JPH0254231U - - Google Patents
Info
- Publication number
- JPH0254231U JPH0254231U JP13397888U JP13397888U JPH0254231U JP H0254231 U JPH0254231 U JP H0254231U JP 13397888 U JP13397888 U JP 13397888U JP 13397888 U JP13397888 U JP 13397888U JP H0254231 U JPH0254231 U JP H0254231U
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- semiconductor device
- substrate
- wiring pattern
- elastic layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Landscapes
- Formation Of Insulating Films (AREA)
Description
第１図〜第３図はこの考案の構成を示す図、第
４図Ａ，Ｂはこの考案の実施例である半導体装置
の構成を表す図である。また、第５図は従来の半
導体装置の構成を示す図である。
１……基板、２……配線パターン、３……保護
膜、４，５……シリコーンゴム層（弾性体層）。
1 to 3 are diagrams showing the structure of this invention, and FIGS. 4A and 4B are diagrams showing the structure of a semiconductor device which is an embodiment of this invention. Further, FIG. 5 is a diagram showing the configuration of a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Wiring pattern, 3...Protective film, 4, 5...Silicone rubber layer (elastic layer).
Claims (1)
体装置において、 保護膜の上部もしくは下部の何れか一方または
両方に弾性体層を形成したことを特徴とする半導
体装置。[Scope of Claim for Utility Model Registration] A semiconductor device comprising a wiring pattern and a protective film formed on a substrate, characterized in that an elastic layer is formed on either or both of the upper and lower parts of the protective film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988133978U JPH0648836Y2 (en) | 1988-10-13 | 1988-10-13 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988133978U JPH0648836Y2 (en) | 1988-10-13 | 1988-10-13 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0254231U true JPH0254231U (en) | 1990-04-19 |
| JPH0648836Y2 JPH0648836Y2 (en) | 1994-12-12 |
Family
ID=31392339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988133978U Expired - Lifetime JPH0648836Y2 (en) | 1988-10-13 | 1988-10-13 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648836Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5662327A (en) * | 1979-10-26 | 1981-05-28 | Hitachi Ltd | Semiconductor device |
| JPS5740935A (en) * | 1980-08-25 | 1982-03-06 | Fujitsu Ltd | Semiconductor device |
| JPS58206144A (en) * | 1982-05-26 | 1983-12-01 | Hitachi Ltd | Manufacture of semiconductor device |
-
1988
- 1988-10-13 JP JP1988133978U patent/JPH0648836Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5662327A (en) * | 1979-10-26 | 1981-05-28 | Hitachi Ltd | Semiconductor device |
| JPS5740935A (en) * | 1980-08-25 | 1982-03-06 | Fujitsu Ltd | Semiconductor device |
| JPS58206144A (en) * | 1982-05-26 | 1983-12-01 | Hitachi Ltd | Manufacture of semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648836Y2 (en) | 1994-12-12 |
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