JPH04163005A - Base material for prepreg - Google Patents
Base material for prepregInfo
- Publication number
- JPH04163005A JPH04163005A JP28657090A JP28657090A JPH04163005A JP H04163005 A JPH04163005 A JP H04163005A JP 28657090 A JP28657090 A JP 28657090A JP 28657090 A JP28657090 A JP 28657090A JP H04163005 A JPH04163005 A JP H04163005A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- treating agent
- prepreg
- surface treating
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 31
- 239000011521 glass Substances 0.000 claims abstract description 15
- 239000004744 fabric Substances 0.000 claims abstract description 14
- 239000012756 surface treatment agent Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 abstract description 25
- 239000011347 resin Substances 0.000 abstract description 25
- 238000000034 method Methods 0.000 abstract description 10
- 239000003795 chemical substances by application Substances 0.000 abstract description 7
- GDFUXPFQUMDNJA-UHFFFAOYSA-N [SiH4].C=CC1=CC=CC=C1 Chemical compound [SiH4].C=CC1=CC=CC=C1 GDFUXPFQUMDNJA-UHFFFAOYSA-N 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 3
- -1 epoxysilane Chemical compound 0.000 abstract description 3
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 abstract description 3
- 239000006087 Silane Coupling Agent Substances 0.000 abstract description 2
- 229910021536 Zeolite Inorganic materials 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 abstract description 2
- 239000012528 membrane Substances 0.000 abstract description 2
- 238000001223 reverse osmosis Methods 0.000 abstract description 2
- 238000000926 separation method Methods 0.000 abstract description 2
- 239000010457 zeolite Substances 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000008595 infiltration Effects 0.000 abstract 1
- 238000001764 infiltration Methods 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 108700042658 GAP-43 Proteins 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野〕
本発明は、プリント配線板などに供される積層板用のプ
リプレグの基材に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a prepreg base material for a laminate used in printed wiring boards and the like.
[従来の技術〕
従来より銅張積層板はプリント配線板として多用されて
いる。この積層板は、所要枚数のプリプレグと銅箔を重
合わせ、加熱加圧成形することによって得ることができ
る。このとき、用いるプリプレグは、基材に含浸された
樹脂が基材中で半硬化したものである。[Prior Art] Copper-clad laminates have been widely used as printed wiring boards. This laminate can be obtained by superimposing a required number of prepregs and copper foils and molding them under heat and pressure. At this time, the prepreg used is one in which a resin impregnated into a base material is semi-cured in the base material.
無機質のガラス布の基材と有機質の樹脂はそのままでは
接着性が良くないので、基材と含浸される樹脂の接着を
よくする目的で、通常、基材を構成する繊維の表面に表
面処理剤の被覆加工が施される。しかし、この表面処理
剤のガラス布基材への塗工時に、ガラス布基材の表面の
細孔によって処理剤が発泡し、処理される基材の表面に
むらを生しる。このむらの部分には樹脂ワニスの含浸が
均−行われないので、樹脂含浸の不均一なプリプレグと
なり、積層板となったとき、吸湿耐熱性、吸湿絶縁性に
劣る問題を有していた。Since the inorganic glass cloth base material and the organic resin do not have good adhesion as they are, in order to improve the adhesion between the base material and the impregnated resin, a surface treatment agent is usually applied to the surface of the fibers that make up the base material. A coating process is applied. However, when this surface treatment agent is applied to a glass cloth substrate, the treatment agent foams due to the pores on the surface of the glass cloth substrate, resulting in unevenness on the surface of the substrate being treated. Since the resin varnish is not evenly impregnated in these uneven areas, the prepreg is unevenly impregnated with the resin, and when it is made into a laminate, it has problems with poor moisture absorption heat resistance and moisture absorption insulation properties.
本発明は、積層板に用いられるプリプレグにおいて、樹
脂が良好に含浸し、外観にむらのないプリプレグが得ら
れるプリプレグ用の基材を提供することにある。An object of the present invention is to provide a prepreg base material for use in laminates, which can be satisfactorily impregnated with resin and has a uniform appearance.
