JP3330055B2 - Method for producing resin-impregnated base material - Google Patents
Method for producing resin-impregnated base materialInfo
- Publication number
- JP3330055B2 JP3330055B2 JP10648497A JP10648497A JP3330055B2 JP 3330055 B2 JP3330055 B2 JP 3330055B2 JP 10648497 A JP10648497 A JP 10648497A JP 10648497 A JP10648497 A JP 10648497A JP 3330055 B2 JP3330055 B2 JP 3330055B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- impregnated
- base material
- substrate
- resin varnish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Reinforced Plastic Materials (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、積層板の製造に用
いられる樹脂含浸基材の製造方法に関するものである。[0001] The present invention relates to a method for producing a resin-impregnated base material used for producing a laminate.
【０００２】[0002]
【従来の技術】樹脂含浸基材は従来から、ガラス布や紙
などの基材にフェノール樹脂やエポキシ樹脂等の樹脂ワ
ニスを含浸させ、これを乾燥することによって製造され
ている。そしてこの樹脂含浸基材を複数枚重ねて加熱加
圧して積層成形することによって、積層板を得ることが
できるものである。2. Description of the Related Art Conventionally, a resin-impregnated base material has been manufactured by impregnating a base material such as glass cloth or paper with a resin varnish such as a phenol resin or an epoxy resin and drying the impregnated resin varnish. Then, a plurality of the resin-impregnated base materials are stacked, heated and pressed to form a laminate, thereby obtaining a laminate.
【０００３】しかし樹脂含浸基材には、気泡が残存して
いたり、樹脂ワニスの未含浸部分が存在したりすること
が多く、積層成形に際して樹脂の流動性が悪くなって、
積層板にカスレが発生し、この結果、積層板は透明性が
劣るだけでなく、耐熱性や耐湿性にも劣ることになるも
のであった。このような積層板のカスレを防止するため
に、樹脂含浸基材の樹脂含浸量を高めたり、流動性の大
きい樹脂を用いたりしているが、この場合には成形時に
位置ずれが発生し易くなって成形性が劣るという問題が
あった。However, the resin-impregnated base material often has air bubbles remaining or non-impregnated portions of the resin varnish, which deteriorates the fluidity of the resin during lamination.
Lamination occurred in the laminate, and as a result, the laminate was not only inferior in transparency, but also inferior in heat resistance and moisture resistance. In order to prevent such lamination of the laminate, the resin impregnation amount of the resin-impregnated base material is increased or a resin having a high fluidity is used, but in this case, misalignment tends to occur during molding. As a result, there was a problem that the moldability was poor.
【０００４】そこで、樹脂含浸基材の気泡の残存や樹脂
ワニスの未含浸をなくすために、加圧ロールや超音波を
用いて樹脂ワニスを含浸させることが試みられている
が、これらは効果が乏しく、また真空下で樹脂ワニスを
含浸することも試みられているが、この方法では連続化
が難しいと共に装置が大型化して高価になるという問題
があった。[0004] In order to eliminate the residual air bubbles in the resin-impregnated base material and the non-impregnation of the resin varnish, attempts have been made to impregnate the resin varnish using a pressure roll or ultrasonic waves. Attempts to impregnate resin varnish under vacuum have been attempted, but this method has problems that it is difficult to achieve continuity and that the apparatus becomes large and expensive.
【０００５】一方、特公平６−８９１６１号公報には、
基材に減圧脱泡溶剤を予備含浸させ、次いで基材に樹脂
ワニスを含浸させた後、乾燥することによって樹脂含浸
基材を製造する方法が提供されている。この方法によれ
ば、基材に樹脂ワニスを含浸させる際に、基材中に予備
含浸されている溶剤と樹脂ワニスとが置換され、基材中
に樹脂ワニスを良好に浸透させることができるものであ
り、気泡の残存や樹脂ワニスの未含浸の少ない樹脂含浸
基材を得ることができる。On the other hand, Japanese Patent Publication No. 6-89161 discloses that
There is provided a method for producing a resin-impregnated substrate by pre-impregnating the substrate with a solvent under reduced pressure and then impregnating the substrate with a resin varnish, followed by drying. According to this method, when the substrate is impregnated with the resin varnish, the solvent preliminarily impregnated in the substrate is replaced with the resin varnish, and the resin varnish can be well penetrated into the substrate. Thus, it is possible to obtain a resin-impregnated base material having less residual air bubbles and less impregnation of the resin varnish.
