JPH0858018A - Laminated sheet - Google Patents
Laminated sheetInfo
- Publication number
- JPH0858018A JPH0858018A JP19390294A JP19390294A JPH0858018A JP H0858018 A JPH0858018 A JP H0858018A JP 19390294 A JP19390294 A JP 19390294A JP 19390294 A JP19390294 A JP 19390294A JP H0858018 A JPH0858018 A JP H0858018A
- Authority
- JP
- Japan
- Prior art keywords
- antistatic agent
- base material
- resin
- insulating layer
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002216 antistatic agent Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000011889 copper foil Substances 0.000 claims abstract description 12
- 239000000835 fiber Substances 0.000 claims abstract description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 8
- 230000005611 electricity Effects 0.000 abstract description 13
- 230000003068 static effect Effects 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 11
- 239000002966 varnish Substances 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 2
- 239000011521 glass Substances 0.000 description 18
- -1 anionic alkyl phosphate ester salts Chemical class 0.000 description 7
- 239000011888 foil Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- HHWADTQVDUQGSB-UHFFFAOYSA-N 2-[bis(2-hydroxyethyl)amino]ethanol;octadecyl dihydrogen phosphate Chemical compound OCCN(CCO)CCO.CCCCCCCCCCCCCCCCCCOP(O)(O)=O HHWADTQVDUQGSB-UHFFFAOYSA-N 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000002759 woven fabric Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- LNNBVLIFDNQXCL-KVVVOXFISA-N 2-[bis(2-hydroxyethyl)amino]ethanol [(Z)-octadec-9-enyl] dihydrogen phosphate Chemical compound OCCN(CCO)CCO.CCCCCCCC\C=C/CCCCCCCCOP(O)(O)=O LNNBVLIFDNQXCL-KVVVOXFISA-N 0.000 description 1
- BIHQJMSIEXRWPS-UHFFFAOYSA-N 2-[bis(2-hydroxyethyl)amino]ethanol;dodecyl dihydrogen phosphate Chemical compound OCCN(CCO)CCO.CCCCCCCCCCCCOP(O)(O)=O BIHQJMSIEXRWPS-UHFFFAOYSA-N 0.000 description 1
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical class OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- XFWJKVMFIVXPKK-UHFFFAOYSA-N calcium;oxido(oxo)alumane Chemical compound [Ca+2].[O-][Al]=O.[O-][Al]=O XFWJKVMFIVXPKK-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002169 ethanolamines Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はプリント配線板に用いら
れる積層板、特に、絶縁層の片面に銅はく層がある片面
銅張積層板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminate used for a printed wiring board, and more particularly to a single-sided copper clad laminate having a copper foil layer on one side of an insulating layer.
【0002】[0002]
【従来の技術】片面銅張積層板は、ガラス系繊維基材
や、セルロース系繊維基材に熱硬化性樹脂ワニスを含
浸、乾燥して得られたプリプレグを、1枚ないし複数枚
重ね合わせ片面に銅はくを配置し、他の面に、プリプレ
グと接着性がないプラスチックフィルム又はプリプレグ
と接着性がない金属はく(アルミニウムはく、銅はくな
ど)のような離形材料を配置し、加熱加圧して製造され
ている。2. Description of the Related Art A single-sided copper-clad laminate is a single-sided laminate of one or more prepregs obtained by impregnating a glass fiber base material or a cellulosic fiber base material with a thermosetting resin varnish and drying. Place the copper foil on the other side, and on the other side, place a release film such as a plastic film that does not adhere to the prepreg or a metal foil that does not adhere to the prepreg (aluminum foil, copper foil, etc.). It is manufactured by heating and pressing.
【0003】板厚が0.8mm以下の薄い片面銅張積層
板については、離形材料を間に挟んでプリプレグを重
ね、両側に銅はくを配置して加熱加圧することにより、
2枚同時に製造する方法も実施されている。For a thin single-sided copper-clad laminate having a thickness of 0.8 mm or less, a release material is sandwiched between prepregs, copper foils are arranged on both sides, and heat and pressure are applied.
