JPH02182408A - Impregnation of base with varnish - Google Patents
Impregnation of base with varnishInfo
- Publication number
- JPH02182408A JPH02182408A JP235489A JP235489A JPH02182408A JP H02182408 A JPH02182408 A JP H02182408A JP 235489 A JP235489 A JP 235489A JP 235489 A JP235489 A JP 235489A JP H02182408 A JPH02182408 A JP H02182408A
- Authority
- JP
- Japan
- Prior art keywords
- base
- resin
- impregnated
- tension
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002966 varnish Substances 0.000 title claims abstract description 16
- 238000005470 impregnation Methods 0.000 title abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 29
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000004744 fabric Substances 0.000 abstract description 9
- 239000011521 glass Substances 0.000 abstract description 8
- 239000004952 Polyamide Substances 0.000 abstract description 3
- 229920002647 polyamide Polymers 0.000 abstract description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 2
- 229920000742 Cotton Polymers 0.000 abstract description 2
- 239000010425 asbestos Substances 0.000 abstract description 2
- 238000005266 casting Methods 0.000 abstract description 2
- 229930003836 cresol Natural products 0.000 abstract description 2
- 238000007598 dipping method Methods 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 abstract description 2
- 239000012784 inorganic fiber Substances 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 229910052895 riebeckite Inorganic materials 0.000 abstract description 2
- 238000005507 spraying Methods 0.000 abstract description 2
- 229920002994 synthetic fiber Polymers 0.000 abstract description 2
- 239000012209 synthetic fiber Substances 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- -1 polybutylene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気機器、電子機器１通信機器、計算機器等に
用いられる積層板、プリント配線板用基材へのワニス含
浸方法に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for impregnating varnish into a substrate for laminated boards and printed wiring boards used in electrical equipment, electronic equipment, communication equipment, computing equipment, etc. .
従来、積層板やプリント配線板用基材へのワニス含浸は
、特公昭５２−４５３５９、特公昭５４−２２４７１に
記載されているように含浸工程を１次、２次に分割し、
低粘度樹脂ワニスで１次含浚することにより基材中に内
蔵して−る空気を基材外に排出し易くし空気内蔵のない
樹脂含浸基材を得、これを用いることにより成形性、ド
リル加工性のよい積層板、プリント配線板を得ようとし
ているがガラス布基材においては、ガラス布の縦糸と横
糸の欠点及び縦糸と横糸を構成するフィラメント間に樹
脂ワニスが充分浸透しない欠点があった。Conventionally, varnish impregnation of laminated boards and printed wiring board substrates has been carried out by dividing the impregnation process into primary and secondary steps, as described in Japanese Patent Publication No. 52-45359 and Japanese Patent Publication No. 54-22471.
By primary dredging with a low-viscosity resin varnish, the air contained in the base material can be easily discharged to the outside of the base material, and a resin-impregnated base material without built-in air can be obtained, and by using this, moldability, We are trying to obtain laminates and printed wiring boards with good drillability, but with glass cloth substrates, there are drawbacks to the warp and weft threads of the glass cloth, and the drawback that resin varnish does not penetrate sufficiently between the filaments that make up the warp and weft threads. there were.
従来の技術で述べたように含浸方法を１？：に、２次と
分割しても基材に充分樹脂を含浸することができなかっ
た。本発明は従来の技術における上述の問題点に鑑みて
なされたもので、その目的とするところは、基材内に残
存空気のない樹脂含浸基材を得ることｊごある。As mentioned in the conventional technique, impregnation method 1? : The base material could not be sufficiently impregnated with the resin even if it was divided into the second and second parts. The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to obtain a resin-impregnated base material without residual air within the base material.
Ｃ問題点全解決するための手段〕
本発明は長尺帯状基材のテンションを＋ｏ Ｋｑ／ｌｉ
以下にして樹脂ワニスを含漬させることを特徴とする基
材へのワニス含浸方法であるため、ガラス布の縦糸と横
糸の交点及びフィラメント間の空間を狭くすることなく
樹脂ワニスを含浸させることができるので基材内に残存
空気のない樹脂含浸基材を得ることができるもので、以
下本発明の詳細な説明する。Means for solving all problems C] The present invention improves the tension of the long strip base material by +o Kq/li
Since this method of impregnating a base material with resin varnish is characterized by impregnating it with resin varnish as follows, it is possible to impregnate the resin varnish without narrowing the intersection of the warp and weft of the glass cloth and the space between the filaments. This makes it possible to obtain a resin-impregnated base material with no residual air within the base material.The present invention will be described in detail below.