【０００６】[0006]
【発明が解決しようとする課題】このように、特公平６
−８９１６１号公報で提供される方法によれば、基材へ
の樹脂ワニスの含浸性が良好な樹脂含浸基材を得ること
ができるが、現実には、季節的変動の要因などで含浸性
にばらつきがあり、気泡の残存や樹脂ワニスの未含浸の
少ない樹脂含浸基材を安定して製造することはできない
ものであった。As described above, Japanese Patent Publication No.
According to the method provided in JP-89161-A, it is possible to obtain a resin-impregnated base material having a good impregnation property with a resin varnish on the base material. There was variation, and it was impossible to stably produce a resin-impregnated base material having little residual air bubbles and no impregnation of resin varnish.
【０００７】本発明は上記の点に鑑みてなされたもので
あり、基材への樹脂の含浸性が良好な樹脂含浸基材を安
定して得ることができる樹脂含浸基材の製造方法を提供
することを目的とするものである。The present invention has been made in view of the above points, and provides a method for producing a resin-impregnated base material capable of stably obtaining a resin-impregnated base material having a good resin impregnation property to the base material. It is intended to do so.
【０００８】[0008]
【課題を解決するための手段】本発明の請求項１に係る
樹脂含浸基材の製造方法は、基材１に減圧脱泡された有
機溶剤２を予備含浸させ、次いでこの基材１に含有水分
量が３重量％以下の樹脂ワニス３を含浸させた後、乾燥
することを特徴とするものである。According to a first aspect of the present invention, there is provided a method for producing a resin-impregnated base material, wherein a base material 1 is pre-impregnated with an organic solvent 2 which has been degassed under reduced pressure. The resin varnish 3 having a water content of 3% by weight or less is impregnated and then dried.
【０００９】また本発明の請求項２に係る樹脂含浸基材
の製造方法は、基材１に含有水分量が３重量％以下の減
圧脱泡された有機溶剤２を予備含浸させ、次いでこの基
材１に含有水分量が３重量％以下の樹脂ワニス３を含浸
させた後、乾燥することを特徴とするものである。また
本発明において、基材１として付着水分量が０．５重量
％以下のものを用いるのが好ましい。Further, in the method for producing a resin-impregnated base material according to claim 2 of the present invention, the base material 1 is pre-impregnated with an organic solvent 2 having a water content of 3% by weight or less and having been degassed under reduced pressure. The method is characterized in that the material 1 is impregnated with a resin varnish 3 having a water content of 3% by weight or less and then dried. Also
In the present invention, it is preferable to use a substrate 1 having an attached moisture amount of 0.5% by weight or less.
【００１０】また本発明にあって、有機溶剤２や樹脂ワ
ニス３を含浸する工程４の雰囲気の水蒸気分圧が１５ｍ
ｍＨｇ以下であることが好ましい。In the present invention, the partial pressure of water vapor in the atmosphere in the step 4 of impregnating the organic solvent 2 and the resin varnish 3 is 15 m.
It is preferably at most mHg.
【００１１】[0011]
【発明の実施の形態】以下、本発明の実施の形態を説明
する。本発明において基材１としては、ガラス布や紙な
ど任意のものを用いることができるものであり、この基
材１は乾燥機等で乾燥して付着水分量が０．５重量％以
下になったものを用いるのが好ましい。基材１の付着水
分量が０．５重量％を超えると、この水分の影響によっ
て樹脂含浸基材に気泡が残留し易くなる。基材１の付着
水分量は少ない程望ましいが、実用的には付着水分量を
０．１重量％以下にすることは困難であり、これが実質
上の下限である。Embodiments of the present invention will be described below. In the present invention, as the substrate 1, any material such as glass cloth or paper can be used, and the substrate 1 is dried by a dryer or the like so that the amount of adhering water becomes 0.5% by weight or less. It is preferable to use those that have been used. If the amount of water adhering to the substrate 1 exceeds 0.5% by weight, air bubbles tend to remain on the resin-impregnated substrate due to the effect of the water. It is desirable that the amount of water adhering to the substrate 1 be as small as possible, but it is practically difficult to reduce the amount of water adhering to 0.1% by weight or less, and this is the practical lower limit.
