JPH0848797A - Production of prepreg - Google Patents

Production of prepreg

Info

Publication number
JPH0848797A
JPH0848797A JP6185532A JP18553294A JPH0848797A JP H0848797 A JPH0848797 A JP H0848797A JP 6185532 A JP6185532 A JP 6185532A JP 18553294 A JP18553294 A JP 18553294A JP H0848797 A JPH0848797 A JP H0848797A
Authority
JP
Japan
Prior art keywords
solvent
base material
prepreg
fiber base
resin varnish
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6185532A
Other languages
Japanese (ja)
Inventor
Fumio Ishigami
富美男 石上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP6185532A priority Critical patent/JPH0848797A/en
Publication of JPH0848797A publication Critical patent/JPH0848797A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Abstract

PURPOSE:To prevent the air present in a fibrous base material from being enclosed and entrapped in a solvent and as a result remaining in the form of bubbles when the material is immersed in the solvent. CONSTITUTION:A fibrous base material 1 is immersed in a solvent 2, while one of its surfaces is kept from being submerged in the solvent, the material is then impregnated with a resin varnish 3, and the resin is dried to stage B.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、プリント配線板用プリ
プレグの製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a prepreg for a printed wiring board.

【0002】[0002]

【従来の技術】プリプレグは電気用積層板の材料であ
り、繊維基材に熱硬化性樹脂ワニスを含浸し、加熱し
て、揮発分を除去するとともに熱硬化性樹脂を半硬化状
態にしたものである。
2. Description of the Related Art Prepreg is a material for electrical laminates, in which a fibrous base material is impregnated with a thermosetting resin varnish and heated to remove volatile components and the thermosetting resin to a semi-cured state. Is.

【0003】積層板は、プリプレグを何枚か重ね、加熱
加圧して製造される。プリプレグ中に気泡があると、積
層板の耐熱性及び電気特性に悪い影響をを及ぼす。従っ
て、プリプレグ中に気泡ができないようにしなければな
らない。
A laminated board is manufactured by stacking several prepregs and heating and pressing them. The presence of air bubbles in the prepreg adversely affects the heat resistance and electrical properties of the laminate. Therefore, it is necessary to prevent bubbles in the prepreg.

【0004】プリプレグへの熱硬化性樹脂ワニスの含浸
性がよくないとプリプレグ中に気泡が残る。そこで、ワ
ニスが繊維基材とのなじみをよくするため、繊維基材を
溶剤に浸漬して繊維基材中の空気を溶剤で置換したの
ち、熱硬化性樹脂ワニスを含浸する方法が提案されてい
る(特開昭63−99910号公報参照)。
If the prepreg is poorly impregnated with the thermosetting resin varnish, bubbles remain in the prepreg. Therefore, in order to improve the familiarity of the varnish with the fiber base material, a method has been proposed in which the fiber base material is immersed in a solvent to replace the air in the fiber base material with the solvent, and then the thermosetting resin varnish is impregnated. (See JP-A-63-99910).

【0005】[0005]

【発明が解決しようとする課題】特開昭63−9991
0号公報に示される溶剤置換法によっても、繊維基材を
急速に溶剤中に浸漬すると、繊維基材の中に存在する空
気が溶剤に囲まれた状態となって逃げ場がなくなり、気
泡として残ることがあった。本発明は、繊維基材の中に
存在する空気が気泡として残ることがより少ない方法を
提供するものである。
Problems to be Solved by the Invention JP-A-63-9991
According to the solvent substitution method disclosed in Japanese Patent Publication No. 0, when the fiber base material is rapidly immersed in the solvent, the air existing in the fiber base material is surrounded by the solvent and the escape area disappears and remains as bubbles. There was an occasion. The present invention provides a method in which air present in the fibrous base material is less likely to remain as bubbles.

【0006】[0006]

【課題を解決するための手段】本発明は、繊維基材1
を、その一表面が沈まないようにして溶剤2に浸漬した
のち樹脂ワニス3を含浸し、乾燥して樹脂をBステージ
化することを特徴とするプリプレグの製造方法である
(図1参照)。
The present invention is directed to a fiber substrate 1
Is soaked in a solvent 2 so that one surface thereof does not sink, then impregnated with a resin varnish 3 and dried to B-stage the resin (see FIG. 1).

