JPS62112153U - - Google Patents

Info

Publication number
JPS62112153U
JPS62112153U JP20395285U JP20395285U JPS62112153U JP S62112153 U JPS62112153 U JP S62112153U JP 20395285 U JP20395285 U JP 20395285U JP 20395285 U JP20395285 U JP 20395285U JP S62112153 U JPS62112153 U JP S62112153U
Authority
JP
Japan
Prior art keywords
chip
utility
sides
scope
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20395285U
Other languages
Japanese (ja)
Other versions
JPH046210Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985203952U priority Critical patent/JPH046210Y2/ja
Publication of JPS62112153U publication Critical patent/JPS62112153U/ja
Application granted granted Critical
Publication of JPH046210Y2 publication Critical patent/JPH046210Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例ICチツプの側面図
、第2図は他の実施例のICチツプの側面図、第
3図は本考案に係るICチツプを異方導電性接着
剤を用いてプリント回路基板に取付けた状態の断
面図、第4図は異方導電性接着剤層の断面図、第
5図は従来のICチツプの側面図である。
Fig. 1 is a side view of an IC chip according to one embodiment of the present invention, Fig. 2 is a side view of an IC chip of another embodiment, and Fig. 3 is a side view of an IC chip according to the present invention using an anisotropic conductive adhesive. 4 is a sectional view of the anisotropically conductive adhesive layer, and FIG. 5 is a side view of the conventional IC chip.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面と共に側面にも絶縁層を形成したICチツ
プ。
An IC chip with an insulating layer formed on both the surface and the sides.
JP1985203952U 1985-12-30 1985-12-30 Expired JPH046210Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985203952U JPH046210Y2 (en) 1985-12-30 1985-12-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985203952U JPH046210Y2 (en) 1985-12-30 1985-12-30

Publications (2)

Publication Number Publication Date
JPS62112153U true JPS62112153U (en) 1987-07-17
JPH046210Y2 JPH046210Y2 (en) 1992-02-20

Family

ID=31169764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985203952U Expired JPH046210Y2 (en) 1985-12-30 1985-12-30

Country Status (1)

Country Link
JP (1) JPH046210Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5662327A (en) * 1979-10-26 1981-05-28 Hitachi Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5662327A (en) * 1979-10-26 1981-05-28 Hitachi Ltd Semiconductor device

Also Published As

Publication number Publication date
JPH046210Y2 (en) 1992-02-20

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