JPS648698A - Manufacture of circuit board - Google Patents

Manufacture of circuit board

Info

Publication number
JPS648698A
JPS648698A JP16371787A JP16371787A JPS648698A JP S648698 A JPS648698 A JP S648698A JP 16371787 A JP16371787 A JP 16371787A JP 16371787 A JP16371787 A JP 16371787A JP S648698 A JPS648698 A JP S648698A
Authority
JP
Japan
Prior art keywords
epoxy resin
molecular weight
parts
coating film
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16371787A
Other languages
Japanese (ja)
Inventor
Shigeharu Ariga
Naoki Fukutomi
Hiroshi Takahashi
Yorio Iwasaki
Fujio Kojima
Hidehiro Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP16371787A priority Critical patent/JPS648698A/en
Publication of JPS648698A publication Critical patent/JPS648698A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To wire in high density and to obtain a multiwiring substrate having excellent insulation at high temperatures by using a composition containing epoxy resin having specific ratio of epoxy resin including 5000 or more of molecular weight and epoxy resin including 5000 or less of molecular weight as an adhesive coating film for bonding insulated wire to an insulating substrate, alkylation melamine resin, saturated polyester resin, and crosslinking agent. CONSTITUTION:In a manufacture of a circuit board for forming a desired wiring pattern by forming an adhesive coating film on an insulating substrate, laying insulated wire on the film and simultaneously bonding it, a composition containing (a) epoxy resin having 5000 or more of molecular weight, (b) 100 parts of epoxy resin having 10:90-90:10 of epoxy resin having 5000 or less of molecular weight as the adhesive coating film, (c) 2-80 parts of alkylation melamine resin, (d) 5-50 parts of saturated polyester resin, and (e) 0.1-50 parts of crosslinking catalyst. When this adhesive is used, wiring property is improved as compared with a conventional rubber adhesive, and its heat resistance and electrical characteristics are largely improved.
JP16371787A 1987-06-30 1987-06-30 Manufacture of circuit board Pending JPS648698A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16371787A JPS648698A (en) 1987-06-30 1987-06-30 Manufacture of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16371787A JPS648698A (en) 1987-06-30 1987-06-30 Manufacture of circuit board

Publications (1)

Publication Number Publication Date
JPS648698A true JPS648698A (en) 1989-01-12

Family

ID=15779307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16371787A Pending JPS648698A (en) 1987-06-30 1987-06-30 Manufacture of circuit board

Country Status (1)

Country Link
JP (1) JPS648698A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6436554B2 (en) 1996-03-07 2002-08-20 Mitsubishi Denki Kabushiki Kaisha Method for producing Nb-Sn compound superconducting wire precursor and wire
JP2018530661A (en) * 2015-09-15 2018-10-18 スリーエム イノベイティブ プロパティズ カンパニー Adhesive composition and articles made from the adhesive

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6436554B2 (en) 1996-03-07 2002-08-20 Mitsubishi Denki Kabushiki Kaisha Method for producing Nb-Sn compound superconducting wire precursor and wire
JP2018530661A (en) * 2015-09-15 2018-10-18 スリーエム イノベイティブ プロパティズ カンパニー Adhesive composition and articles made from the adhesive
US10392540B2 (en) 2015-09-15 2019-08-27 3M Innovative Properties Company Adhesive composition and an article manufactured therefrom

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