【0007】本発明で使用する繊維基材としては、材質
は、セルロースなどの有機質、ガラスなどの無機質、基
材の形態としては、織布、不織布が挙げられる。溶剤と
しては、メチルエチルケトン、2−メトキシエタノー
ル、トルエン、ジメチルホルムアミド等を用いることが
できる。樹脂ワニスとしては、通常積層板のマトリック
スとして使用されるエポキシ樹脂、不飽和ポリエステル
樹脂、フェノール樹脂を溶剤に溶解したものが使用され
る。
The fiber base material used in the present invention may be made of an organic material such as cellulose, an inorganic material such as glass, or a woven or non-woven fabric as the base material. As the solvent, methyl ethyl ketone, 2-methoxyethanol, toluene, dimethylformamide or the like can be used. As the resin varnish, an epoxy resin, an unsaturated polyester resin, or a phenol resin, which is usually used as a matrix of a laminate, is dissolved in a solvent.

【0008】繊維基材1が、その一表面が沈まないよう
にして溶剤2に浸漬するには、図1に示すように、溶剤
の液面に接するように維持されたロール4、4によって
繊維基材を送るようにすればよい。
In order to immerse the fiber base material 1 in the solvent 2 so that one surface of the fiber base material 1 does not sink, the fiber base material 1 is rolled by rolls 4 and 4 maintained in contact with the liquid surface of the solvent as shown in FIG. The base material may be sent.

【0009】繊維基材を溶剤に浸漬する工程に続いてエ
ポキシ樹脂等の樹脂ワニスに含浸する。樹脂ワニスへの
含浸は通常方法すなわち、繊維基材を含浸タンクに浸漬
する方法でよい。溶剤への浸漬から樹脂ワニスへの含浸
するまでの時間は、使用する溶剤によって差異はある
が、通常40秒〜80秒が好ましい。40秒より短いと
溶剤が十分基材中に浸透せず、基材中の気泡との置換が
十分に行われない。80秒より長いと、基材が樹脂ワニ
スへの含浸される前に溶剤が揮発してしまうため基材中
に再び空気が入り、溶剤置換の効果を失わせる。
Following the step of immersing the fiber base material in a solvent, it is impregnated with a resin varnish such as an epoxy resin. The resin varnish may be impregnated by a usual method, that is, by immersing the fiber base material in an impregnation tank. The time from the immersion in the solvent to the impregnation into the resin varnish varies depending on the solvent used, but is usually 40 seconds to 80 seconds. If it is shorter than 40 seconds, the solvent does not sufficiently penetrate into the base material, and the replacement with the bubbles in the base material is not sufficiently performed. If it is longer than 80 seconds, the solvent volatilizes before the base material is impregnated with the resin varnish, so that air is reintroduced into the base material and the effect of solvent substitution is lost.

【0010】[0010]

【作用】繊維基材の片側から含浸した溶剤が繊維基材中
に下から浸透するので、空気は溶剤に包み込まれること
なく溶剤が浸透するにつれて抜けていく。溶剤に浸漬さ
れていない部分も表面張力で溶剤が浸透する。
Since the solvent impregnated from one side of the fiber base material penetrates into the fiber base material from below, the air escapes without being wrapped in the solvent as the solvent penetrates. The solvent penetrates due to the surface tension even in the portion not immersed in the solvent.

【0011】[0011]

【実施例】厚さ0.2mmのガラスクロスを、図1に示
すよう上面が沈まないように注意しながらメチルエチル
ケトンに浸漬した。続けて、樹脂分60重量%のエポキ
シ樹脂ワニスに含浸、乾燥してプリプレグとした。この
とき、繊維基材が、溶剤から離れてエポキシ樹脂ワニス
に浸漬されるまでの時間を、30秒(実施例1)、60
秒(実施例2)及び90秒(実施例3)と変化させた。
Example A glass cloth having a thickness of 0.2 mm was immersed in methyl ethyl ketone while being careful not to sink the upper surface as shown in FIG. Subsequently, an epoxy resin varnish having a resin content of 60% by weight was impregnated and dried to obtain a prepreg. At this time, the time until the fiber base material is separated from the solvent and immersed in the epoxy resin varnish is 30 seconds (Example 1), 60
It was changed to seconds (Example 2) and 90 seconds (Example 3).

