JPH02182407A - Impregnation of base with varnish - Google Patents
Impregnation of base with varnishInfo
- Publication number
- JPH02182407A JPH02182407A JP235389A JP235389A JPH02182407A JP H02182407 A JPH02182407 A JP H02182407A JP 235389 A JP235389 A JP 235389A JP 235389 A JP235389 A JP 235389A JP H02182407 A JPH02182407 A JP H02182407A
- Authority
- JP
- Japan
- Prior art keywords
- base
- resin
- resin varnish
- bandlike
- long
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002966 varnish Substances 0.000 title claims abstract description 23
- 238000005470 impregnation Methods 0.000 title abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 12
- 239000004744 fabric Substances 0.000 abstract description 7
- 239000011521 glass Substances 0.000 abstract description 6
- 239000004952 Polyamide Substances 0.000 abstract description 3
- 229920002647 polyamide Polymers 0.000 abstract description 3
- 229920000742 Cotton Polymers 0.000 abstract description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 abstract description 2
- 239000010425 asbestos Substances 0.000 abstract description 2
- 238000007664 blowing Methods 0.000 abstract description 2
- 238000005266 casting Methods 0.000 abstract description 2
- 238000007598 dipping method Methods 0.000 abstract description 2
- 239000012784 inorganic fiber Substances 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 abstract description 2
- 229910052895 riebeckite Inorganic materials 0.000 abstract description 2
- 238000005507 spraying Methods 0.000 abstract description 2
- 229920002994 synthetic fiber Polymers 0.000 abstract description 2
- 239000012209 synthetic fiber Substances 0.000 abstract description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000000835 fiber Substances 0.000 abstract 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- -1 polyphenylene Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の第１１用分野〕
本発明は電気機器、電子機器、通信機器、計算機器等に
用いられる積層板、プリント配線板用基材へのワニス含
浸方法に関するものである。[Detailed Description of the Invention] [Eleventh Industrial Field] The present invention relates to a method for impregnating varnish into a substrate for laminated boards and printed wiring boards used in electrical equipment, electronic equipment, communication equipment, computing equipment, etc. It is.
従来、積層板やプリント配線板用基材へのワニス含浸は
、特公昭５２−４５３５９、特公昭５４−２２４７１に
記載されて層るように含浸工程を１次、２次に分割し、
低粘度樹脂ワニスで１次含浸することにより基材中に内
蔵している空気を基材外に排出し易くし９気内蔵のなり
樹脂含浸基材を得、これを用いることにより成形性、ド
リル加工性のよい積層板、プリント配ｈａを得ようとし
ているがガラス布基材においては、ガラス布の絣糸と横
糸の交点及び紗糸と横糸を構成するフィラメント間に樹
脂ワニスが充分浸透しない欠点があった。Conventionally, varnish impregnation of laminated boards and printed wiring board substrates has been carried out by dividing the impregnation process into primary and secondary stages in a layered manner as described in Japanese Patent Publication No. 52-45359 and Japanese Patent Publication No. 54-22471.
By primary impregnation with a low viscosity resin varnish, the air contained in the base material can be easily discharged to the outside of the base material, resulting in a resin-impregnated base material with 9 air content, which improves moldability and drillability. We are trying to obtain laminates and printed halves with good workability, but with glass cloth substrates, the disadvantage is that the resin varnish does not penetrate sufficiently between the intersections of the kasuri threads and weft threads of the glass cloth, and between the filaments that make up the gauze threads and weft threads. was there.
従来の技術で述べたように含浸方法を１次、２次と分割
しても基材に充分樹脂を含浸することができなかった。As described in the prior art, even if the impregnation method is divided into primary and secondary methods, the base material cannot be sufficiently impregnated with resin.
本発明は従来の技術における上述の問題点に鑑みてなさ
れたもので、その目的とするところは、基材内に残存空
気のなＬＡ僧脂會攻基材を得ることにある。The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to obtain an LA resin-containing base material with no residual air within the base material.
本発明はシ尺帯状基材の温度を、樹脂ワニス温度より５
〜５０℃高温にして樹脂ワニスを含浸させることを特徴
とする基材へのワニス含浸方法のため、ガラス布基材と
接触する界面の樹脂ワニス粘度を低下できるのでガラス
布交点及びフィラメント間に樹脂ワニスを浸透させるこ
とができるため基材内に残存空気のない樹脂含浸基材を
得ることができるもので、以下本発明の詳細な説明する
。In the present invention, the temperature of the strip-like base material is 55% lower than the resin varnish temperature.
