KR850002552A - 프린트 배선판과 그 제조방법 및 이것에 사용하는 레지스트잉크 - Google Patents
프린트 배선판과 그 제조방법 및 이것에 사용하는 레지스트잉크 Download PDFInfo
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- KR850002552A KR850002552A KR1019840005977A KR840005977A KR850002552A KR 850002552 A KR850002552 A KR 850002552A KR 1019840005977 A KR1019840005977 A KR 1019840005977A KR 840005977 A KR840005977 A KR 840005977A KR 850002552 A KR850002552 A KR 850002552A
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- wiring board
- electroless plating
- printed wiring
- coupling agent
- forming portion
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- 238000004519 manufacturing process Methods 0.000 title claims 9
- 238000007772 electroless plating Methods 0.000 claims description 18
- 239000007822 coupling agent Substances 0.000 claims description 16
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 150000004645 aluminates Chemical class 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 6
- 239000003054 catalyst Substances 0.000 claims 6
- 230000008021 deposition Effects 0.000 claims 4
- 229920002050 silicone resin Polymers 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- XHWQYYPUYFYELO-UHFFFAOYSA-N ditridecyl phosphite Chemical compound CCCCCCCCCCCCCOP([O-])OCCCCCCCCCCCCC XHWQYYPUYFYELO-UHFFFAOYSA-N 0.000 claims 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 2
- 239000004411 aluminium Substances 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0713—Plating poison, e.g. for selective plating or for preventing plating on resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1407—Applying catalyst before applying plating resist
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Chemically Coating (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 풀애디티브(full additive)방식에 의한 양면관통공 프린트 배선판의 일레의 단면 개략도, 제2도는 커플링제로서 알루미킬레이트계, 티타네이트계 및 실리콘 변성에폭시수지와, 아민계 경화제와의 혼합물을 각기 무전해 도금용 레지스트 잉크에 첨가했을 경우에 있어서, 그 첨가량과 흡습(吸濕)후의 프린트 배선판의 절연저항의 관계를 나타낸 그래프.
Claims (15)
- 무전해도금의 석출에 대해 반응성을 갖는 촉매가 부여된 절연기재와, 그 회로형성부 이외에 설치된 무전해도금용 레지스트 및 무전해도금에 의해 형성된 회로로 이루어진 프리트배선판에 있어서, 이 무전해도금용 레지스트가 이 촉매성분의 이온화를 방지하는 기능을 갖는 커플링제를 함유하는 것을 특징으로 하는 프린트 배선판.
- 상기 커플링제가 알루미킬레이트계, 티타네이트계, 실리콘변성 에폭시수지와 아민계경화제와의 혼합물 및 아미노변성 실리콘수지로 이루어진 군에서 선택하 것임을 특징으로 하는 특허청구의 범위 1기재의 프린트 배선판.
- 알루미킬레이트계, 티타네이트계 및 실리콘변성 에폭시수지와 아민경화제와의 혼합물로 이루어진 군에서 선택된 상기 커플링제가 에폭시수지 100중량부에 대해 2.5~7중량부 함유된 것을 특징으로 하는 특허청구의 범위 1기재의 프린트 배선판.
- 상기 커플링제로서 아미미변성 실리콘수지가 에폭시수지 100중량부에 대해 5~35중량부 함유된 것을 특징으로 하는 특허청구의 범위 1기재의 프린트 배선판.
- 상기 커플링제가 알킬아세토아세테이트(디이소프로필레이트)알루비늄임을 특징으로 하는 특허청구의 범위 1기재의 프린트 배선판.
- 상기 커플링제가 테트라옥틸비스(디트리데실포스파이트)티타네이트임을 특징으로 하는 특허청구의 범위 1기재의 프린트 배선판.
- (a)절연기재의 최소한 회로형성부 표면을 무전해도금의 석출에 대해 반응성을 갖게하는 공정과, (b)회로형성부 이외를 무전해도금용 촉매성분의 이온화를 방지하는 기능을 갖는 커플링제를 함유하는 무전해 도금용 레지스트로 피복하는 공정 및 (c)회로형성부에 무전해도금에 의해 회로를 형성하는 공정의 각 공정을 포함하는 것을 특징으로 하는 프린트 배선판의 제조방법.
