JPS5662327A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5662327A
JPS5662327A JP13762179A JP13762179A JPS5662327A JP S5662327 A JPS5662327 A JP S5662327A JP 13762179 A JP13762179 A JP 13762179A JP 13762179 A JP13762179 A JP 13762179A JP S5662327 A JPS5662327 A JP S5662327A
Authority
JP
Japan
Prior art keywords
insulation
insulation membrane
membrane
semiconductor device
side surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13762179A
Other languages
Japanese (ja)
Inventor
Nobukatsu Tanaka
Yoshimi Hagiwara
Kenji Akeyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13762179A priority Critical patent/JPS5662327A/en
Publication of JPS5662327A publication Critical patent/JPS5662327A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE:To obtain a semiconductor device having a high breakdown-resisting voltage at a high temperature, by applying an insulation membrane of a high insulation breakage strength on top and side surfaces of a semiconductor element and providing thus finished surfaces with No.2 insulation membrane which is to become rubber state at the normal temperature. CONSTITUTION:Varnish of a high insulation breakage resisting strength or a polyimide resin material is used as No.1 insulation membrane 3 to be formed on top and side surfaces of a semiconductor element 2, and rubber-state resin is used as No.2 insulation membrane 4 for covering surface of the No.1 insulation membrane so as to supplement the electric field resistance.
JP13762179A 1979-10-26 1979-10-26 Semiconductor device Pending JPS5662327A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13762179A JPS5662327A (en) 1979-10-26 1979-10-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13762179A JPS5662327A (en) 1979-10-26 1979-10-26 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5662327A true JPS5662327A (en) 1981-05-28

Family

ID=15202946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13762179A Pending JPS5662327A (en) 1979-10-26 1979-10-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5662327A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62112153U (en) * 1985-12-30 1987-07-17
JPH0254231U (en) * 1988-10-13 1990-04-19
JPH0727480U (en) * 1993-05-26 1995-05-23 庸平 皐月 Fabric temporary stop

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62112153U (en) * 1985-12-30 1987-07-17
JPH046210Y2 (en) * 1985-12-30 1992-02-20
JPH0254231U (en) * 1988-10-13 1990-04-19
JPH0727480U (en) * 1993-05-26 1995-05-23 庸平 皐月 Fabric temporary stop

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