JPS63212510A - Manufacture of prepreg - Google Patents
Manufacture of prepregInfo
- Publication number
- JPS63212510A JPS63212510A JP4522987A JP4522987A JPS63212510A JP S63212510 A JPS63212510 A JP S63212510A JP 4522987 A JP4522987 A JP 4522987A JP 4522987 A JP4522987 A JP 4522987A JP S63212510 A JPS63212510 A JP S63212510A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- resin
- prepreg
- impregnated
- roll
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 229920005989 resin Polymers 0.000 claims abstract description 46
- 239000011347 resin Substances 0.000 claims abstract description 46
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 abstract description 33
- 238000005470 impregnation Methods 0.000 abstract description 15
- 239000002966 varnish Substances 0.000 abstract description 8
- 238000001035 drying Methods 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 abstract description 2
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 8
- 239000004744 fabric Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、多重合回路の製造などに使用されるプリプレ
グ（樹脂含浸基材）の製造方法に関し、より詳しく゛は
基材の樹脂含浸性を改良し、スルホール信頼性の優れた
積層板が得られるプリプレグの製造方法に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a method for manufacturing prepreg (resin-impregnated base material) used for manufacturing multiplex circuits, etc. The present invention relates to a prepreg manufacturing method that improves the resin impregnability of the material and provides a laminate with excellent through-hole reliability.
（従来技術）
電子・電気機器用の印刷配線板は、それが使用される機
器の軽量小型化にともない、基材の薄板化、実装部品の
小形化が進んでいる。 このような印刷配線板では、配
線パターンの高密度化とともにスルホール径が小さくな
り、その結果スルーホールの信頼性の確保がますます重
要視されるようになってきた。 スルホールの信頼性は
プリプレグの製造方法に依存している。(Prior Art) Printed wiring boards for electronic and electrical equipment are becoming lighter and smaller as the equipment in which they are used are becoming lighter and smaller, and the base materials are becoming thinner and the components mounted on them are becoming smaller. In such printed wiring boards, as the wiring pattern becomes denser, the diameter of the through holes becomes smaller, and as a result, ensuring the reliability of the through holes becomes increasingly important. The reliability of throughholes depends on the prepreg manufacturing method.
従来のプリプレグでは、連続した基材をディプロールを
用いて含浸槽の熱硬化性樹脂溶液中に浸漬し引き上げる
という含浸方法が採られるが、基材中に存在する微細な
ボイドを樹脂含浸中に完全に除去することは不可能であ
った。 こうして製造されたプリプレグを使用したＭｌ
ｌｌ板は、小径スルホールにメッキを施した場合メッキ
ボイド等の現象を起し、スルーホール信頼性が悪く、問
題の起こりやすいものであった。In conventional prepreg, an impregnation method is used in which a continuous base material is immersed in a thermosetting resin solution in an impregnation tank using a dip roll and then pulled up. It was impossible to remove it. Ml using prepreg produced in this way
In the case of plating small-diameter through-holes, the ll board causes phenomena such as plating voids, has poor through-hole reliability, and is prone to problems.
（本発明が解決しようとする問題点）
本発明は、上記の事情に鑑みてなされたもので、樹脂の
含浸がよくボイドの少ないプリプレグの製造り法を提供
することであり、また積１＆とした場合に小径スルホー
ル信頼性の優れたプリプレグの製造方法を提供しようと
するものである。(Problems to be Solved by the Present Invention) The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a method for manufacturing prepreg that is well impregnated with resin and has few voids. The present invention aims to provide a method for manufacturing a prepreg with excellent small-diameter through-hole reliability in such cases.