本発明は、上記の点に鑑みて為されたものであり、その
特徴は、脱泡処理された表面処理剤が被覆されたプリプ
レグ用の基材にある。The present invention has been made in view of the above points, and its feature lies in a base material for prepreg coated with a defoamed surface treatment agent.
以下に、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明にかかる表面処理剤としては、アミノンラン、エ
ポキシシラン、スチレンシランなどのシラン系カップリ
ング剤を用いることができる。As the surface treatment agent according to the present invention, silane coupling agents such as aminorane, epoxysilane, and styrene silane can be used.
基材のN!lは特に限定するものではなく、好ましくは
ガラス布等を用いることができる。この他、石英繊維布
等の無機繊維布やこれらの不織布等が用いられてもよい
。Base material N! l is not particularly limited, and preferably glass cloth or the like can be used. In addition, inorganic fiber cloths such as quartz fiber cloths and nonwoven fabrics thereof may also be used.
その脱泡方法としては、■ゼオライトなどの多孔体を含
んだ状態で減圧下で加熱または、加熱か減圧のいづれか
一方を行う、■逆浸透膜による気体分離、■真空脱泡処
理などの方法を適宜選択して用いることができる。Methods for degassing include: ■ heating under reduced pressure in a state containing a porous material such as zeolite, or performing either heating or depressurization, ■ gas separation using a reverse osmosis membrane, and ■ vacuum degassing treatment. It can be selected and used as appropriate.
基材に表面処理剤を被覆する方法の一例としては、上記
の方法で脱泡処理した表面処理剤が2〜20%で分散し
た水溶液の入ったタンクを、連続して送り出されてくる
ガラス布基材より上方に設置し、タンクから水溶液を重
力で供給し、基材の片側表面に一様に塗布し、乾燥機で
水分を乾燥する方法をあげることができる。An example of a method for coating a substrate with a surface treatment agent is to use a glass cloth that is continuously fed through a tank containing an aqueous solution in which 2 to 20% of the surface treatment agent, which has been defoamed using the above method, is dispersed. An example of a method is to install the aqueous solution above the base material, supply an aqueous solution by gravity from a tank, apply it uniformly to one surface of the base material, and dry the water in a dryer.
この基材に含浸してプリプレグとするのに用いることが
できる樹脂としては、フェノール樹脂、エポキシ樹脂、
不飽和ポリエステル樹脂、ポリイミド樹脂、ポリブタジ
ェン樹脂、ポリフェニレンオキサイド樹脂、フッ素樹脂
、ポリエチレンテレフタレート樹脂、ポリフェニレンサ
ルファイド樹脂などの熱硬化性樹脂や熱可塑性樹脂の単
独、変性物、混合物から成る樹脂のみ、または、これら
の樹脂にガラス粉、炭酸カルシウム、タルク、水酸化ア
ルミニウムなどの無III質充填材を混入した樹脂プレ
スがある。Resins that can be used to impregnate this base material to make prepreg include phenolic resin, epoxy resin,
Resins consisting solely of thermosetting resins and thermoplastic resins such as unsaturated polyester resins, polyimide resins, polybutadiene resins, polyphenylene oxide resins, fluororesins, polyethylene terephthalate resins, and polyphenylene sulfide resins, modified products, and mixtures of these resins. There is a resin press in which non-III fillers such as glass powder, calcium carbonate, talc, and aluminum hydroxide are mixed into the resin.
プリプレグは、十分に脱泡処理した表面処理剤で表面処
理された基材に前記の樹脂プレスを含浸させ、乾燥によ
って溶媒を蒸発させつつ樹脂の反応を進行させ基材中の
樹脂を半硬化させることによって得ることができる。半
硬化させる時の温度は140〜170°Cで行うのが好
ましい。170°Cを越えると樹脂の反応が進み過ぎ、
得られるプリプレグの層間接着力の低下や蒸発する溶媒
の発火の危険ム二通しる。Prepreg is produced by impregnating the resin press into a base material whose surface has been treated with a surface treatment agent that has been sufficiently defoamed, and then drying to evaporate the solvent and proceed with the reaction of the resin, semi-curing the resin in the base material. You can get it by doing this. The temperature during semi-curing is preferably 140 to 170°C. If the temperature exceeds 170°C, the reaction of the resin will proceed too much.