A method of manufacturing two sheets at the same time is also practiced.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うにして得られた片面銅張積層板は、静電気の発生が著
しく、特に絶縁層が、ガラス系繊維基材とエポキシ樹脂
よりなる片面銅張積層板は、積層板のハンドリングの際
に、静電気による衝撃が手先に伝わり、作業しずらい。
またプリント板に加工するため、1枚づつ印刷ラインに
投入する際に、静電気による吸着のために、複数枚同時
に投入されてしまうことがあった。However, the one-sided copper-clad laminate obtained in this manner has a remarkable occurrence of static electricity, and in particular, the insulating layer is a one-sided copper-clad laminate made of a glass fiber base material and an epoxy resin. When handling laminated plates, the impact of static electricity is transmitted to the hands when handling laminated plates, making it difficult to work.
Further, in order to process the printed board, when one by one is put in the printing line, a plurality of sheets may be put in at the same time because of electrostatic attraction.
【0005】静電気の発生は、片面銅張積層板において
最も著しく、銅はくのない積層板においても、若干見ら
れるが、両面銅張積層板では、ほとんど見られない。本
発明は、片面銅張積層板又は銅はくのない積層板の静電
気発生を防止することを目的とするものである。The generation of static electricity is most remarkable in the single-sided copper-clad laminate, and is slightly observed in the laminate without copper foil, but it is hardly seen in the double-sided copper-clad laminate. The present invention aims to prevent static electricity from being generated in a single-sided copper-clad laminate or a copper foil-free laminate.
【0006】[0006]
【課題を解決するための手段】本発明は、繊維基材と熱
硬化性樹脂からなる絶縁層中に、帯電防止剤を含ませた
こと特徴とする。The present invention is characterized in that an antistatic agent is contained in an insulating layer composed of a fiber base material and a thermosetting resin.
【0007】本発明で用いる熱硬化性樹脂としては、フ
ェノール樹脂、エポキシ樹脂、ポリイミド樹脂、不飽和
ポリエステル樹脂、ビニルエステル樹脂、メラミン樹脂
などがあり、これらを単独あるいは2種以上併用しても
よい。The thermosetting resin used in the present invention includes phenol resin, epoxy resin, polyimide resin, unsaturated polyester resin, vinyl ester resin, melamine resin, etc. These may be used alone or in combination of two or more kinds. .
【0008】またこれらの樹脂に必要により、公知のリ
ン系、アンチモン系の難燃剤やクレー、タルク、水酸化
アルミニウム、ワラストナイト、シリカ、ガラス粉、水
酸化マグネシウム、アルミナ、カルシウムアルミネー
ト、炭酸カルシウム等の無機充填剤などを添加する。If necessary, these known resins include known phosphorus-based and antimony-based flame retardants, clay, talc, aluminum hydroxide, wollastonite, silica, glass powder, magnesium hydroxide, alumina, calcium aluminate, carbonic acid. An inorganic filler such as calcium is added.
【0009】本発明で用いる繊維基材としては、Eガラ
ス、Cガラス、Dガラス、Sガラスなどのガラス長繊維
を使用したガラス織布、Eガラス、Cガラス、Dガラ
ス、Sガラスなどのガラス短繊維を有機バインダーで接
着したガラス不織布、セルロース系繊維や有機繊維より
なる紙基材があげられる。これらの繊維基材は、単独
で、又は、ガラス織布とガラス不織布、ガラス織布と紙
基材のように組み合わせて使用される。The fiber base material used in the present invention is a glass woven fabric using long glass fibers such as E glass, C glass, D glass and S glass, and glass such as E glass, C glass, D glass and S glass. Examples thereof include a glass non-woven fabric in which short fibers are bonded with an organic binder, and a paper base made of cellulosic fibers or organic fibers. These fiber substrates are used alone or in combination such as glass woven fabric and glass nonwoven fabric, or glass woven fabric and paper substrate.
