JPS648699A - Manufacture of circuit board - Google Patents

Manufacture of circuit board

Info

Publication number
JPS648699A
JPS648699A JP16371887A JP16371887A JPS648699A JP S648699 A JPS648699 A JP S648699A JP 16371887 A JP16371887 A JP 16371887A JP 16371887 A JP16371887 A JP 16371887A JP S648699 A JPS648699 A JP S648699A
Authority
JP
Japan
Prior art keywords
wire
adhesive
epoxy resin
coating film
melamine resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16371887A
Other languages
Japanese (ja)
Inventor
Shigeharu Ariga
Naoki Fukutomi
Hiroshi Takahashi
Yorio Iwasaki
Fujio Kojima
Hidehiro Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP16371887A priority Critical patent/JPS648699A/en
Publication of JPS648699A publication Critical patent/JPS648699A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To wire in high density and to obtain a multiwiring board having excellent insulation at high temperatures by using a composition containing epoxy resin and alkylation melamine resin as an adhesive coating film for bonding insulated wire to an insulating substrate, and the insulating film of insulated wire. CONSTITUTION:An adhesive coating film made of epoxy resin having 5000 or more of molecular weight and alkylation melamine resin is formed on a substrate for a multiwiring board. An insulated wire formed by coating a wire core or through an insulator coating layer the wire core with resin containing the epoxy resin containing 5000 or more of molecular weight and the alkylation melamine resin, and thermally curing it is laid on the adhesive coating film by a numerical control wiring machine, and simultaneously thermally melted by an ultrasonic vibration to be continuously bonded. Then, the wire is pressed by a press or the like to be tightly secured. When this adhesive is used, wiring property is improved as compared with a conventional rubber adhesive, and its heat resistance and electrical characteristics are largely improved.
JP16371887A 1987-06-30 1987-06-30 Manufacture of circuit board Pending JPS648699A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16371887A JPS648699A (en) 1987-06-30 1987-06-30 Manufacture of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16371887A JPS648699A (en) 1987-06-30 1987-06-30 Manufacture of circuit board

Publications (1)

Publication Number Publication Date
JPS648699A true JPS648699A (en) 1989-01-12

Family

ID=15779329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16371887A Pending JPS648699A (en) 1987-06-30 1987-06-30 Manufacture of circuit board

Country Status (1)

Country Link
JP (1) JPS648699A (en)

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