JPH07216112A - Preparation of aramid fiber-based laminated sheet - Google Patents
Preparation of aramid fiber-based laminated sheetInfo
- Publication number
- JPH07216112A JPH07216112A JP913994A JP913994A JPH07216112A JP H07216112 A JPH07216112 A JP H07216112A JP 913994 A JP913994 A JP 913994A JP 913994 A JP913994 A JP 913994A JP H07216112 A JPH07216112 A JP H07216112A
- Authority
- JP
- Japan
- Prior art keywords
- water
- aramid fiber
- soluble
- resin
- varnish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、アラミド繊維を基材と
する積層板の製造方法に関するものである。本発明によ
って、吸湿後の耐熱性が少ないアラミド繊維を基材とす
る積層板を得ることができる。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a laminated board having an aramid fiber as a base material. According to the present invention, it is possible to obtain a laminated board having aramid fibers as a base material, which has low heat resistance after absorbing moisture.
【０００２】[0002]
【従来の技術】プリント配線板の基板材料に要求される
諸特性の中でも面方向の熱膨張係数が小さいこと、寸法
安定性が良好なことが特に要求されるようになった。こ
れは、電子部品が小型化し高集積化するのに伴い、プリ
ント配線板上への部品実装も高密度化しているためであ
る。従来から広く使用されている、紙基材、ガラス繊維
基材（織布又は不織布）の熱硬化性樹脂積層板では、面
方向の熱膨張係数が大きく、寸法安定性もよくない。そ
こで、負の熱膨張係数を持つアラミド繊維を基材とす
る、熱硬化性樹脂積層板が提案されている。この積層板
は、熱膨張係数が小さく寸法安定性も良好である。2. Description of the Related Art Among the various characteristics required for a substrate material of a printed wiring board, it has been particularly required that the coefficient of thermal expansion in the plane direction be small and that the dimensional stability be good. This is because, as electronic components are downsized and highly integrated, the density of components mounted on a printed wiring board is also increased. Conventionally widely used paper-based or glass fiber-based (woven or non-woven) thermosetting resin laminates have a large coefficient of thermal expansion in the plane direction and poor dimensional stability. Then, the thermosetting resin laminated board which uses aramid fiber which has a negative thermal expansion coefficient as a base material is proposed. This laminate has a small thermal expansion coefficient and good dimensional stability.
【０００３】アラミド繊維を基材とする、熱硬化性樹脂
積層板は、アラミド繊維の織布又は不織布に、熱硬化性
樹脂ワニスを含浸乾燥してプリプレグとし、このプリプ
レグを所定枚数重ねて、加熱加圧して製造される。アラ
ミド繊維基材と樹脂との親和性をよくするため、アラミ
ド繊維又はアラミド繊維の織布、不織布にシランカップ
リング剤で表面処理をしたり、不織布を作る際に使用す
るバインダにエポキシ系樹脂が主成分であるものを用い
たり、加熱加圧を真空条件下で行ったりすることが知ら
れている。A thermosetting resin laminated board using aramid fibers as a base material is obtained by impregnating a woven or non-woven fabric of aramid fibers with a thermosetting resin varnish and drying it into a prepreg. It is manufactured under pressure. In order to improve the affinity between the aramid fiber base material and the resin, the aramid fiber or aramid fiber woven or non-woven fabric is surface-treated with a silane coupling agent, or the epoxy resin is used as the binder when making the non-woven fabric. It is known to use the main component or to heat and pressurize under vacuum conditions.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、基材に
アラミド繊維を用いた熱硬化性樹脂積層板には、このよ
うな処理を行っても、吸湿処理後にはんだ耐熱性が悪く
なるという積層板としては大きな欠点がある。本発明
は、吸湿処理後もはんだ耐熱性が悪くならない、アラミ
ド繊維基材積層板を得ることができる製造方法を提供す
るものである。However, a thermosetting resin laminated board using aramid fibers as a base material is a laminated board in which solder heat resistance deteriorates even after such a treatment after moisture absorption treatment. Has a major drawback. The present invention provides a manufacturing method capable of obtaining an aramid fiber base material laminated plate in which solder heat resistance does not deteriorate even after a moisture absorption treatment.
【０００５】[0005]
【課題を解決するための手段】本発明は、アラミド繊維
基材に、水溶性の熱硬化性樹脂ワニスを含浸した後熱硬
化性樹脂ワニスを含浸してプリプレグとし、このプリプ
レグを所定枚数重ねて加熱加圧することを特徴とするア
ラミド繊維基材積層板の製造方法である。According to the present invention, an aramid fiber base material is impregnated with a water-soluble thermosetting resin varnish and then with a thermosetting resin varnish to form a prepreg. It is a method for producing an aramid fiber base material laminate, which comprises heating and pressing.