【００１２】また本発明において有機溶剤２としては、
後述の樹脂ワニス３中の有機溶剤と相溶性を有するもの
を用いるのが好ましく、メチルアルコール、アセトン、
メチルエチルケトン、メチルセロソルブ、１−メトキシ
−２−プロパノール、ジメチルホルムアミドなどを使用
することができる。この有機溶剤２は減圧槽１０で１５
０Ｔｏｒｒ以上に減圧して脱泡した状態で溶剤槽１１に
供給されるようにしてある。また本発明では、この有機
溶剤２として含有水分量が３重量％以下のものを用いる
ようにしている。有機溶剤２に３重量％を超える水分が
含有されていると、この水分の影響によって樹脂含浸基
材に気泡が残留し易くなる。有機溶剤２の含有水分量は
小さい程良く、理想的には０重量％であるが、実用的に
は含有水分量を０．０５重量％以下にすることは困難で
あり、これが実質上の下限である。In the present invention, the organic solvent 2 includes
It is preferable to use one having compatibility with the organic solvent in the resin varnish 3 described below, and methyl alcohol, acetone,
Methyl ethyl ketone, methyl cellosolve, 1-methoxy-2-propanol, dimethylformamide and the like can be used. The organic solvent 2 is added to the
The solvent is supplied to the solvent tank 11 in a defoamed state by reducing the pressure to 0 Torr or more. In the present invention, the organic solvent 2 having a water content of 3% by weight or less is used. If the organic solvent 2 contains more than 3% by weight of water, bubbles tend to remain on the resin-impregnated base material due to the effect of the water. The smaller the water content of the organic solvent 2 is, the better, and ideally it is 0% by weight. However, it is practically difficult to reduce the water content to 0.05% by weight or less. It is.
【００１３】そして、有機溶剤２が供給される溶剤槽１
１に長尺の基材１を連続して送りながら、有機溶剤２中
に基材１を浸漬させることによって、基材１に有機溶剤
２を含浸させることができる。基材１を有機溶剤２中に
５〜３０秒間程度浸漬させることによって、基材１中に
有機溶剤２を十分に含浸させるのが好ましい。ここで、
減圧脱泡された有機溶剤２は空気の溶解力を持ってお
り、この有機溶剤２を基材１に含浸させることによっ
て、基材１中の空気を有機溶剤２に溶解させて基材１中
の残存空気を減少させることができるものである。A solvent tank 1 to which the organic solvent 2 is supplied.
The substrate 1 can be impregnated with the organic solvent 2 by immersing the substrate 1 in the organic solvent 2 while continuously feeding the long substrate 1 to the substrate 1. It is preferable that the substrate 1 is sufficiently impregnated with the organic solvent 2 by immersing the substrate 1 in the organic solvent 2 for about 5 to 30 seconds. here,
The organic solvent 2 that has been defoamed under reduced pressure has the ability to dissolve air. By impregnating the organic solvent 2 into the substrate 1, the air in the substrate 1 is dissolved in the organic solvent 2 and Can reduce residual air.
【００１４】また本発明において樹脂ワニス３として
は、フェノール樹脂、エポキシ樹脂、ポリイミド樹脂な
ど、積層板用の任意の熱硬化性樹脂を有機溶剤に溶解し
て調製したものを用いることができるものである。また
本発明では、この樹脂ワニス３として含有水分量が３重
量％以下のものを用いるようにしている。樹脂ワニス３
に３重量％を超える水分が含有されていると、この水分
の影響によって樹脂含浸基材に気泡が残留し易くなる。
樹脂ワニス３の含有水分量は小さい程良く、理想的には
０重量％であるが、実用的には含有水分量を０．０５重
量％以下にすることは困難であり、これが実質上の下限
である。In the present invention, the resin varnish 3 may be a resin varnish prepared by dissolving an arbitrary thermosetting resin for a laminate such as a phenol resin, an epoxy resin or a polyimide resin in an organic solvent. is there. Further, in the present invention, a resin varnish 3 having a water content of 3% by weight or less is used. Resin varnish 3
Contains more than 3% by weight of water, bubbles tend to remain in the resin-impregnated base material due to the influence of the water.
The smaller the water content of the resin varnish 3 is, the better and ideally it is 0% by weight. However, it is practically difficult to reduce the water content to 0.05% by weight or less. It is.
