JPH03120035U - - Google Patents
Info
- Publication number
- JPH03120035U JPH03120035U JP2831890U JP2831890U JPH03120035U JP H03120035 U JPH03120035 U JP H03120035U JP 2831890 U JP2831890 U JP 2831890U JP 2831890 U JP2831890 U JP 2831890U JP H03120035 U JPH03120035 U JP H03120035U
- Authority
- JP
- Japan
- Prior art keywords
- film wiring
- semiconductor substrate
- metal film
- semiconductor
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 2
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第１図ａは本考案の一実施例の部分平面図、同
図ｂは同図ａのＡ−Ａ断面図、第２図は考案の第
２実施例の部分平面図、第３図ａは従来例の部分
平面図、同図ｂは同図ａのＡ−Ａ断面図である。
１……半導体基板、２……絶縁層、３，４……
金属膜配線、３ａ……膜の穴、４ａ……膜のスリ
ツト、５……コンタクト部、６……表面保護膜。
Figure 1a is a partial plan view of an embodiment of the invention, Figure b is a sectional view taken along line A-A in Figure a, Figure 2 is a partial plan view of a second embodiment of the invention, and Figure 3a is a partial plan view of the second embodiment of the invention. A partial plan view of the conventional example, FIG. 1... Semiconductor substrate, 2... Insulating layer, 3, 4...
Metal film wiring, 3a...hole in the film, 4a...slit in the film, 5...contact portion, 6...surface protective film.
Claims (1)
膜配線を被う表面保護膜を有する半導体素子にお
いて、該金属膜配線には表面から半導体基板に達
する多数の穴またはスリツトがあけられているこ
とを特徴とする半導体素子。 In a semiconductor element having a metal film wiring on a semiconductor substrate and a surface protective film covering the film wiring, the metal film wiring has a large number of holes or slits extending from the surface to the semiconductor substrate. A semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2831890U JPH03120035U (en) | 1990-03-19 | 1990-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2831890U JPH03120035U (en) | 1990-03-19 | 1990-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03120035U true JPH03120035U (en) | 1991-12-10 |
Family
ID=31531126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2831890U Pending JPH03120035U (en) | 1990-03-19 | 1990-03-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120035U (en) |
-
1990
- 1990-03-19 JP JP2831890U patent/JPH03120035U/ja active Pending