【０００６】本発明者は、基材にアラミド織布又は不織
布を用いた熱硬化性樹脂積層板の吸湿後のはんだ耐熱不
良の発生原因について研究した結果、アラミド織布又は
不織布への熱硬化性樹脂の含浸性と、アラミド繊維と使
用した熱硬化性樹脂との親和性がよくないことに、その
原因があることを見出した。そして、この課題は、アラ
ミド織布又は不織布を用いたプリプレグの作成工程にお
いて、水溶性の熱硬化性樹脂ワニスを含浸した後（含浸
工程１）、熱硬化性樹脂ワニスを含浸する（含浸工程
２）ことで解決することがわかった。The present inventor has studied the cause of occurrence of poor solder heat resistance after moisture absorption of a thermosetting resin laminate using an aramid woven fabric or a non-woven fabric as a base material, and found that the aramid woven fabric or the non-woven fabric has a thermosetting property. It has been found that the reason is that the impregnating property of the resin and the affinity between the aramid fiber and the thermosetting resin used are not good. Then, this problem is that in the step of forming a prepreg using an aramid woven fabric or a non-woven fabric, after impregnating the water-soluble thermosetting resin varnish (impregnation step 1), impregnating the thermosetting resin varnish (impregnation step 2 I found out that it could be solved.
【０００７】水溶性の熱硬化性樹脂としては、水溶性フ
ェノール樹脂、水溶性メラミン樹脂又は水溶性エポキシ
樹脂が挙げられ、これらは、単独で又は混合して用いら
れる。Examples of the water-soluble thermosetting resin include water-soluble phenol resin, water-soluble melamine resin and water-soluble epoxy resin, which may be used alone or in combination.
【０００８】含浸工程１では、アラミド織布又は不織布
に処理ワニスを十分に含浸させるため、処理ワニス中の
水溶性熱硬化性樹脂の樹脂分の量は、少ないほうがよ
い。しかし、少なすぎると、アラミド繊維と含浸工程２
で含浸する熱硬化性樹脂との親和性向上の効果が少な
い。したがって、水溶性熱硬化性樹脂の樹脂分は５〜４
０重量％であるのが好ましい。またアラミド繊維自身へ
のシランカップリング処理を行っても効果があまり見ら
れないが、カップリング処理後、含浸工程１を行うとよ
り効果的である。In the impregnation step 1, the amount of the water-soluble thermosetting resin in the treated varnish should be small in order to sufficiently impregnate the aramid woven fabric or nonwoven fabric with the treated varnish. However, if too little, aramid fiber and impregnation step 2
The effect of improving the affinity with the thermosetting resin impregnated with is small. Therefore, the resin content of the water-soluble thermosetting resin is 5 to 4
It is preferably 0% by weight. Further, the silane coupling treatment on the aramid fiber itself does not show much effect, but it is more effective if the impregnation step 1 is performed after the coupling treatment.
【０００９】[0009]
【作用】アラミド繊維は吸湿性が高いことが知られてい
るが、これはアラミド繊維が水と親和性が高いことを示
している。従って含浸工程１で水溶性の熱硬化性樹脂を
仲立ちとすることにより、アラミド繊維と熱硬化性樹脂
との親和性がよくなり、樹脂とアラミド繊維とが密着す
るので、吸湿し難くなり、吸湿処理後もはんだ耐熱性が
悪くならない。また、処理ワニスはアラミド織布又は不
織布に十分含浸させる必要があり、そのため低樹脂分
（５〜４０％）の水溶性熱硬化性樹脂からなる処理ワニ
スを用いる。The aramid fiber is known to have a high hygroscopicity, which indicates that the aramid fiber has a high affinity with water. Therefore, by interposing the water-soluble thermosetting resin in the impregnation step 1, the affinity between the aramid fiber and the thermosetting resin is improved, and the resin and the aramid fiber are in close contact with each other, so that it becomes difficult to absorb moisture and absorbs moisture. Solder heat resistance does not deteriorate after processing. Further, the treated varnish needs to be sufficiently impregnated with an aramid woven fabric or a non-woven fabric, and therefore a treated varnish made of a water-soluble thermosetting resin having a low resin content (5 to 40%) is used.