This will reduce the interlayer adhesion of the resulting prepreg and pose a risk of ignition from the evaporated solvent.
次に本発明を実施例と比較例によって説明する。Next, the present invention will be explained with reference to Examples and Comparative Examples.
〔実施例]
実施例 1
アミノシランの2.0%水溶液からなる表面処理剤を用
い、処理温度40°C1真空度7X10’パスカルで表
面処理した仕様1080のガラス布を基材とし、エポキ
シ樹脂としてブロム化エポキシ樹脂(東部化成、 YD
B−50帆エポキシ当量500)を100重量部、硬化
剤としてジシアンジアミドを2.1重量部、硬化促進剤
として、2エチル4メチルイミダヅールを0.1重量部
、溶媒としてメチルエチルケトンとジメチルホルムアミ
ドの等量の混合液を前記エポキシ樹脂に対して65重量
%の樹脂含有率になるように調製した樹脂ワニスとし、
この樹脂プレスを前記ガラス布に含浸させ、150 ’
Cの乾燥機中で10分間乾燥させることにより各々のプ
リプレグを得た。[Example] Example 1 Glass cloth of specification 1080 was surface-treated with a surface treatment agent consisting of a 2.0% aqueous solution of aminosilane at a treatment temperature of 40° C. and a degree of vacuum of 7×10' Pascal, and bromine was used as the epoxy resin. Chemical epoxy resin (Tobu Kasei, YD
100 parts by weight of B-50 (epoxy equivalent: 500), 2.1 parts by weight of dicyandiamide as a curing agent, 0.1 parts by weight of 2-ethyl 4-methyl imidazole as a curing accelerator, methyl ethyl ketone and dimethyl formamide as solvents. A resin varnish prepared by using an equal amount of the mixed liquid to have a resin content of 65% by weight based on the epoxy resin,
This resin press was impregnated into the glass cloth, and 150'
Each prepreg was obtained by drying for 10 minutes in a dryer of C.
このプリプレグをlmX1m角に切断加工し、この加工
表面を目視で検査し、プリプレグ表面のむらを判定した
。むらが全体の80%以上の著しいものを×、15%以
下のものをOlこの間のものを△とし、その結果を第1
表乙こプリプレグの外観として示した。This prepreg was cut into 1 m x 1 m squares, and the processed surface was visually inspected to determine the unevenness of the prepreg surface. If the unevenness is significant at 80% or more of the total, it is marked as ×, if it is less than 15%, it is marked as △, and the results are marked as △.
The appearance of the prepreg is shown below.
この切断したプリプレグ10枚を重ね、その両表面に1
8μ請の粗面化銅箔を置いて蒸気プレスを用いて、成形
温度170°C1成形圧力50kg/cm”、100分
間の成形条件で積層成形を行い両面銅張積層板を得た。Stack 10 of these cut prepregs and place one layer on both surfaces.
A double-sided copper-clad laminate was obtained by placing a roughened copper foil having a thickness of 8 μm and using a steam press to perform lamination molding at a molding temperature of 170° C. and a molding pressure of 50 kg/cm” for 100 minutes.
このようにして得た1mx1m角の両面銅張積層板から
切り出して各試験片を作成し、絶縁性、耐熱性をJ I
S C6481に準して評価し、第1表にそれぞれの
結果を、鉛層絶縁抵抗と半田耐熱(260°C11分)
として示した。なお、半田耐熱で、ふくれの生しなった
ものをC1僅かに生したものを△、著しいものを×とし
て示した。Each test piece was cut out from the 1 m x 1 m square double-sided copper-clad laminate obtained in this way, and the insulation and heat resistance were tested by JI.
It was evaluated according to SC6481, and the results are shown in Table 1. Lead layer insulation resistance and soldering heat resistance (260°C 11 minutes)
It was shown as In terms of solder heat resistance, those with slight blistering were rated C1 as △, and those that were markedly blistered were rated as ×.
実施例2
実施例1のアミノシランを、スチレンシランに換えた、
以外は実施例1と同様にした。Example 2 The aminosilane in Example 1 was replaced with styrene silane,
Except for this, the same procedure as in Example 1 was carried out.