【００１５】図の実施の形態では、接触法と浸漬法を併
用して基材１に樹脂ワニス３を含浸させるようにしてあ
る。すなわち、キスロール１２をその下部を樹脂ワニス
３に浸漬して設けた接触槽１３と、浸漬ロール１４を樹
脂ワニス３に浸漬して設けた浸漬槽１５とを用い、上記
のように有機溶剤２を含浸させた基材１を連続して送り
ながら、先ず基材１の片面をキスロール１２に接触さ
せ、キスロール１２によって基材１の片面に樹脂ワニス
３を塗布して基材１に片面から樹脂ワニス３を浸透させ
る。このように基材１に片面から樹脂ワニス３を浸透さ
せることによって、基材１中の空気を他方の片面から追
い出すことが容易になる。次いで、基材１を浸漬ロール
１４によって浸漬槽１５の樹脂ワニス３中に浸漬し、基
材１に樹脂ワニス３を含浸させた後、基材１を加圧ロー
ル１６に通して、余分な樹脂ワニス３とともに基材１中
の空気を絞り出す。In the embodiment shown in the drawings, the substrate 1 is impregnated with the resin varnish 3 by using both the contact method and the dipping method. That is, using the contact tank 13 provided with the lower part of the kiss roll 12 immersed in the resin varnish 3 and the immersion tank 15 provided with the immersion roll 14 immersed in the resin varnish 3, the organic solvent 2 is supplied as described above. While continuously feeding the impregnated substrate 1, one side of the substrate 1 is first brought into contact with a kiss roll 12, and a resin varnish 3 is applied to one side of the substrate 1 by the kiss roll 12, and the resin varnish is applied to the substrate 1 from one side. 3 infiltrate. By infiltrating the resin varnish 3 into the substrate 1 from one side in this way, it becomes easy to expel air in the substrate 1 from the other side. Next, the base material 1 is immersed in the resin varnish 3 of the immersion tank 15 by the immersion roll 14 to impregnate the base material 1 with the resin varnish 3. The air in the substrate 1 is squeezed out together with the varnish 3.
【００１６】このように、基材１に有機溶剤２を含浸さ
せた後に樹脂ワニス３を含浸させると、有機溶剤２と置
換するようにして樹脂ワニス３は基材１にスムーズに浸
透し、基材１に未含浸部分が生じることなく樹脂ワニス
３を含浸させることができるものである。また、基材１
に有機溶剤２や樹脂ワニス３を含浸させる工程４の湿度
雰囲気は、水蒸気分圧が１５ｍｍＨｇ以下になるように
調整しておくのが好ましい。水蒸気分圧が１５ｍｍＨｇ
以下になるように雰囲気を調整することによって、基材
１や有機溶剤２や樹脂ワニス３に対する雰囲気中の水分
の影響を小さくすることができ、長時間連続生産しても
安定して含浸性の良好な状態を維持することができるも
のである。水蒸気分圧は低い程好ましいが、雰囲気の水
蒸気分圧を５ｍｍＨｇより低くすることは困難であり、
これが実質上の下限である。As described above, when the resin varnish 3 is impregnated after the base material 1 is impregnated with the organic solvent 2, the resin varnish 3 permeates the base material 1 smoothly so as to replace the organic solvent 2, The material 1 can be impregnated with the resin varnish 3 without generating an unimpregnated portion. In addition, substrate 1
It is preferable that the humidity atmosphere in the step 4 of impregnating the organic solvent 2 or the resin varnish 3 with the organic solvent 2 or the resin varnish 3 is adjusted so that the partial pressure of water vapor is 15 mmHg or less. Water vapor partial pressure is 15mmHg
By adjusting the atmosphere so as to be as follows, the influence of moisture in the atmosphere on the substrate 1, the organic solvent 2, and the resin varnish 3 can be reduced, and the impregnating property can be stably maintained even after continuous production for a long time. A good state can be maintained. Although the lower the water vapor partial pressure, the better, but it is difficult to make the water vapor partial pressure of the atmosphere lower than 5 mmHg,
This is a practical lower limit.
【００１７】そして、上記のように基材１に樹脂ワニス
３を含浸した後、これを加熱して乾燥することによっ
て、Ｂステージ状態の樹脂含浸基材を得ることができる
ものである。このようにして得られた樹脂含浸基材を複
数枚重ね、これを加熱加圧して積層成形することによっ
て積層板を製造することができるものであり、また樹脂
含浸基材を複数枚重ねると共にその片面あるいは両面に
銅箔等の金属箔を重ね、これを加熱加圧して積層成形す
ることによって、プリント配線板に加工される金属箔貼
り積層板を製造することができるものである。After the substrate 1 is impregnated with the resin varnish 3 as described above, the resin varnish 3 is heated and dried to obtain a B-stage resin impregnated substrate. A plurality of resin-impregnated base materials obtained in this manner are stacked, and a laminate can be manufactured by laminating and molding by heating and pressurizing the resin-impregnated base materials. By laminating a metal foil such as a copper foil on one or both sides and heating and pressurizing the same to form a laminate, a metal foil-attached laminated board processed into a printed wiring board can be manufactured.