本発明に用−る長尺帯状基材は厚み０．０５〜１．０朋
、巾約１ｍ乃至約２ｍのガラス、アスベスト等の無機繊
維やポリエステル、ポリアミド、ポリアラミドポリビニ
ルアルコール、ポリアクリル等の有機合成繊維や木綿等
の天然繊維からなる織布、不織布、マーノド或は紙又は
これらの組合せ基材等である。樹脂ワニスとしてはフェ
ノール樹脂、クレゾール樹脂、エポキシ樹脂、不９和ポ
リエステル樹脂、メラミン樹脂、ポリイミド、ポリブタ
ジェン、ポリアミド、ポリアミドイミド、ポリスルフォ
ン、ポリフェニレンサルファイド、ポリフェニレンオキ
サイド、ポリブチレンテレ７タレートポリエーテルエー
テルケトン、弗化樹脂等の単独、変性物、混合物等が用
いられ必要に応じて粘度調整に水、メチルアルコール、
アセトン、シクロヘキサノン、スチレンモノマー等のｆ
ｇ 媒’ｆｒ 添加したものである。長尺帯状基材のテ
ンションは１０ＫＱ／ｃ４以下にして樹脂ワニスを含浸
させる必要がある。即ち＋ＯＫｑ／ｄをこえるとガラス
布交点及びフィラメント間の空間を充分拡げることがで
きず従って基材内に残存空気のある樹脂含浸基材しか得
られない。長尺帯状基材のテンションを＋ｎＫｑ／ｄ以
下にする手段としては含浸前後の送り込みフィードロー
ルと引取りフィードロールを速度差をつばたりすること
で達成できるが特に限定するものではない。含浸手段ｌ
こついても浸漬、スプレー塗布、転写、流延等を用込る
ことができ特に限定するものではなく、史に含浸を１次
、２次、３次と初数含沈させることもできるものである
。The long strip-shaped base material used in the present invention has a thickness of 0.05 to 1.0 mm and a width of about 1 m to about 2 m, and is made of inorganic fibers such as glass, asbestos, polyester, polyamide, polyaramid, polyvinyl alcohol, polyacrylic, etc. The base materials include woven fabrics, non-woven fabrics, woven fabrics, paper, or combinations thereof made of organic synthetic fibers and natural fibers such as cotton. Resin varnishes include phenolic resin, cresol resin, epoxy resin, non-9ated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamide-imide, polysulfone, polyphenylene sulfide, polyphenylene oxide, polybutylene tele-7-thalerate polyether ether ketone. , fluorinated resins, etc. alone, modified products, mixtures, etc. are used, and if necessary, water, methyl alcohol,
f of acetone, cyclohexanone, styrene monomer, etc.
g medium'fr added. The tension of the long strip base material needs to be 10 KQ/c4 or less to impregnate it with the resin varnish. That is, if +OKq/d is exceeded, the space between the glass cloth intersection point and the filament cannot be sufficiently expanded, and therefore only a resin-impregnated base material with residual air inside the base material can be obtained. The tension of the long strip base material can be set to +nKq/d or less by adjusting the speed difference between the feed roll and the take-up feed roll before and after impregnation, but this is not particularly limited. Impregnation means
Even if you get stuck, you can use dipping, spray coating, transfer, casting, etc., and there are no particular limitations, and it is also possible to perform initial impregnation, such as primary, secondary, and tertiary impregnation. be.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
厚み０．１８劇、巾１０４０ ｍの長尺帯状ガラス布（
日東紡績株式会社製、品番ＷＥ１８Ｋ １０４ ） −
ｉ送り込みフィードロールを径でエポキシｍｌ 脂ワニ
スを収納する含浸槽に全面浸漬し乾燥後の樹脂逗が４ｓ
重鑞４になるように含浸した後、引取りフィードロール
を径で乾燥機にて乾燥し樹脂含浸基材を得たが、フィー
ドロールのスピード比を運転開始時は引取りフィードロ
ールを１とし、送り込みフィードロールを１．２に設定
し、定常運転後は送り込みフィードロール及び引取りフ
ィードロールのスピードを同調させて運転したが、この
時の長尺帯状基材のテンションは５ＫＱΔであった。Example: A long strip of glass cloth with a thickness of 0.18 mm and a width of 1040 m (
Manufactured by Nittobo Co., Ltd., product number WE18K 104) -
I Fully immersed the feed roll into an impregnating tank containing epoxy varnish (diameter) and dried the resin for 4 seconds.
