior art date
Application number
TW084104531A
Other languages
English (en)
Inventor
Akio Sekimoto
Tatuichi Yamada
Original Assignee
Taiyo Ink Seisaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Seisaku Kk filed Critical Taiyo Ink Seisaku Kk
Application granted granted Critical
Publication of TW345591B publication Critical patent/TW345591B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L17/00—Compositions of reclaimed rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
TW084104531A 1994-05-13 1995-05-06 Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof TW345591B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12332494A JP3290295B2 (ja) 1994-05-13 1994-05-13 硬化性樹脂組成物並びに該組成物を用いた多層プリント配線板及びその製造方法

Publications (1)

Publication Number Publication Date
TW345591B true TW345591B (en) 1998-11-21

Family

ID=14857745

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084104531A TW345591B (en) 1994-05-13 1995-05-06 Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof

Country Status (3)

Country Link
US (2) US6586526B1 (zh)
JP (1) JP3290295B2 (zh)
TW (1) TW345591B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7847393B2 (en) 1998-12-16 2010-12-07 Ibiden Co., Ltd. Conductive connecting pins for a package substrate

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JP2000294922A (ja) * 1999-04-01 2000-10-20 Victor Co Of Japan Ltd 多層プリント配線板用の絶縁樹脂組成物
JP4783984B2 (ja) * 2001-02-15 2011-09-28 日立化成工業株式会社 樹脂組成物およびその用途ならびにそれらの製造方法
JP4951816B2 (ja) * 2001-03-30 2012-06-13 日立化成工業株式会社 プリント配線板用絶縁樹脂組成物及びその用途
KR100495208B1 (ko) * 2002-07-29 2005-06-14 삼성전기주식회사 절연수지 조성물 및 그 조성물을 이용한다층인쇄회로기판제조방법
JP3822549B2 (ja) * 2002-09-26 2006-09-20 富士通株式会社 配線基板
JP4576794B2 (ja) * 2003-02-18 2010-11-10 日立化成工業株式会社 絶縁樹脂組成物及びその使用
TW200602427A (en) 2004-03-30 2006-01-16 Taiyo Ink Mfg Co Ltd Thermosetting resin composition and multilayered printed wiring board comprising the same
JP5019098B2 (ja) * 2006-08-03 2012-09-05 Ｄｉｃ株式会社 多層プリント配線板用硬化性樹脂組成物、熱硬化性接着フィルム及び多層プリント基板
JP2010514886A (ja) * 2006-12-27 2010-05-06 ポスコ 優れた放熱黒色樹脂組成物、これを利用した亜鉛めっき鋼板処理方法、及びこれにより処理されためっき鋼板
KR100804934B1 (ko) * 2006-12-27 2008-02-20 주식회사 포스코 방열특성이 우수한 방열수지 조성물, 이를 이용한 강판처리방법 및 이에 따라 처리된 강판
JP5150381B2 (ja) 2008-06-20 2013-02-20 太陽ホールディングス株式会社 熱硬化性樹脂組成物
JP2010034197A (ja) * 2008-07-28 2010-02-12 Fujitsu Ltd ビルドアップ基板
TWI494364B (zh) * 2009-01-30 2015-08-01 Ajinomoto Kk Resin composition
DE102009012195A1 (de) * 2009-03-06 2010-09-09 Siemens Aktiengesellschaft Gießharzsystem für Isolatoren mit erhöhter Wärmeformbeständigkeit
KR101114318B1 (ko) * 2009-04-16 2012-03-14 삼성전기주식회사 박리 강도가 강화된 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조 방법
US8173745B2 (en) 2009-12-16 2012-05-08 Momentive Specialty Chemicals Inc. Compositions useful for preparing composites and composites produced therewith
JP2011017026A (ja) * 2010-10-15 2011-01-27 Hitachi Chem Co Ltd 樹脂組成物およびその用途ならびにそれらの製造方法
JP2011021205A (ja) * 2010-10-22 2011-02-03 Hitachi Chem Co Ltd プリント配線板用絶縁樹脂組成物及びその用途
US9288909B2 (en) * 2012-02-01 2016-03-15 Marvell World Trade Ltd. Ball grid array package substrate with through holes and method of forming same
JP5624184B1 (ja) 2013-06-28 2014-11-12 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
KR20150025245A (ko) * 2013-08-28 2015-03-10 삼성전기주식회사 인쇄회로기판용 동박 적층판 및 그의 제조방법
WO2015080241A1 (ja) 2013-11-29 2015-06-04 四国化成工業株式会社 メルカプトアルキルグリコールウリル類とその利用
JP6538429B2 (ja) 2014-10-17 2019-07-03 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板
KR102415755B1 (ko) 2015-01-21 2022-07-04 다이요 잉키 세이조 가부시키가이샤 열경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
CN114126257B (zh) * 2020-08-27 2024-03-22 深南电路股份有限公司 一种电路板及其制造方法

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7847393B2 (en) 1998-12-16 2010-12-07 Ibiden Co., Ltd. Conductive connecting pins for a package substrate
US7902659B2 (en) 1998-12-16 2011-03-08 Ibiden Co., Ltd. Conductive connecting pin and package substrate
US8035214B1 (en) 1998-12-16 2011-10-11 Ibiden Co., Ltd. Conductive connecting pin for package substance
US8110917B2 (en) 1998-12-16 2012-02-07 Ibiden Co., Ltd. Package substrate with a conductive connecting pin
US8536696B2 (en) 1998-12-16 2013-09-17 Ibiden Co., Ltd. Conductive pin attached to package substrate

Also Published As

Publication number Publication date
US20010000518A1 (en) 2001-04-26
US6518331B2 (en) 2003-02-11
JP3290295B2 (ja) 2002-06-10
US6586526B1 (en) 2003-07-01
JPH07304933A (ja) 1995-11-21

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