［発明の構成］
（問題点を解決するための手段）
本発明者らは、上記の目的を達成しようと鋭意検討した
結果、基材に対する樹脂含浸を、減圧下での含浸工程を
行うことによって、あるいは減圧下での第１次含浸工程
と、常圧下での第２次含浸工程を連続して行うことによ
って、樹脂の含浸がよく、ボイドの少ないプリプレグが
得られ、また小径スルボールの信頼性の優れた積層板が
得られることを見いだし、本発明を完成させたものであ
る。[Structure of the Invention] (Means for Solving the Problems) As a result of intensive studies to achieve the above object, the present inventors have discovered that the base material is impregnated with resin by performing an impregnation process under reduced pressure. Alternatively, by sequentially performing the first impregnation step under reduced pressure and the second impregnation step under normal pressure, a prepreg with good resin impregnation and few voids can be obtained, and the reliability of small diameter Surbol can be improved. It was discovered that an excellent laminate can be obtained, and the present invention was completed.
すなわち、本発明は、
積層板用基材に熱硬化性樹脂を含浸させてなるプリプレ
グの製造方法において、減圧下で前記積層板用基材に熱
硬化性樹脂を含浸させる工程を含むプリプレグの製造方
法である。That is, the present invention provides a method for producing a prepreg in which a thermosetting resin is impregnated into a laminate substrate, which includes a step of impregnating the laminate substrate with a thermosetting resin under reduced pressure. It's a method.
また、積層板用基材に熱硬化性樹脂を含浸させてなるプ
リプレグの製造方法において、減圧下で前記積層板用基
材に熱硬化性樹脂を含浸させる工程と、さらに常圧下で
熱硬化性樹脂を含浸させる工程とを含むプリプレグの製
造方法である。In addition, in the method for producing a prepreg in which a thermosetting resin is impregnated into a laminate substrate, a step of impregnating the laminate substrate with a thermosetting resin under reduced pressure, and a further step of impregnating the laminate substrate with a thermosetting resin under normal pressure. This method includes a step of impregnating a prepreg with a resin.
本発明に用いる積層板用基材としては、コツトン紙、リ
ンター紙、クラフト紙およびこれらの混抄紙等の紙基材
、ガラス織布、ガラス不織布、ガラスベーパー等のガラ
ス基材なと、積層板用として用いられている基材は材質
にかかわらずすべて使用することができる。The substrates for the laminate used in the present invention include paper substrates such as cotton paper, linter paper, kraft paper, and mixed papers thereof; glass substrates such as glass woven cloth, glass nonwoven fabric, and glass vapor; and laminates. Any base material used for this purpose can be used regardless of the material.
本発明に用いる熱硬化性樹脂としては、フェノール樹脂
、メラミン樹脂、ブチラール樹脂、不飽和ポリエステル
樹脂、エポキシ樹脂、ポリイミド樹脂およびこれらの変
性樹脂等が挙げられ、これらは単独もしくは２種以上の
混合系として使用することができる。Thermosetting resins used in the present invention include phenol resins, melamine resins, butyral resins, unsaturated polyester resins, epoxy resins, polyimide resins, and modified resins thereof, which may be used alone or in combinations of two or more. It can be used as
次に図面を用いて説明する。Next, it will be explained using drawings.
第１図は、本発明の一実施例を示す概念図である。 ロ
ール状に巻いた積層板用基材１と、熱硬化性樹脂を溶剤
に溶かしたワニス８を入れた樹脂含浸槽２とをあらかじ
め真空チャンバー３内に入れ真空チャンバー３内をトラ
ップ４を経由し真空ポンプ５を作動させて減圧状態にし
ておく。 減圧の強さは種々の条件によって異なるが６
０Ｔ Ｏｒｒ程度がよい。 減圧下の真空チャンバー３
内で積層板用基材１をロール６経出で樹脂含浸槽２に導
入し、ディップロール７を通して積層板用基材１にワニ
ス８を含浸させる。 そして積層板用基材１を臼−ル６
１を経由し、更にシールロール９を通して真空チャンバ
ー３の外に移動する。 それ以降は図示しないが、含浸
した基材はスクイズロールで樹脂含浸量を調整して乾燥
塔に運びプリプレグをつくる。FIG. 1 is a conceptual diagram showing one embodiment of the present invention. A laminate base material 1 wound into a roll and a resin impregnating tank 2 containing a varnish 8 made by dissolving a thermosetting resin in a solvent are placed in a vacuum chamber 3 in advance, and the inside of the vacuum chamber 3 is passed through a trap 4. The vacuum pump 5 is operated to reduce the pressure. The strength of decompression varies depending on various conditions, but6
Approximately 0T Orr is good. Vacuum chamber under reduced pressure 3
The laminate base material 1 is introduced into the resin impregnation tank 2 through a roll 6, and the laminate base material 1 is impregnated with varnish 8 through a dip roll 7. Then, the base material 1 for the laminate is placed in the mortar 6.