- (a)절연기재의 최소한 회로형성부 표면을 무전해도금의 석출에 대해 반응성을 갖게하는 공정과, (b)그 표면에, 상소와 온수에 의한 처리 또는 항온습도하의 처리를 하는 공정과, (c)회로형성부 이외를 무전해도금용 촉매성분의 이온화를 방지하는 기능을 갖는 커플링제를 함유하는 무전도해도금용 레지스트를 피복하는 공정 및 (d)회로형성부에 무전채도금에 의해 회로를 형성하는 공정의 각 공정을 포함하는 것을 특징으로 하는 프린트 배선판의 제조방법.
- (a)절연기재의 최소한 회로형성부 표면을 무전해도금의 석출에 대해 반응성을 갖게하는 공정과, (b)회로형성부 이외를 무전해도금용 촉매성분의 이온화를 방지하는 기능을 갖는 커플링제를 함유하는 무전해도금용 레지스트로 피복하는 공정과(c)회로형성부에 무전해도금에 의해 회로를 형성하는 공정 및 (d)산소와 온수에 의한 차이를 하는 공정의 각 공정을 포함하는 것을 특징으로 하는 프린트 배선판의 제조방법.
- 상기 커플링제가 알루미킬레이트계, 티타네이트계, 실리콘변성 에폭시수지와 아민계경화제와의 혼합물 및 아미노변성 실리콘수지로 이루어진 군에서 선택한 것임을 특징으로 하는 특허청구의 범위 7,8 또는 9기재의 프린트 배선판의 제조방법.
- 상기 알루미켈레이트계, 티터네이트계 및 실리콘변성 에폭시수지와 아민경화제와의 혼합물로 이루어진 군에서 선택된 이 커플링제 및 에폭시수지 100중량부에 대해 2.5~7중량부 포함되는 것을 특징으로 하는 특허청구의 범위 7,8 또는 9기재의 프린트 배선판의 제조방법.
- 상기 커플링제로서 아미노변성 실리콘수지가 에폭시수지 100중량부에 대해 5~35중량부 함유되는 것을 특징으로 하는 특허청구의 범위 7,8 또는 9기재의 프린트 배선판의 제조방법.
- 상기 커플링제가 알킬아세토아세테이트(디이소프로필레이트)알루미늄임을 특징으로 하는 특허청구의 범위 7,8 또는 9기재의 프린트 배선판의 제조방법.
- 상기 커플링제가 테트라옥틸비스(디트리데실포스파이트)티타네이트임을 특징으로 하는 특허청구의 범위 7,8 또는 9기재의 프린트 배선판의 제조방법.
- 에폭시수지를 주성분으로 하고, 그밖에 부가제 및 유기용제로 이루어진 무전해도금용 레지스트 잉크에 있어서, 상기 레지스트 앙크가 무전해도금용 촉매성분의 이온화를 방지하는 기능을 갖는 커플링제를 포함하는 것을 특징으로 하는 무전해도금용 레지스트 잉크.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP83-180648 | 1983-09-30 | ||
JP58180648A JPS6074599A (ja) | 1983-09-30 | 1983-09-30 | プリント配線板及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR850002552A true KR850002552A (ko) | 1985-05-13 |
Family
ID=16086863
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019840005977A KR850002552A (ko) | 1983-09-30 | 1984-09-28 | 프린트 배선판과 그 제조방법 및 이것에 사용하는 레지스트잉크 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4610910A (ko) |
JP (1) | JPS6074599A (ko) |
KR (1) | KR850002552A (ko) |
DE (1) | DE3436024A1 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4847114A (en) * | 1984-01-26 | 1989-07-11 | Learonal, Inc. | Preparation of printed circuit boards by selective metallization |
US4759952A (en) * | 1984-01-26 | 1988-07-26 | Learonal, Inc. | Process for printed circuit board manufacture |
JPS60217695A (ja) * | 1984-04-13 | 1985-10-31 | 株式会社日立製作所 | 無電解めつき前処理法及びプリント配線板の製造法 |
US4718972A (en) * | 1986-01-24 | 1988-01-12 | International Business Machines Corporation | Method of removing seed particles from circuit board substrate surface |
US4735820A (en) * | 1987-05-18 | 1988-04-05 | International Business Machines Corporation | Removal of residual catalyst from a dielectric substrate |
US5053280A (en) * | 1988-09-20 | 1991-10-01 | Hitachi-Chemical Co., Ltd. | Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent |
US4952420A (en) * | 1988-10-12 | 1990-08-28 | Advanced Dielectric Technologies, Inc. | Vapor deposition patterning method |
EP0467199A3 (en) * | 1990-07-19 | 1992-11-25 | Learonal, Inc. | Preparation of printed circuit boards by metallization |
JPH1032221A (ja) * | 1996-07-12 | 1998-02-03 | Nec Corp | プリント配線基板 |
US20060033793A1 (en) * | 2004-08-10 | 2006-02-16 | Webster Grant A | Coupling agent patterning |
US7700926B2 (en) * | 2006-01-12 | 2010-04-20 | Draximage General Partnership | Systems and methods for radioisotope generation |