【0010】帯電防止剤としては、非イオン系、アニオ
ン系、カチオン系、両性系の界面活性剤が使用される
が、その中でも、アニオン系の、アルキルリン酸エステ
ル塩、アルキルエーテルリン酸塩、アルキルアリルエー
テルリン酸塩が耐熱性に優れ好ましい。As the antistatic agent, nonionic, anionic, cationic or amphoteric surfactants are used. Among them, anionic alkyl phosphate ester salts, alkyl ether phosphate salts, Alkyl allyl ether phosphate is preferable because of its excellent heat resistance.
【0011】具体的な化合物としては、モノステアリル
リン酸エステルトリエタノールアミン塩、モノオレイル
リン酸エステルトリエタノールアミン塩、モノラウリル
リン酸エステルトリエタノールアミン塩、モノアセチル
アルコールエチレンオキサイドリン酸エステルトリエタ
ノールアミン塩、モノノニルフェノールエチレンオキサ
イドリン酸エステルトリエタノールアミン塩等があげら
れ、これらは単独もしくは2種以上併用して使用するこ
とができる。Specific compounds include monostearyl phosphate triethanolamine salt, monooleyl phosphate triethanolamine salt, monolauryl phosphate triethanolamine salt, monoacetyl alcohol ethylene oxide phosphate triethanol amine. Examples thereof include amine salts and monononylphenol ethylene oxide phosphoric acid ester triethanolamine salts, which can be used alone or in combination of two or more kinds.
【0012】絶縁層中に、帯電防止剤を含ませる方法と
しては、帯電防止剤を熱硬化性樹脂ワニスに混合して基
材に含浸する方法、離形材料の表面に帯電防止剤を塗布
しておき、プリプレグを加熱加圧する際に、離形材料表
面から樹脂中に拡散させる方法、繊維基材の表面に塗布
しておき、成形加工中に樹脂中に拡散していくようにす
る方法がある。これらの方法は併用してもよい。帯電防
止剤の含有量は、0.01〜5重量%が好ましく、0.
01%未満であると静電気防止の効果が少なく、5%を
越えると表面抵抗を著しく低下させ好ましくない。As a method of incorporating an antistatic agent into the insulating layer, a method of mixing the antistatic agent with a thermosetting resin varnish to impregnate the base material, or applying an antistatic agent to the surface of the release material is used. In addition, when heating and pressing the prepreg, a method of diffusing into the resin from the surface of the release material, a method of applying it to the surface of the fiber base material and diffusing into the resin during the molding process are available. is there. You may use these methods together. The content of the antistatic agent is preferably 0.01 to 5% by weight,
If it is less than 01%, the effect of preventing static electricity is small, and if it exceeds 5%, the surface resistance is remarkably reduced, which is not preferable.
【0013】帯電防止剤は、絶縁層全体に含ませる必要
はない。例えば、片面銅張積層板の場合は、銅はくのな
い面に位置するプリプレグに帯電防止剤を含むようにし
ておけばよい。The antistatic agent need not be included in the entire insulating layer. For example, in the case of a single-sided copper-clad laminate, an antistatic agent may be included in the prepreg located on the surface without copper foil.
【0014】[0014]
【作用】絶縁層中に帯電防止剤を含むため、ハンドリン
グの際に発生する静電気が容易に放散され帯電しなくな
る。Since the insulating layer contains the antistatic agent, the static electricity generated during handling is easily dissipated and the static electricity is not applied.
【0015】[0015]
実施例1 ブロム化エポキシ樹脂(エポキシ当量470g/eq)
100部(重量部 以下同じ)、ジシアンジアミド3
部、2−エチル−4−メチルイミダゾール0.17部、
2−メトキシエタノール25部、N,Nジメチルホルム
アミド25部、モノステアリルリン酸エステルトリエタ
ノールアミン塩0.3部を混合し含浸用樹脂ワニスを調
製した。Example 1 Brominated epoxy resin (epoxy equivalent 470 g / eq)
100 parts (weight part the same below), dicyandiamide 3
Parts, 2-ethyl-4-methylimidazole 0.17 parts,
A resin varnish for impregnation was prepared by mixing 25 parts of 2-methoxyethanol, 25 parts of N, N dimethylformamide and 0.3 part of monostearyl phosphate triethanolamine salt.