【００１０】[0010]
実施例１ 樹脂分５０％の水溶性エポキシ樹脂１００部（重量部
以下同じ）、水７８部及びメタノール９２部を混合し
た。このワニス（以下処理ワニスという）の水溶性エポ
キシの樹脂分は１７％であった。この処理ワニスをアラ
ミド不織布（坪量６０ｇ／ｍ2 ）に含浸し、１５５〜１
６５℃で５〜１０分間乾燥した。Example 1 100 parts of water-soluble epoxy resin having a resin content of 50% (parts by weight)
The same shall apply hereinafter), 78 parts of water and 92 parts of methanol were mixed. The resin content of the water-soluble epoxy in this varnish (hereinafter referred to as the treated varnish) was 17%. An aramid non-woven fabric (basis weight 60 g / m 2 ) was impregnated with this treated varnish to give 155 to 1
It was dried at 65 ° C. for 5 to 10 minutes.
【００１１】これに通常のエポキシ樹脂ワニスを含浸
し、乾燥してエポキシ樹脂の樹脂分５０％のアラミド不
織布プリプレグを得た。このプリプレグを重ね、その上
下両面に厚さ３５μｍの銅はくをを載置し、鏡板を介し
て、１３３３〜８０００Ｐａの減圧下、１７５℃で６０
分、３ＭＰａで加熱加圧して、両面銅張り積層板を得
た。This was impregnated with an ordinary epoxy resin varnish and dried to obtain an aramid nonwoven fabric prepreg having an epoxy resin content of 50%. This prepreg is overlaid, copper foil with a thickness of 35 μm is placed on the upper and lower surfaces thereof, and the pressure is reduced at 175 ° C. under a reduced pressure of 1333-8000 Pa through a mirror plate to 60 ° C.
A pressure was applied at 3 MPa for 3 minutes to obtain a double-sided copper-clad laminate.
【００１２】実施例２ アラミド不織布（坪量６０ｇ／ｍ2 ）にオルガノシラン
系のカップリング剤５％水溶液を含浸し、１５０℃で５
〜１０分間乾燥した。次に実施例１で用いたものと同じ
処理ワニスを含浸し、１５５〜１６５℃で５〜１０分間
乾燥した。以下実施例１と同様にして両面銅張り積層板
を得た。Example 2 An aramid non-woven fabric (basis weight: 60 g / m 2 ) was impregnated with a 5% aqueous solution of an organosilane coupling agent, and the mixture was treated at 150 ° C.
Dry for -10 minutes. Then, the same treated varnish used in Example 1 was impregnated and dried at 155 to 165 ° C. for 5 to 10 minutes. Then, a double-sided copper-clad laminate was obtained in the same manner as in Example 1.
【００１３】実施例３ 水溶性フェノール及びメラミン樹脂の混合樹脂（樹脂分
５０％）１００部、水２１部及びメタノール５０部を混
合した。水溶性フェノール及びメラミン樹脂の混合樹脂
の樹脂分は２０％であった。この処理ワニスをアラミド
不織布（坪量６０ｇ／ｍ2 ）に含浸し、１５５〜１６５
℃で５〜１０分間乾燥した。以下実施例１と同様にして
両面銅張り積層板を得た。Example 3 100 parts of a mixed resin of water-soluble phenol and melamine resin (resin content 50%), 21 parts of water and 50 parts of methanol were mixed. The resin content of the mixed resin of water-soluble phenol and melamine resin was 20%. An aramid non-woven fabric (basis weight 60 g / m 2 ) was impregnated with this treated varnish to give 155-165.
Dry at 5 ° C for 5-10 minutes. Then, a double-sided copper-clad laminate was obtained in the same manner as in Example 1.
【００１４】比較例 アラミド不織布（坪量６０ｇ／ｍ2 ）に、通常のエポキ
シ樹脂を直接含浸して乾燥し、アラミド不織布プリプレ
グ（エポキシ樹脂の樹脂分５０％）を得た。以下実施例
１と同様にして両面銅張り積層板を得た。Comparative Example An aramid nonwoven fabric (basis weight: 60 g / m 2 ) was directly impregnated with an ordinary epoxy resin and dried to obtain an aramid nonwoven fabric prepreg (resin content of epoxy resin: 50%). Then, a double-sided copper-clad laminate was obtained in the same manner as in Example 1.
【００１５】実施例１、実施例２及び実施例３並びに比
較例で得られた両面銅張り積層板を全面エッチングして
銅はくお除き、５０ｍｍ平方に切断した。この試験片
を、煮沸水中に浸漬した後、２６０℃のはんだ槽中に２
０秒間浸して、外観を目視で観察した。その結果を表１
に示す。表中、○はふくれ発生がないことを、また、×
はふくれ発生があることを示している。The double-sided copper-clad laminates obtained in Example 1, Example 2 and Example 3 and Comparative Example were entirely etched to remove copper foil and cut into 50 mm squares. The test piece was immersed in boiling water and then placed in a solder bath at 260 ° C.
