JPS6455235A - Laminate - Google Patents

Laminate

Info

Publication number
JPS6455235A
JPS6455235A JP21155787A JP21155787A JPS6455235A JP S6455235 A JPS6455235 A JP S6455235A JP 21155787 A JP21155787 A JP 21155787A JP 21155787 A JP21155787 A JP 21155787A JP S6455235 A JPS6455235 A JP S6455235A
Authority
JP
Japan
Prior art keywords
laminate
laminated
wiring board
glass cloth
chemical plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21155787A
Other languages
Japanese (ja)
Inventor
Saburo Amano
Hideo Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP21155787A priority Critical patent/JPS6455235A/en
Publication of JPS6455235A publication Critical patent/JPS6455235A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Abstract

PURPOSE:To obtain the printed wiring board having no deterioration of insulation and high reliability by a method in which the glass cloth to whose surface cationic silane is stuck, is impregnated with epoxy resin, and the desired number of dried prepregs are laminated, and then said laminate is heated and pressurized. CONSTITUTION:A surface-treated glass cloth is impregnated with epoxy resin, and desired number of dried prepregs are laminated. A laminate by additive method made integrally by heating and pressurizing is obtained. Then as a surface treating agent, the cationic silane of 0.1g/m<2> or more is stuck onto the surface of the glass cloth. To obtain a printed wiring board by additive method, the entire surface of the laminate is coated with the catalyst-containing adhesive, and after it has been coated with a plating resist, a circuit is formed by chemical plating and then simultaneously chemical plating is applied to the wall with bored holes. Then, in the chemical plating, said laminated is dipped in liquid at 40 deg.C-80 deg.C for long time, but when this laminate is used, since is has excellent moisture resistance, the print wiring board without the deterioration of insulation can be produced.
JP21155787A 1987-08-26 1987-08-26 Laminate Pending JPS6455235A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21155787A JPS6455235A (en) 1987-08-26 1987-08-26 Laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21155787A JPS6455235A (en) 1987-08-26 1987-08-26 Laminate

Publications (1)

Publication Number Publication Date
JPS6455235A true JPS6455235A (en) 1989-03-02

Family

ID=16607776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21155787A Pending JPS6455235A (en) 1987-08-26 1987-08-26 Laminate

Country Status (1)

Country Link
JP (1) JPS6455235A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0421418A2 (en) * 1989-10-05 1991-04-10 Hercules Incorporated Method for preparing a ceramic-forming prepreg tape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0421418A2 (en) * 1989-10-05 1991-04-10 Hercules Incorporated Method for preparing a ceramic-forming prepreg tape
US5714025A (en) * 1989-10-05 1998-02-03 Lanxide Technology Company, Lp Process for forming a ceramic body

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