【0016】これをガラス織布(厚さ0.2mm、坪量
210g/m2 )に樹脂分が40重量%になるように含
浸、乾燥してプリプレグ(これをプリプレグAとする)
を得た。A glass woven fabric (thickness: 0.2 mm, basis weight: 210 g / m 2 ) was impregnated with this so that the resin content was 40% by weight, and dried to obtain a prepreg (this is referred to as prepreg A).
I got
【0017】プリプレグAを3枚重ね合わせ、片面に厚
さ35μmの電解銅はくを配置し、他の面に、厚さ20
μmの離形用アルミニウムはくを配置し、温度170
℃、圧力4MPaで30分プレス成形して、厚さ0.6
mmの片面銅張積層板を得た。Three prepregs A are superposed, an electrolytic copper foil having a thickness of 35 μm is arranged on one surface, and a thickness of 20 is formed on the other surface.
A release aluminum foil of μm is placed and the temperature is 170
Press-molded at ℃, pressure 4MPa for 30 minutes, thickness 0.6
A single-sided copper clad laminate having a size of mm was obtained.
【0018】得られた片面銅張積層板300枚を、自動
移載装置により1枚1枚移載したところ、移載中に複数
枚を同時に吸着することがなく、また、ハンドリング中
に静電気を発生することもなかった。When 300 sheets of the obtained single-sided copper-clad laminate were transferred one by one by an automatic transfer device, a plurality of sheets were not adsorbed at the same time during transfer, and static electricity was generated during handling. It never happened.
【0019】実施例2 モノステアリルリン酸エステルトリエタノールアミン塩
4部をメチルエチルケトン100部に溶解し、ガラス織
布(厚さ0.2mm、坪量210g/m2 )に、モノス
テアリルリン酸エステルトリエタノールアミン塩の付着
量が0.2重量%となるように塗布乾燥した。Example 2 Monostearyl phosphate triethanolamine 4 parts was dissolved in 100 parts of methyl ethyl ketone, and a glass woven cloth (thickness 0.2 mm, basis weight 210 g / m 2 ) was prepared. The ethanolamine salt was applied and dried so that the amount attached was 0.2% by weight.
【0020】ブロム化エポキシ樹脂(エポキシ当量47
0g/eq)100部(重量部、以下同じ)、ジシアン
ジアミド3部、2−エチル−4−メチルイミダゾール
0.17部、2−メトキシエタノール25部、N,Nジ
メチルホルムアミド25部、を混合し含浸用樹脂ワニス
を調製し、モノステアリルリン酸エステルトリエタノー
ルアミン塩を塗布したガラス織布に、樹脂分が40重量
%になるように含浸、乾燥してプリプレグ(これをプリ
プレグBとする)を得た。Brominated epoxy resin (epoxy equivalent 47
0 g / eq) 100 parts (parts by weight, the same applies hereinafter), 3 parts of dicyandiamide, 0.17 parts of 2-ethyl-4-methylimidazole, 25 parts of 2-methoxyethanol, 25 parts of N, N dimethylformamide are mixed and impregnated. Resin varnish was prepared and impregnated on a glass woven cloth coated with monostearyl phosphate ester triethanolamine salt so that the resin content was 40% by weight and dried to obtain a prepreg (this is referred to as prepreg B). It was
【0021】厚さ20μmの離形用アルミニウムはく、
プリプレグA1枚、プリプレグB2枚、厚さ35μmの
電解銅はくの順に重ね合わせ、以下実施例1と同様にし
て、厚さ0.6mmの片面銅張積層板を得た。20 μm thick release aluminum foil,
One piece of prepreg A, two pieces of prepreg B, and electrolytic copper foil having a thickness of 35 μm were laminated in this order, and a single-sided copper-clad laminate having a thickness of 0.6 mm was obtained in the same manner as in Example 1.
【0022】得られた片面銅張積層板300枚を、自動
移載装置により1枚1枚移載したところ、移載中に複数
枚を同時に吸着することがなく、また、ハンドリング中
に静電気を発生することもなかった。When 300 sheets of the obtained single-sided copper-clad laminate were transferred one by one by an automatic transfer device, a plurality of sheets were not adsorbed at the same time during transfer and static electricity was generated during handling. It never happened.