Because the method of impregnating the base material with resin varnish at a high temperature of ~50°C, it is possible to reduce the viscosity of the resin varnish at the interface where it contacts the glass cloth base material. Since the varnish can be permeated into the resin-impregnated base material, a resin-impregnated base material with no residual air inside the base material can be obtained.The present invention will be described in detail below.
本発明に用いる長尺帯状基材は厚み０，０５〜１．０ｓ
ａｗ、巾約１ｍ乃至約２＃！のガラス、アスベスト等の
無機繊維やポリエステル、ポリアミド、ポリアラミドポ
リビニルアルコール、ポリアクリル等の有機会成繊維や
木綿等の矢然＃ＩＩ紺からなる織布、不織布、マっト或
は租又はこれらの組合せ基材等である。樹脂ワニスとし
てはフェノール樹脂、クレゾール樹脂、エポキシ樹゛脂
、不飽和ポリエステル樹脂、メラミン樹脂、ポリイミド
、ポリブタジェン、ポリアミド、ポリアミドイミド、ポ
リスルフォン、ポリフェニレンサルファイド、ポリフェ
ニレンオキサイＶ１ポリブチレンチＶフタレートポリエ
ーテルエーテルケトン、弗化樹脂等の単独、変性物、混
合物等が用いられ必要に応じて粘度調整に水、メチルア
ルコール、アセトン、シクロヘキサノン、スチレンモノ
マー等の溶媒ｔ” ｔｉ 加したものである。長尺帯状
基材の温度は、樹脂ワニス温度より５〜５０℃高温であ
ることが必要である。即ち５℃未滴では含浸性が向上せ
ず、５０℃をこえると樹脂ワニスに粘度ムラを発生する
ためである。長尺帯状基材の加温は、加温ロールとの接
触による伝熱加温、熱風吹き付けによる基材加温乾燥機
による基材の加温等で行なうことができ特に限定するも
のではない。The long strip-shaped base material used in the present invention has a thickness of 0.05 to 1.0 seconds.
aw, width about 1m to about 2#! Woven fabrics, non-woven fabrics, mats, or grains made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyaramid, polyvinyl alcohol, and polyacrylic, and arrowhead #II navy blue such as cotton. It is a combination base material etc. Resin varnishes include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polyphenylene sulfide, polyphenylene oxy V1 polybutylene V phthalate polyether ether ketone, Fluorinated resins, etc. alone, modified products, mixtures, etc. are used, and if necessary, a solvent such as water, methyl alcohol, acetone, cyclohexanone, styrene monomer, etc. is added to adjust the viscosity.Long strip-shaped base material The temperature needs to be 5 to 50 degrees Celsius higher than the resin varnish temperature.In other words, impregnating properties will not improve if it is not dropped at 5 degrees Celsius, and if it exceeds 50 degrees Celsius, viscosity unevenness will occur in the resin varnish. Heating of the long strip-shaped base material can be carried out by heat transfer heating by contact with a heating roll, heating the base material by heating the base material by blowing hot air, and heating the base material by a dryer, and is not particularly limited. .
含浸手段についても浸漬、スプレー 塗布、転写、流延
等を用いることができ特に限定するものではなく、更に
含浸を１次、２次、３次と複数含浸させることもできる
ものである。The impregnation means is not particularly limited, and may be dipping, spray coating, transfer, casting, etc., and it is also possible to carry out multiple impregnations such as primary, secondary, and tertiary impregnation.
以下本発ＢＡを実施例にもとづ論で説明する。The BA of the present invention will be explained below based on an example.