1 and further passes through a seal roll 9 and moves out of the vacuum chamber 3. After that, although not shown, the impregnated base material is used to adjust the amount of resin impregnated with a squeeze roll, and then transported to a drying tower to produce a prepreg.
第２図は本発明の別の一実施例を承す概念図である。
シールロール１９を通過するまでは第１図に示し”たと
同様な操作で行われる。 すなわち、ロール状に巻いた
積層板用基材１１と熱硬化性樹脂を溶剤に溶かしてワニ
ス１８とし、これを入れた樹脂含浸槽１２とをあらかじ
め真空チャンバー１３内に入れ、真空チャンバー１３内
をトラップ１４経由真空ポンプ１５で減圧状態にしてお
く。FIG. 2 is a conceptual diagram of another embodiment of the present invention.
Until it passes through the seal roll 19, the same operation as shown in FIG. The resin impregnating tank 12 containing the resin is placed in the vacuum chamber 13 in advance, and the inside of the vacuum chamber 13 is brought into a reduced pressure state by the vacuum pump 15 via the trap 14.
減圧度は６０Ｔ ｏｒｒ程度に上記同様にしておく。The degree of pressure reduction is set to about 60 T orr as above.
減圧下の真空チャンバー１３内で積層板用基材１１をロ
ール１６を経由して樹脂含浸槽１２に導入し、ディップ
ロール１７を通して積層板用基材１１にワニス１８を含
浸させる。 そして積層板用基材１１をロール１６１を
経由、更にシールロール１９を通した後、ロール２０を
経由して第２の樹脂含浸槽２１に導入する。 第２の樹
脂含浸槽２１には前記の含浸槽１２と同−又は異なるワ
ニス２２が入れてあり、ディップロール２３．２３１を
通してワニス２２を含浸させる。 積層板用基材１１は
スクイズロール２４で樹脂付着量が調整されて乾燥塔２
５に送られ、加熱乾燥してプリプレグがつくられる。In a vacuum chamber 13 under reduced pressure, the laminate base material 11 is introduced into a resin impregnation tank 12 via a roll 16, and the laminate base material 11 is impregnated with a varnish 18 through a dip roll 17. Then, the laminate base material 11 is passed through the roll 161 and further through the seal roll 19, and then introduced into the second resin impregnation tank 21 via the roll 20. The second resin impregnation tank 21 contains the same or different varnish 22 as the impregnation tank 12, and is impregnated with the varnish 22 through dip rolls 23, 231. The base material 11 for the laminate is adjusted in the amount of resin attached with a squeeze roll 24, and then sent to the drying tower 2.
5, where it is heated and dried to produce prepreg.
（作用）
減圧下で積層板用基材に熱硬化性樹脂を含浸させるため
、基材中のボイドを除去することができ、また更に熱硬
化性樹脂を充分含浸させることができる。(Function) Since the base material for a laminate is impregnated with the thermosetting resin under reduced pressure, voids in the base material can be removed and the thermosetting resin can be sufficiently impregnated.
（実施例） 次に本発明を実施例によって説明する。(Example) Next, the present invention will be explained by examples.