【0023】実施例3 モノステアリルリン酸エステルトリエタノールアミン塩
4部をメチルエチルケトン100部に溶解し、厚さ20
μmの離形用アルミニウムはくに、モノステアリルリン
酸エステルトリエタノールアミン塩の付着量が0.2重
量%となるように塗布乾燥した。Example 3 4 parts of monostearyl phosphate triethanolamine salt was dissolved in 100 parts of methyl ethyl ketone to give a thickness of 20.
An aluminum foil for release having a thickness of μm was coated and dried so that the amount of the monostearyl phosphate ester triethanolamine salt attached was 0.2% by weight.
【0024】モノステアリルリン酸エステルトリエタノ
ールアミン塩の塗布面がプリプレグ側になるようにし
て、離形用アルミニウムはく、プリプレグB、厚さ35
μmの電解銅はくの順に重ね合わせ、以下実施例1と同
様にして、厚さ0.6mmの片面銅張積層板を得た。With the coating surface of the monostearyl phosphate triethanolamine salt facing the prepreg side, a release aluminum foil, prepreg B, thickness 35
The electrolytic copper foils having a thickness of μm were stacked in this order, and a single-sided copper-clad laminate having a thickness of 0.6 mm was obtained in the same manner as in Example 1.
【0025】得られた片面銅張積層板300枚を、自動
移載装置により1枚1枚移載したところ、移載中に複数
枚を同時に吸着することがなく、また、ハンドリング中
に静電気を発生することもなかった。When 300 sheets of the obtained single-sided copper-clad laminate were transferred one by one by an automatic transfer device, a plurality of sheets were not adsorbed at the same time during transfer, and static electricity was generated during handling. It never happened.
【0026】比較例 プリプレグBを3枚重ね合わせ、片面に厚さ35μmの
電解銅はくを配置し、他の面に、厚さ20μmの離形用
アルミニウムはくを配置し、温度170℃、圧力4MP
aで30分プレス成形して、厚さ0.6mmの片面銅張
積層板を得た。Comparative Example Three prepregs B were superposed, an electrolytic copper foil having a thickness of 35 μm was arranged on one surface, and a release aluminum foil having a thickness of 20 μm was arranged on the other surface at a temperature of 170 ° C. Pressure 4MP
It was press molded with a for 30 minutes to obtain a single-sided copper-clad laminate having a thickness of 0.6 mm.
【0027】得られた片面銅張積層板300枚を、自動
移載装置により1枚1枚移載したところ、移載中に複数
枚を同時吸着が10回発生した。When 300 sheets of the obtained single-sided copper-clad laminate were transferred one by one by an automatic transfer device, a plurality of sheets were simultaneously adsorbed 10 times during the transfer.
【0028】[0028]
【発明の効果】繊維基材と熱硬化性樹脂からなる絶縁層
中に、帯電防止剤を含ませたので、ハンドリング中に発
生した静電気は放散され、作業者に不快な衝撃を与える
こともなく、また、2枚以上が静電気により互いに吸着
することもなくなった。As the antistatic agent is contained in the insulating layer made of the fiber base material and the thermosetting resin, the static electricity generated during the handling is dissipated without giving an unpleasant impact to the operator. Also, two or more sheets no longer stick to each other due to static electricity.
Claims (2)
中に、帯電防止剤を含ませたこと特徴とする積層板。1. A laminate comprising an insulating layer made of a fiber base material and a thermosetting resin containing an antistatic agent.
層を有することを特徴とする片面銅張積層板。2. A single-sided copper-clad laminate having a copper foil layer on one surface of the insulating layer according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19390294A JPH0858018A (en) | 1994-08-18 | 1994-08-18 | Laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19390294A JPH0858018A (en) | 1994-08-18 | 1994-08-18 | Laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0858018A true JPH0858018A (en) | 1996-03-05 |
Family
ID=16315648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19390294A Pending JPH0858018A (en) | 1994-08-18 | 1994-08-18 | Laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0858018A (en) |
-
1994
- 1994-08-18 JP JP19390294A patent/JPH0858018A/en active Pending
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