実施例１乃至３
厚み０．１８鱈、巾１０４０ ＃の長尺帯状ガラス布（
日東紡績株式会社裂、品番ＷＥ１ｇＫ］０４）の材料温
度は２０℃であ−た。該基材を含攪伊直前に加温ロール
に接幼させて実権例１については３０℃、実施例２につ
いては４５℃、実施例３につηては６０℃に加温してか
らワニス温度２０℃、粘度５ｏｏｅｐ８のエポキシ樹脂
ワニスを収納する含浸槽に全面浸漬し、乾燥後の樹脂量
が４５優になるように含浸した後乾燥機で乾燥し樹脂含
浸基材を得た。Examples 1 to 3 Long strip-shaped glass cloth with a thickness of 0.18 mm and a width of 1040 #
The material temperature of Nittobo Co., Ltd., product number WE1gK]04) was 20°C. Immediately before stirring, the base material is inoculated onto a heating roll and heated to 30°C for Actual Example 1, 45°C for Example 2, and 60°C for Example 3, and then varnished. The entire surface was immersed in an impregnating tank containing an epoxy resin varnish with a temperature of 20° C. and a viscosity of 5 ooep8, and the resin was impregnated so that the amount of resin after drying was 45 yen, and then dried in a drier to obtain a resin-impregnated base material.
比較例
実施例と同じ長尺帯状基材を加温せず、そのまま実施例
と同じエポキシ樹脂ワニスに含浸した以外は実施例と同
様に処理して樹脂含浸基材を得た。Comparative Example A resin-impregnated base material was obtained in the same manner as in the Example except that the same elongated strip base material as in the Example was not heated and was impregnated with the same epoxy resin varnish as in the Example.
実施例及び比較例の樹脂含浸基材の残存内蔵気泡数及び
該樹脂含浸基材８枚と厚さ０．０３５ｓｒａ＋の銅箔１
枚を重ねて積層板を３０ Ｋｑ／ｄ で檀庵成形した時
の成形性及び得られた積層板のドリル加工性は第１表の
ようである。Number of remaining built-in bubbles in resin-impregnated base materials of Examples and Comparative Examples and 8 resin-impregnated base materials and 1 copper foil with a thickness of 0.035 sra+
Table 1 shows the formability of the laminated sheets stacked together and the laminate molded at 30 Kq/d and the drill workability of the resulting laminated sheet.
本発明は上述した０口＜構成されて偽る。特許請求の範
囲第１項に記載した構成を有する基材へのワニス含浸方
法においては樹脂含浸基材残存内蔵空気ヲ檄減させ、成
形性、ドリル加工￥Ｅに優れた積層板、プリント配線板
金得ることができる効果を有している。The present invention is configured as described above. In the method of impregnating a base material with varnish having the structure described in claim 1, the residual built-in air in the resin-impregnated base material is reduced, and a laminated board and a printed wiring sheet metal with excellent moldability and drilling processing cost are obtained. It has the effect that can be obtained.
Claims (1)
５０℃高温にして樹脂ワニスを含浸させることを特徴と
する基材へのワニス含浸方法。(1) The temperature of the long strip base material is 5 to 50% lower than the resin varnish temperature.
A method for impregnating a base material with varnish, which comprises impregnating a base material with a resin varnish at a high temperature of 50°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP235389A JPH02182407A (en) | 1989-01-09 | 1989-01-09 | Impregnation of base with varnish |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP235389A JPH02182407A (en) | 1989-01-09 | 1989-01-09 | Impregnation of base with varnish |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02182407A true JPH02182407A (en) | 1990-07-17 |
Family
ID=11526908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP235389A Pending JPH02182407A (en) | 1989-01-09 | 1989-01-09 | Impregnation of base with varnish |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02182407A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1786967A2 (en) * | 2004-09-11 | 2007-05-23 | Johns Manville | Methods and systems for making fiber reinforced products and resultant products |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5557100A (en) * | 1978-10-15 | 1980-04-26 | Matsushita Electric Works Ltd | Reinforcing of paper base material for resin impregnation |
| JPS5567412A (en) * | 1978-11-15 | 1980-05-21 | Matsushita Electric Works Ltd | Preparation of prepreg for laminated plate |
-
1989
- 1989-01-09 JP JP235389A patent/JPH02182407A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5557100A (en) * | 1978-10-15 | 1980-04-26 | Matsushita Electric Works Ltd | Reinforcing of paper base material for resin impregnation |
| JPS5567412A (en) * | 1978-11-15 | 1980-05-21 | Matsushita Electric Works Ltd | Preparation of prepreg for laminated plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1786967A2 (en) * | 2004-09-11 | 2007-05-23 | Johns Manville | Methods and systems for making fiber reinforced products and resultant products |
| EP1786967A4 (en) * | 2004-09-11 | 2009-05-13 | Johns Manville | Methods and systems for making fiber reinforced products and resultant products |
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