実施例 １
第１図に示した装置を用いて、厚さ １００μ備のガラ
ス布基材ＷＥＡ−１１６（日東紡績社製、商品名）を減
圧度５０Ｔ ｏｒｒの真空チャンバー内でＦＲ−４用樹
脂（ＪＩＳグレードＧＥ４Ｆ）を含浸させて樹脂付着量
５０重量％とじ、加熱乾燥して半硬化のプリプレグを製
造した。 このプリプレグと、厚さ０．３１１１の内層
用銅張板ＩＬＣ−５５１Ｍ（東芝ケミカル社製、商品名
）にパターンを形成した内層板とを用いて、１７０℃、
２０ｋｇ／ ｃ霞２．９０分間の加熱加圧成形をし、総
板厚１．６ｍ１ｇ１の６層板を作った。Example 1 Using the apparatus shown in FIG. 1, a glass cloth base material WEA-116 (manufactured by Nitto Boseki Co., Ltd., trade name) with a thickness of 100 μm was heated with resin for FR-4 in a vacuum chamber with a reduced pressure of 50 T orr. (JIS grade GE4F) to obtain a resin adhesion of 50% by weight, and heat-dried to produce a semi-cured prepreg. Using this prepreg and an inner layer plate with a pattern formed on an inner layer copper clad plate ILC-551M (manufactured by Toshiba Chemical Co., Ltd., trade name) with a thickness of 0.3111,
A 6-layer board with a total thickness of 1.6 ml and 1 g was produced by heating and pressing at 20 kg/c haze for 2.90 minutes.
実施例 ２
第２図に示した装置を用いて厚さ５０μ層のガラス布基
材Ａ１０８０（旭シュニーベル社製、商品名）を減圧度
５０Ｔ Ｏｒｒの真空チャンバー内でポリイミド樹脂を
含浸させ、次いで常圧下で７１１度ポリイミド樹脂を含
浸させ、樹脂付着量７０重量％とじ、加熱乾燥して半硬
化のプリプレグを製造した。Example 2 Using the apparatus shown in Fig. 2, a 50μ thick glass cloth base material A1080 (manufactured by Asahi Schniebel Co., Ltd., trade name) was impregnated with polyimide resin in a vacuum chamber with a reduced pressure of 50T Orr, and then regularly It was impregnated with polyimide resin at 711 degrees under pressure, bound to a resin adhesion of 70% by weight, and dried by heating to produce a semi-cured prepreg.
このプリプレグと、厚さ０．１ｕ＋の内層用銅張板ＴＬ
Ｃ−５８３Ｍ （東芝ケミカル社製、商品名）にパター
ンを形成した内層板とを用いて、１９０℃、２０ｋａ／
ａｍ２．１２０分間加熱加圧成形をし、総板厚１．６
ＩＩＩｌの１２Ｒ板を作った。This prepreg and the copper clad plate TL for the inner layer with a thickness of 0.1u+
C-583M (manufactured by Toshiba Chemical Co., Ltd., trade name) with a patterned inner layer plate was used at 190℃, 20ka/
am2. Heat and pressure mold for 120 minutes, total plate thickness 1.6
I made a 12R board of IIIl.
比較例 １
減圧下でない通常の含浸装置を用いて実施例１で用いた
ガラス布基材およびＦＲ−４用樹脂を用いて樹脂付着量
５０重量％のプリプレグを得、次いで実施例１と同様に
して６層板を作った。Comparative Example 1 A prepreg with a resin adhesion of 50% by weight was obtained using the glass cloth base material and FR-4 resin used in Example 1 using a normal impregnation device that was not under reduced pressure, and then treated in the same manner as in Example 1. I made a 6 layer board.
比較例 ２
減圧下でない通常の含浸装置を用いて実施例２で用いた
ガラス布基材およびポリイミド樹脂を用いて樹脂付着量
７０重量％のプリプレグを得、次いで実施例２と同様に
して１２層板を作った。Comparative Example 2 A prepreg with a resin coverage of 70% by weight was obtained using the glass cloth base material and polyimide resin used in Example 2 using an ordinary impregnating apparatus that was not under reduced pressure, and then 12 layers were prepared in the same manner as in Example 2. I made a board.