【００１８】ここで、上記のようにして得られた樹脂含
浸基材は、気泡の残存や樹脂ワニスの未含浸の少ない含
浸性の良好なものであるので、積層成形を行なうにあた
っては、成形性が向上し、成形圧力を低圧にすることが
できると共に成形時間を短縮することができるものであ
り、従来のデーライトプレスのみならず、オートクレー
ブ成形や、金属箔に通電して加熱を行なう方式の成形に
もおいても、良好に積層成形を行なうことができるもの
である。Here, the resin-impregnated base material obtained as described above has good impregnating properties with little residual air bubbles and no impregnation of the resin varnish. It can improve the molding pressure and reduce the molding time and shorten the molding time. Not only the conventional daylight press, but also the autoclave molding and the method of heating by energizing the metal foil Also in molding, it is possible to perform good lamination molding.
【００１９】[0019]
【実施例】次に、本発明を実施例によって具体的に説明
する。 （実施例１） 基材１としてＭＩＬ仕様規格７６２８のガラスクロス
（旭シュエーベル社製、厚み０．１８ｍｍ）を用い、有
機溶剤２として減圧度２０Ｔｏｒｒで１５分間減圧脱泡
した１−メトキシ−２−プロパノールを用い、また樹脂
ワニス３として次の配合組成のものを用いた。 ・臭素化ビスフェノールＡ型エポキシ樹脂（エポキシ当量５００）９０重量部 ・クレゾールノボラック型エポキシ樹脂（エポキシ当量２２０） １０重量部 ・ジシアンジアミド ５重量部 ・ジメチルホルムアミド ３０重量部 ・メチルセロソルブ ３０重量部 ・２−エチル−４−メチルイミダゾール ０．２重量部 そして先ず、付着水分率が０．６重量％の基材１を用
い、含有水分率を４重量％に調整した有機溶剤２に１５
秒間浸漬して、基材１に有機溶剤２を含浸させた後、含
有水分率を１重量％に調整した樹脂ワニス３を用い、基
材１の片面に樹脂ワニス３をキスロール１２で塗布して
含浸させると共に次いで基材１を樹脂ワニス３に浸漬し
て含浸させ、加圧ロール１６で余分な樹脂ワニス３を絞
った後、１５５℃で５分間加熱乾燥することによって、
樹脂含有率が５０％の樹脂含浸基材を得た。ここで、有
機溶剤２や樹脂ワニス３の含浸工程の雰囲気は、水蒸気
分圧９ｍｍＨｇであった。Next, the present invention will be described specifically with reference to examples. (Example 1) 1-methoxy-2-decompressed and defoamed for 15 minutes at a reduced pressure of 20 Torr as an organic solvent 2 using a glass cloth (manufactured by Asahi Schwebel Co., Ltd., thickness 0.18 mm) as the base material 1 and MIL specification standard 7628 Propanol was used, and resin varnish 3 having the following composition was used. -90 parts by weight of brominated bisphenol A type epoxy resin (epoxy equivalent 500)-10 parts by weight of cresol novolak type epoxy resin (epoxy equivalent 220)-5 parts by weight of dicyandiamide-30 parts by weight of dimethylformamide-30 parts by weight of methyl cellosolve-2- 0.2 parts by weight of ethyl-4-methylimidazole First, using the base material 1 having an attached moisture content of 0.6% by weight, and adding 15% to the organic solvent 2 whose moisture content was adjusted to 4 % by weight.
After dipping for 2 seconds to impregnate the base material 1 with the organic solvent 2, the resin varnish 3 having a moisture content adjusted to 1 % by weight was applied to one surface of the base material 1 with the kiss roll 12. By impregnating and then impregnating the substrate 1 with the resin varnish 3 by impregnating the resin varnish 3, squeezing excess resin varnish 3 with the pressure roll 16, and heating and drying at 155 ° C. for 5 minutes,
A resin-impregnated base material having a resin content of 50% was obtained. Here, the atmosphere in the step of impregnating the organic solvent 2 and the resin varnish 3 was a water vapor partial pressure of 9 mmHg.