US20150181724A1 (en) * | 2013-12-17 | 2015-06-25 | Sanmina Corporation | Methods of forming segmented vias for printed circuit boards |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3443988A (en) * | 1965-05-06 | 1969-05-13 | Photocircuits Corp | Printed circuits,work holders and method of preventing electroless metal deposition |
DE1924864A1 (de) * | 1969-05-16 | 1970-11-19 | Licentia Gmbh | Verfahren zur Herstellung von metallischen Leiterbildern auf einer Katalysatoren zur stromlosen Metallabscheidung enthaltenden Isolierstoffplatte |
US3799816A (en) * | 1972-01-11 | 1974-03-26 | Photocircuits Corp | Metallizing insulating bases |
US3865623A (en) * | 1973-02-02 | 1975-02-11 | Litton Systems Inc | Fully additive process for manufacturing printed circuit boards |
JPS50112231A (ko) * | 1974-02-15 | 1975-09-03 | ||
JPS5113266A (en) * | 1974-07-16 | 1976-02-02 | Furukawa Electric Co Ltd | Idotaino jikoichikenshutsuhoshiki |
JPS5134998A (ja) * | 1974-09-19 | 1976-03-25 | Canon Kk | Setsuchakuseisoseibutsu |
US3982045A (en) * | 1974-10-11 | 1976-09-21 | Macdermid Incorporated | Method of manufacture of additive printed circuitboards using permanent resist mask |
US4100037A (en) * | 1976-03-08 | 1978-07-11 | Western Electric Company, Inc. | Method of depositing a metal on a surface |
DE2628350C3 (de) * | 1976-06-24 | 1978-12-07 | Felten & Guilleaume Carlswerk Ag, 5000 Koeln | Verfahren zur Herstellung von nichtmetallisierbaren Oberflächen auf Schichtstoffen unter Verwendung eines gelösten Antimonkomplexes und Anwendung des Verfahrens |
JPS5391381A (en) * | 1977-01-22 | 1978-08-11 | Hitachi Ltd | Method of producing printed circuit board |
US4151313A (en) * | 1977-03-11 | 1979-04-24 | Hitachi, Ltd. | Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material |
US4486466A (en) * | 1979-01-12 | 1984-12-04 | Kollmorgen Technologies Corporation | High resolution screen printable resists |
JPS55135155A (en) * | 1979-04-07 | 1980-10-21 | Toshiba Chem Corp | Epoxy resin composition |
JPS56147843A (en) * | 1980-04-16 | 1981-11-17 | Matsushita Electric Ind Co Ltd | Resin composition |
JPS5771198A (en) * | 1980-10-22 | 1982-05-01 | Hitachi Ltd | Method of fabricating circuit board |
DE3110415C2 (de) * | 1981-03-18 | 1983-08-18 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Verfahren zum Herstellen von Leiterplatten |
US4537799A (en) * | 1984-04-16 | 1985-08-27 | At&T Technologies, Inc. | Selective metallization process |
-
1983
- 1983-09-30 JP JP58180648A patent/JPS6074599A/ja active Pending
-
1984
- 1984-09-28 US US06/655,426 patent/US4610910A/en not_active Expired - Fee Related
- 1984-09-28 KR KR1019840005977A patent/KR850002552A/ko not_active IP Right Cessation
- 1984-10-01 DE DE19843436024 patent/DE3436024A1/de active Granted
Also Published As
Publication number | Publication date |
---|---|
DE3436024A1 (de) | 1985-04-18 |
JPS6074599A (ja) | 1985-04-26 |
DE3436024C2 (ko) | 1987-06-11 |
US4610910A (en) | 1986-09-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
SUBM | Surrender of laid-open application requested |