実施例3
実施例1の仕様1080の基材を仕fi 7628のガ
ラス布の基材に換えた、以外は実施例1と同様にした。Example 3 The same procedure as in Example 1 was carried out except that the base material of specification 1080 in Example 1 was replaced with a glass cloth base material of specification fi 7628.
実施例4
実施例1のアミノソランを、スチレンシランに換え、仕
様1080の基材を仕様7628のガラス布の基材に換
えた、以外は実施例1と同様にした。Example 4 The same procedure as in Example 1 was carried out, except that the aminosolane in Example 1 was replaced with styrene silane, and the base material of specification 1080 was replaced with a glass cloth base material of specification 7628.
比較例 1〜4
各実施例の表面処理剤を脱泡しないまま、表面処理剤と
して用いた以外は各実施例と同様に実施し、第1表の結
果を得た。Comparative Examples 1 to 4 Comparative Examples 1 to 4 were carried out in the same manner as in each Example except that the surface treatment agent of each Example was used as a surface treatment agent without defoaming, and the results shown in Table 1 were obtained.
第1表の結果から、実施例のプリプレグは外観に優れる
とともに、電気特性、耐熱性にも優れてしることが分か
る。厚みの薄い仕様1080の基材のほうが仕様762
8のガラス布基材より、脱泡処理された表面処理剤の効
果がよくでることも確認できた。From the results in Table 1, it can be seen that the prepregs of Examples have excellent appearance, as well as excellent electrical properties and heat resistance. The thinner base material with specification 1080 is better with specification 762.
It was also confirmed that the effect of the defoamed surface treatment agent was better than that of the glass cloth base material No. 8.
(以 下 余 白)
〔発明の効果〕
本発明のプリプレグ用の基材によって、樹脂含浸性に優
れ、外観にむらのない良好なプリプレグが得られるので
ある。(Margin below) [Effects of the Invention] The base material for prepreg of the present invention makes it possible to obtain a good prepreg that has excellent resin impregnation properties and has a uniform appearance.
特許出願人 松下電工株式会社Patent applicant Matsushita Electric Works Co., Ltd.
Claims (2)
徴とするプリプレグ用の基材。(1) A prepreg base material coated with a defoamed surface treatment agent.
求項1記載のプリプレグ用の基材。(2) The base material for prepreg according to claim 1, wherein the base material is a glass cloth.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28657090A JPH04163005A (en) | 1990-10-23 | 1990-10-23 | Base material for prepreg |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28657090A JPH04163005A (en) | 1990-10-23 | 1990-10-23 | Base material for prepreg |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04163005A true JPH04163005A (en) | 1992-06-08 |
Family
ID=17706123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28657090A Pending JPH04163005A (en) | 1990-10-23 | 1990-10-23 | Base material for prepreg |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04163005A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07242757A (en) * | 1994-03-04 | 1995-09-19 | Yoshikuni Yoshimitsu | Production of prepreg |
US8246564B2 (en) | 2008-12-04 | 2012-08-21 | Therox, Inc. | System for enriching a bodily fluid with a gas having automated priming capabilities |
US8636952B2 (en) | 2008-12-04 | 2014-01-28 | Therox, Inc. | System for enriching a bodily fluid with a gas having a removable gas-enrichment device with an information recording element |
CN107470317A (en) * | 2017-06-15 | 2017-12-15 | 广东环境保护工程职业学院 | A kind of method of the debrominate of waste printed circuit board pyrolysis oil and lighting |
-
1990
- 1990-10-23 JP JP28657090A patent/JPH04163005A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07242757A (en) * | 1994-03-04 | 1995-09-19 | Yoshikuni Yoshimitsu | Production of prepreg |
US8246564B2 (en) | 2008-12-04 | 2012-08-21 | Therox, Inc. | System for enriching a bodily fluid with a gas having automated priming capabilities |
US8636952B2 (en) | 2008-12-04 | 2014-01-28 | Therox, Inc. | System for enriching a bodily fluid with a gas having a removable gas-enrichment device with an information recording element |
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