【００２０】尚、基材１の付着水分率、有機溶剤２や樹
脂ワニス３の含有水分率は、三菱化成工業社製微量水分
測定装置「ＣＡ−０５」によって測定した数値である。 （実施例２，３、比較例１，２） 基材１の付着水分率、有機溶剤２や樹脂ワニス３の含有
水分率を表１のように調整して使用するようにした他
は、実施例１と同様にして、樹脂含浸基材を得た。The moisture content of the substrate 1 and the moisture content of the organic solvent 2 and the resin varnish 3 are numerical values measured by a micro moisture analyzer "CA-05" manufactured by Mitsubishi Chemical Corporation. (Examples 2 and 3 , Comparative Examples 1 and 2) Except that the moisture content of the base material 1 and the moisture content of the organic solvent 2 and the resin varnish 3 were adjusted as shown in Table 1, and used. A resin-impregnated substrate was obtained in the same manner as in Example 1.
【００２１】上記のようにして実施例１〜３及び比較例
１，２で得た樹脂含浸基材について、その表面を光学顕
微鏡で観察し、１平方センチメートル当たりの気泡の数
を計測した。その結果を表１に示す。また実施例１〜３
及び比較例１，２で得た樹脂含浸基材を用いて積層板を
成形した。すなわち、両面に７０μｍ厚の銅箔を張った
厚み１．２ｍｍの銅張り積層板の両面にそれぞれ樹脂含
浸基材を１枚ずつ重ねると共にさらにその外側にそれぞ
れ１８μｍ厚の銅箔を重ね、これを１３０℃の温度で３
０分間、１７０℃の温度で６０分間加熱しながら１０ｋ
ｇ／ｃｍ２の圧力で加圧することによって、４層構成の
積層板を成形した。そしてこのように成形した積層板の
表面の銅箔をエッチング除去し、積層板の各角部からの
カスレ量を測定し、その最大値を表１に示す。The surfaces of the resin-impregnated substrates obtained in Examples 1 to 3 and Comparative Examples 1 and 2 were observed with an optical microscope, and the number of bubbles per square centimeter was measured. Table 1 shows the results. Examples 1 to 3
A laminate was formed using the resin-impregnated substrates obtained in Comparative Examples 1 and 2. That is, a resin-impregnated base material is laminated on both sides of a 1.2 mm-thick copper-clad laminate having 70 μm-thick copper foil on both sides, and further 18 μm-thick copper foil is further laminated on the outside thereof. 3 at a temperature of 130 ° C
0k for 10 minutes while heating at 170 ° C for 60 minutes
By pressing at a pressure of g / cm 2 , a four-layer laminate was formed. Then, the copper foil on the surface of the laminate thus formed was removed by etching, and the amount of scrap from each corner of the laminate was measured. The maximum value is shown in Table 1.
【００２２】[0022]
【表１】 [Table 1]
【００２３】表１にみられるように、基材１の付着水分
量、有機溶剤２や樹脂ワニス３の含有水分量を規定する
ことによって、基材１への樹脂ワニス３の含浸性を高め
て樹脂含浸基材の気泡の数を低減することができると共
に、積層板のカスレ量を低減できることが確認される。As shown in Table 1, the amount of water adhering to the substrate 1 and the amount of water contained in the organic solvent 2 and the resin varnish 3 are regulated to improve the impregnation of the resin varnish 3 into the substrate 1. It is confirmed that the number of air bubbles in the resin-impregnated base material can be reduced, and the amount of thinning of the laminate can be reduced.
【００２４】[0024]
【００２５】[0025]
【発明の効果】 上記のように 請求項１の発明は、基材に
減圧脱泡された有機溶剤を予備含浸させ、次いでこの基
材に含有水分量が３重量％以下の樹脂ワニスを含浸させ
た後、乾燥するようにしたので、含浸させる樹脂ワニス
に含有される水分の影響によって気泡が残留することを
低減することができ、基材への樹脂の含浸性が良好な樹
脂含浸基材を安定して得ることができるものである。 As described above, according to the first aspect of the present invention, a substrate is pre-impregnated with an organic solvent degassed under reduced pressure, and then the resin varnish having a water content of 3% by weight or less is impregnated in the substrate. After drying, it is possible to reduce bubbles remaining due to the effect of moisture contained in the resin varnish to be impregnated. It can be obtained stably.
