JPS55143056A - Manufacture of wiring structure for electronic circuit - Google Patents
Manufacture of wiring structure for electronic circuitInfo
- Publication number
- JPS55143056A JPS55143056A JP5089579A JP5089579A JPS55143056A JP S55143056 A JPS55143056 A JP S55143056A JP 5089579 A JP5089579 A JP 5089579A JP 5089579 A JP5089579 A JP 5089579A JP S55143056 A JPS55143056 A JP S55143056A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resisting
- heat
- protective film
- property
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Formation Of Insulating Films (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To obtain a highly efficient protective film for an electronic circuit by a method wherein a resin made by the reaction of heat-resisting resin containing hetero-cyclic compound on a phenoxyl-resin is used as a coating material. CONSTITUTION:A polyimide resin singular, having molecular weight of above 5,000 and containing closed imidic cycle above 40% in a molecule, has superior heat-resisting property but has poor formability of printed film and is scarce of adhesive property. Therefor a phenoxyl resin having the molecular weight of above 1,000 and containing at least two or more hydroxyl group in a molecule is added in 0.1-40wt% of a polyimide resin of 100wt%, solved in an organic solvent, applied to the surface of a semiconductor substrate, etc., and is dried by heating. The protective film obtained by the way keeps the heat-resisting and damp-proof property of heat-resisting resin containing heterocyclic compound, and the improvement of its scarce adhesiveness, the rapid acceleration of paint film formation, making to minute the hardening and shrinkage, and a broad drop of hardening temperature, etc., becomes possible and highly efficient protective film can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5089579A JPS55143056A (en) | 1979-04-26 | 1979-04-26 | Manufacture of wiring structure for electronic circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5089579A JPS55143056A (en) | 1979-04-26 | 1979-04-26 | Manufacture of wiring structure for electronic circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55143056A true JPS55143056A (en) | 1980-11-08 |
JPS6210015B2 JPS6210015B2 (en) | 1987-03-04 |
Family
ID=12871465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5089579A Granted JPS55143056A (en) | 1979-04-26 | 1979-04-26 | Manufacture of wiring structure for electronic circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55143056A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6097648A (en) * | 1983-11-02 | 1985-05-31 | Hitachi Ltd | Semiconductor device |
JPS61198634A (en) * | 1985-02-27 | 1986-09-03 | Asahi Chem Ind Co Ltd | Manufacture of semiconductor device |
JPS62263692A (en) * | 1986-05-12 | 1987-11-16 | ニツポン高度紙工業株式会社 | Heat-resistant printed wiring board and manufacture of the same |
-
1979
- 1979-04-26 JP JP5089579A patent/JPS55143056A/en active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6097648A (en) * | 1983-11-02 | 1985-05-31 | Hitachi Ltd | Semiconductor device |
JPH0348660B2 (en) * | 1983-11-02 | 1991-07-25 | Hitachi Ltd | |
JPS61198634A (en) * | 1985-02-27 | 1986-09-03 | Asahi Chem Ind Co Ltd | Manufacture of semiconductor device |
JPS62263692A (en) * | 1986-05-12 | 1987-11-16 | ニツポン高度紙工業株式会社 | Heat-resistant printed wiring board and manufacture of the same |
JPH0257713B2 (en) * | 1986-05-12 | 1990-12-05 | Nippon Kodoshi Kogyo Kk |
Also Published As
Publication number | Publication date |
---|---|
JPS6210015B2 (en) | 1987-03-04 |
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