【0012】比較例1 厚さ0.2mmのガラスクロスを、全部沈むようにメチ
ルエチルケトンに浸漬した。続けて、樹脂分60重量%
のエポキシ樹脂ワニスに含浸、乾燥してプリプレグとし
た。繊維基材が、溶剤から離れてエポキシ樹脂ワニスに
浸漬されるまでの時間は、60秒とした。
Comparative Example 1 A glass cloth having a thickness of 0.2 mm was immersed in methyl ethyl ketone so as to completely sink it. Continuously, resin content 60% by weight
Was impregnated with the epoxy resin varnish and dried to obtain a prepreg. The time until the fiber base material was separated from the solvent and immersed in the epoxy resin varnish was set to 60 seconds.

【0013】比較例2 溶剤の含浸を行わず、樹脂ワニスへの含浸のみを行い乾
燥してプリプレグを得た。
Comparative Example 2 A prepreg was obtained by impregnating with a resin varnish without impregnating with a solvent and drying.

【0014】得られたプリプレグ8枚を重ね、さらに、
銅はくを両面に重ねて、170℃、2MPaで90分間
加熱加圧して両面銅張り積層板を製造した。
8 pieces of the obtained prepregs are stacked, and further,
Copper foil was laminated on both sides and heated and pressed at 170 ° C. and 2 MPa for 90 minutes to produce a double-sided copper-clad laminate.

【0015】この積層板から銅はくをエッチングして全
面取り除き、外観(主に気泡(ボイド)の有無)を目視
で調べた。また、各プリプレグについても同様の評価を
した。その結果を表1に示す。
Copper foil was etched from this laminated plate to remove the entire surface, and the appearance (mainly presence or absence of air bubbles (voids)) was visually inspected. Further, the same evaluation was made for each prepreg. The results are shown in Table 1.

【0016】[0016]

【表1】 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 実施例1 実施例2 実施例3 比較例1 比較例2 ─────────────────────────────── プリプレグ ○ ◎ ○ ○ △ ─────────────────────────────── 積層板 ◎ ◎ ◎ ○ △ ─────────────────────────────── 注)◎:極めて良好、○:良好、△:やや不良(ボイド有) ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━[Table 1] ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Example 1 Example 2 Example 3 Comparative example 1 Comparative example 2 ─────────────────────────────── Prepreg ○ ◎ ○ ○ △ ────────────── ────────────────── Laminate ◎ ◎ ◎ ◎ ○ △ ────────────────────────── ────── Note) ◎: Very good, ○: Good, △: Slightly bad (with void) ━━━━━━━━━━━━━━━━━━━━━━━━━━ ━━━━━━

【0017】[0017]

【発明の効果】本発明によれば、繊維基材中に溶剤が気
泡を追い出すように浸透するので、繊維基材中に気泡が
残らないで溶剤が浸透している。従ってこのあと、樹脂
ワニスを含浸すると気泡を含まないプリプレグを得るこ
とができ、このプリプレグを用いて製造した積層板もボ
イドがない優れた積層板となる。
EFFECTS OF THE INVENTION According to the present invention, the solvent permeates into the fiber base material so as to expel the air bubbles, so that the solvent permeates without leaving any bubbles in the fiber base material. Therefore, after that, when the resin varnish is impregnated, a prepreg containing no bubbles can be obtained, and the laminated plate produced using this prepreg also becomes an excellent laminated plate without voids.

【0018】[0018]

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明を実施するための装置の一例を示す概略
断面図である。
FIG. 1 is a schematic cross-sectional view showing an example of an apparatus for carrying out the present invention.

【符号の説明】[Explanation of symbols]

1 繊維基材 2 溶剤 3 樹脂ワニス 4 ロール 1 Fiber substrate 2 Solvent 3 Resin varnish 4 Roll

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 繊維基材を、その一表面が沈まないよう
にして溶剤に浸漬したのち樹脂ワニスを含浸し、乾燥し
て樹脂をBステージ化することを特徴とするプリプレグ
の製造方法。
1. A method for producing a prepreg, which comprises immersing a fiber base material in a solvent so that one surface thereof does not sink, then impregnating it with a resin varnish, and drying the resin to B-stage the resin.
JP6185532A 1994-08-08 1994-08-08 Production of prepreg Pending JPH0848797A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6185532A JPH0848797A (en) 1994-08-08 1994-08-08 Production of prepreg

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6185532A JPH0848797A (en) 1994-08-08 1994-08-08 Production of prepreg

Publications (1)

Publication Number Publication Date
JPH0848797A true JPH0848797A (en) 1996-02-20

Family

ID=16172454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6185532A Pending JPH0848797A (en) 1994-08-08 1994-08-08 Production of prepreg

Country Status (1)

Country Link
JP (1) JPH0848797A (en)

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