After soaking for 0 second, the appearance was visually observed. The results are shown in Table 1.
Shown in. In the table, ○ means no blister, and ×
Indicates that swelling has occurred.
【００１６】[0016]
【表１】 [Table 1]
【００１７】この表から、アラミド繊維をシラン処理し
た実施例２のものは、長時間の煮沸処理後も耐熱性が劣
化していないことが分かる。また、実施例１のものは、
５時間、実施例３のものは３時間の煮沸によっても吸湿
しておらず、問題なく実用できるのにたいし、比較例の
ものは、１時間の煮沸処理にも耐えず、実用できないこ
とが分かる。From this table, it can be seen that the silane-treated aramid fibers of Example 2 did not deteriorate in heat resistance after boiling for a long time. In addition, in the first embodiment,
5 hours, Example 3 did not absorb moisture even after boiling for 3 hours, and it can be practically used without problems, whereas Comparative Example does not endure boiling treatment for 1 hour and cannot be practically used. I understand.
【００１８】[0018]
【発明の効果】本発明によれば、アラミド繊維と熱硬化
性樹脂との親和性がよくなり、樹脂とアラミド繊維とが
密着するので、吸湿し難くなり、吸湿処理後も吸湿せ
ず、はんだ耐熱性が悪くならない。According to the present invention, the affinity between the aramid fiber and the thermosetting resin is improved, and the resin and the aramid fiber are in close contact with each other. Heat resistance does not deteriorate.
Claims (4)
樹脂ワニスを含浸した後熱硬化性樹脂ワニスを含浸して
プリプレグとし、このプリプレグを所定枚数重ねて加熱
加圧することを特徴とするアラミド繊維基材積層板の製
造方法。1. An aramid fiber base material is impregnated with a water-soluble thermosetting resin varnish and then a thermosetting resin varnish to form a prepreg, and a predetermined number of the prepregs are stacked and heated and pressed. A method for manufacturing an aramid fiber-based laminate.
ール樹脂、水溶性メラミン樹脂又は水溶性エポキシ樹脂
若しくはこれらの混合物である請求項１記載のアラミド
繊維基材積層板の製造方法。2. The method for producing an aramid fiber substrate laminate according to claim 1, wherein the water-soluble thermosetting resin is a water-soluble phenol resin, a water-soluble melamine resin, a water-soluble epoxy resin or a mixture thereof.
が５〜４０％であることを特徴とする請求項１又は２記
載のアラミド繊維基材積層板の製造方法。3. The method for producing an aramid fiber base material laminate according to claim 1, wherein the water-soluble thermosetting resin varnish has a resin content of 5 to 40%.
処理されたアラミド繊維基材であることを特徴とする請
求項１、２又は３記載のアラミド繊維基材積層板の製造
方法。4. The method for producing an aramid fiber substrate laminate according to claim 1, 2 or 3, wherein the aramid fiber substrate is a silane coupling treated aramid fiber substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP913994A JPH07216112A (en) | 1994-01-31 | 1994-01-31 | Preparation of aramid fiber-based laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP913994A JPH07216112A (en) | 1994-01-31 | 1994-01-31 | Preparation of aramid fiber-based laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07216112A true JPH07216112A (en) | 1995-08-15 |
Family
ID=11712304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP913994A Pending JPH07216112A (en) | 1994-01-31 | 1994-01-31 | Preparation of aramid fiber-based laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07216112A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006043811A (en) * | 2004-08-04 | 2006-02-16 | Nitta Haas Inc | Polishing cloth |
| JP2011190382A (en) * | 2010-03-16 | 2011-09-29 | Sumitomo Chemical Co Ltd | Manufacturing method for liquid crystal polyester-impregnated fiber sheet |
| KR20220021758A (en) * | 2020-08-14 | 2022-02-22 | 주식회사 유원 | Fiber reinforced polymer composite and roll wiper using the same |
-
1994
- 1994-01-31 JP JP913994A patent/JPH07216112A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006043811A (en) * | 2004-08-04 | 2006-02-16 | Nitta Haas Inc | Polishing cloth |
| JP2011190382A (en) * | 2010-03-16 | 2011-09-29 | Sumitomo Chemical Co Ltd | Manufacturing method for liquid crystal polyester-impregnated fiber sheet |
| KR20220021758A (en) * | 2020-08-14 | 2022-02-22 | 주식회사 유원 | Fiber reinforced polymer composite and roll wiper using the same |
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|---|---|---|---|
| A02 | Decision of refusal |
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