【００２６】また請求項２の発明は、基材に含有水分量
が３重量％以下の減圧脱泡された有機溶剤を予備含浸さ
せ、次いでこの基材に含有水分量が３重量％以下の樹脂
ワニスを含浸させた後、乾燥するようにしたので、予備
含浸させる有機溶剤や含浸させる樹脂ワニスに含有され
る水分の影響によって気泡が残留することを低減するこ
とができ、基材への樹脂の含浸性が良好な樹脂含浸基材
を安定して得ることができるものである。According to a second aspect of the present invention, a base material is pre-impregnated with an organic solvent having a water content of 3% by weight or less and degassed under reduced pressure. After being impregnated with the varnish, the drying is performed, so that the bubbles remaining due to the influence of the organic solvent to be pre-impregnated and the moisture contained in the resin varnish to be impregnated can be reduced, and the resin to the base material can be reduced. A resin-impregnated base material having good impregnation properties can be stably obtained.
【００２７】また、基材として付着水分量が０．５重量
％以下のものを用いるようにするのが好ましく、基材に
含有される水分の影響によって気泡が残留することを低
減することができ、基材への樹脂の含浸性が良好な樹脂
含浸基材を安定して得ることができるものである。ま
た、有機溶剤や樹脂ワニスを含浸する工程の雰囲気を水
蒸気分圧が１５ｍｍＨｇ以下に調整するのが好ましく、
基材や有機溶剤や樹脂ワニスに対する雰囲気中の水分の
影響を小さくすることができ、長時間連続生産しても安
定して含浸性の良好な状態を維持することができるもの
である。[0027] Also, it adhered water content as the base material is reduced that it is preferable to so use of 0.5 wt% or less, air bubbles under the influence of water contained in the base material remains It is possible to stably obtain a resin-impregnated base material having a good resin impregnation property to the base material. Ma
Further, it is preferable to adjust the atmosphere of the step of impregnating the organic solvent or the resin varnish with a partial pressure of water vapor of 15 mmHg or less,
The effect of moisture in the atmosphere on the base material, the organic solvent, and the resin varnish can be reduced, and the good impregnating state can be stably maintained even after continuous production for a long time.
【図１】本発明の実施の形態の一例の概略図である。FIG. 1 is a schematic diagram of an example of an embodiment of the present invention.
１ 基材 ２ 有機溶剤 ３ 樹脂ワニス ４ 含浸工程 1 base material 2 organic solvent 3 resin varnish 4 impregnation process
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭63−175032（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) B29B 11/14 - 11/16 B29B 15/08 - 15/14 C08J 5/04 - 5/10 C08J 5/24 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-175032 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) B29B 11/14-11/16 B29B 15 / 08-15/14 C08J 5/04-5/10 C08J 5/24
Claims (2)
浸させ、次いでこの基材に含有水分量が３重量％以下の
樹脂ワニスを含浸させた後、乾燥することを特徴とする
樹脂含浸基材の製造方法。1. A organic solvent that is reduced degassing the substrate preimpregnated, then after water content was impregnated with 3 wt% or less <br/> resin varnish to the substrate, and dried A method for producing a resin-impregnated substrate, characterized by the following.
脱泡された有機溶剤を予備含浸させ、次いでこの基材に
含有水分量が３重量％以下の樹脂ワニスを含浸させた
後、乾燥することを特徴とする樹脂含浸基材の製造方
法。2. A is an organic solvent preimpregnated the water content is 3 wt% or less of the vacuum degassing the substrate, and then after the water content in this substrate was impregnated with 3 wt% or less of the resin varnish And drying the resin-impregnated substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10648497A JP3330055B2 (en) | 1997-04-23 | 1997-04-23 | Method for producing resin-impregnated base material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10648497A JP3330055B2 (en) | 1997-04-23 | 1997-04-23 | Method for producing resin-impregnated base material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10296725A JPH10296725A (en) | 1998-11-10 |
| JP3330055B2 true JP3330055B2 (en) | 2002-09-30 |
Family
ID=14434757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10648497A Expired - Lifetime JP3330055B2 (en) | 1997-04-23 | 1997-04-23 | Method for producing resin-impregnated base material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3330055B2 (en) |
-
1997
- 1997-04-23 JP JP10648497A patent/JP3330055B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10296725A (en) | 1998-11-10 |
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