After impregnation to a weight of 4, the taken-up feed roll was dried in a dryer with a diameter to obtain a resin-impregnated base material, but the speed ratio of the taken-up feed roll was set to 1 at the start of operation. The feed roll was set at 1.2, and after steady operation, the speed of the feed roll and the take-up feed roll were synchronized and the tension of the long strip base material at this time was 5KQΔ.
比較例
実施例と同じ長尺帯状基材を最初から送り込みフィード
ロールド引取りフィードロールのスピード比を同調させ
て運転した以外は実施例と同様にして樹脂含浸基材を得
たが、この時の長尺帯状基材のテンションは１６ Ｋｑ
／ｌ：ｙ＊ であった。Comparative Example A resin-impregnated base material was obtained in the same manner as in the Example except that the same long strip base material as in the Example was fed from the beginning and the speed ratio of the feed roll and take-up feed roll were synchronized and operated. The tension of the long strip base material is 16 Kq.
/l:y*.
実殉例及び比較例の樹脂含浸基材の残存内蔵気泡斂及び
該樹脂含浸基材８斃厚さ０．０３５鰭の銅箔１枚を重ね
て積層板を３ｏＫｑ／ｄで積層成形した時の成形性及び
得られた積層板のドリル加工性は第１表のようである。Residual built-in bubbles of the resin-impregnated base material of the actual case and comparative example and when the resin-impregnated base material was laminated with one sheet of copper foil having a thickness of 0.035 fins and laminated at 3oKq/d. The formability and drillability of the obtained laminate are shown in Table 1.
ＷＪ１表
注
※ ドリル径０．５ ｆｆで１．６ ｒａｍの積層板を
３枚軍ねてドリル加工した場合の穴ズレをミクロンで示
したもの。WJ1 table note * Hole misalignment in microns when drilling three 1.6 RAM laminates with a drill diameter of 0.5 ff.
本発明は上述した如く構成されている。特許請求の範囲
第１項に記載した構成を有する基材へのワニス含浸方法
においては樹脂含攪基拐残存内蔵空気を激減させ、成形
性、ドリル加工性に優れた積層板、プリント配線板を得
ることができる効果を有して−る。The present invention is constructed as described above. The method for impregnating a base material with varnish having the structure described in claim 1 drastically reduces the residual built-in air in the resin-containing base material, and produces laminates and printed wiring boards with excellent moldability and drill workability. It has the effect that can be obtained.
Claims (1)
以下にして樹脂ワニスを含浸させることを特徴とする基
材へのワニス含浸方法。(1) The tension of the long strip base material is 10Kg/cm^2
A method for impregnating a base material with a resin varnish as follows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP235489A JPH02182408A (en) | 1989-01-09 | 1989-01-09 | Impregnation of base with varnish |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP235489A JPH02182408A (en) | 1989-01-09 | 1989-01-09 | Impregnation of base with varnish |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02182408A true JPH02182408A (en) | 1990-07-17 |
Family
ID=11526935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP235489A Pending JPH02182408A (en) | 1989-01-09 | 1989-01-09 | Impregnation of base with varnish |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02182408A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001064411A1 (en) * | 2000-03-03 | 2001-09-07 | Hitachi Chemical Co., Ltd. | Method for producing prepreg, preprig, metal-clad laminate and printed wiring board |
| JP2006232951A (en) * | 2005-02-23 | 2006-09-07 | Matsushita Electric Works Ltd | Method for producing prepreg |
-
1989
- 1989-01-09 JP JP235489A patent/JPH02182408A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001064411A1 (en) * | 2000-03-03 | 2001-09-07 | Hitachi Chemical Co., Ltd. | Method for producing prepreg, preprig, metal-clad laminate and printed wiring board |
| US6749899B2 (en) | 2000-03-03 | 2004-06-15 | Hitachi Chemical Co., Ltd. | Method for producing prepreg, prepreg, metal clad laminate and printed wiring board |
| JP2006232951A (en) * | 2005-02-23 | 2006-09-07 | Matsushita Electric Works Ltd | Method for producing prepreg |
| JP4734953B2 (en) * | 2005-02-23 | 2011-07-27 | パナソニック電工株式会社 | Manufacturing method of prepreg |
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