実施例１〜２および比較例１〜２で得られた多層板につ
いてスルホール信頼性試験を行いその結果を第１表に示
したが、いずれも本発明の顕著な効果が認められた。The multilayer plates obtained in Examples 1 and 2 and Comparative Examples 1 and 2 were subjected to a through-hole reliability test, and the results are shown in Table 1, in which the remarkable effects of the present invention were recognized.
［発明の効果１
以上の説明および第１表から明らかなように、本発明の
プリプレグの製造方法によれば、はとんどのボイドを除
去することができボイドの少ない、樹脂の含浸のよいプ
リプレグを得ることができ、これを用いた積層板は小径
スルホール信頼性の優れたちのである。[Effect of the invention 1] As is clear from the above explanation and Table 1, according to the prepreg manufacturing method of the present invention, most of the voids can be removed, and the prepreg with good resin impregnation can be produced with few voids. can be obtained, and the laminate using this material has excellent reliability for small diameter through holes.
第１図は本発明の一実施例を示す概念図、第２図は本発
明の別の一実施例を示す概念図である。
１．１１・・・積層板用基材、 ３．１３・・・真空チ
ャンバー、 ２，１２．２１・・・樹脂含浸槽、２５・
・・乾燥塔、 ８．１８．２２・・・熱硬化性樹脂（ワ
ニス）。FIG. 1 is a conceptual diagram showing one embodiment of the present invention, and FIG. 2 is a conceptual diagram showing another embodiment of the present invention. 1.11... Base material for laminate, 3.13... Vacuum chamber, 2,12.21... Resin impregnation tank, 25.
...Drying tower, 8.18.22...Thermosetting resin (varnish).
Claims (1)
プレグの製造方法において、減圧下で前記積層板用基材
に熱硬化性樹脂を含浸させる工程を含むプリプレグの製
造方法。 ２ 積層板用基板に熱硬化性樹脂を含浸させてなるプリ
プレグの製造方法において、減圧下で前記積層板用基材
に熱硬化性樹脂を含浸させる工程と、さらに常圧下で熱
硬化性樹脂を含浸させる工程とを含むプリプレグの製造
方法。[Scope of Claims] 1. A method for producing a prepreg in which a thermosetting resin is impregnated into a laminate substrate, the prepreg comprising a step of impregnating the laminate substrate with a thermosetting resin under reduced pressure. Production method. 2. A method for producing a prepreg by impregnating a thermosetting resin into a laminate substrate, including a step of impregnating the laminate substrate with a thermosetting resin under reduced pressure, and further impregnating the thermosetting resin under normal pressure. A method for manufacturing a prepreg, comprising a step of impregnating the prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4522987A JPS63212510A (en) | 1987-03-02 | 1987-03-02 | Manufacture of prepreg |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4522987A JPS63212510A (en) | 1987-03-02 | 1987-03-02 | Manufacture of prepreg |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63212510A true JPS63212510A (en) | 1988-09-05 |
Family
ID=12713431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4522987A Pending JPS63212510A (en) | 1987-03-02 | 1987-03-02 | Manufacture of prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63212510A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54130672A (en) * | 1978-03-31 | 1979-10-11 | Matsushita Electric Works Ltd | Vacuum impregnation of varnish |
| JPS557812A (en) * | 1978-06-30 | 1980-01-21 | Dainippon Ink & Chem Inc | Printing ink |
| JPS6189032A (en) * | 1984-10-05 | 1986-05-07 | Matsushita Electric Works Ltd | Manufacture of laminate |
-
1987
- 1987-03-02 JP JP4522987A patent/JPS63212510A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54130672A (en) * | 1978-03-31 | 1979-10-11 | Matsushita Electric Works Ltd | Vacuum impregnation of varnish |
| JPS557812A (en) * | 1978-06-30 | 1980-01-21 | Dainippon Ink & Chem Inc | Printing ink |
| JPS6189032A (en) * | 1984-10-05 | 1986-05-07 | Matsushita Electric Works Ltd | Manufacture of laminate |
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