JPS55143056A - Manufacture of wiring structure for electronic circuit - Google Patents

Manufacture of wiring structure for electronic circuit

Info

Publication number
JPS55143056A
JPS55143056A JP5089579A JP5089579A JPS55143056A JP S55143056 A JPS55143056 A JP S55143056A JP 5089579 A JP5089579 A JP 5089579A JP 5089579 A JP5089579 A JP 5089579A JP S55143056 A JPS55143056 A JP S55143056A
Authority
JP
Japan
Prior art keywords
resin
resisting
heat
protective film
property
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5089579A
Other languages
Japanese (ja)
Other versions
JPS6210015B2 (en
Inventor
Shigenori Yamaoka
Katamatsu Isozaki
Masuo Mizuno
Mitsuo Waki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP5089579A priority Critical patent/JPS55143056A/en
Publication of JPS55143056A publication Critical patent/JPS55143056A/en
Publication of JPS6210015B2 publication Critical patent/JPS6210015B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Formation Of Insulating Films (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a highly efficient protective film for an electronic circuit by a method wherein a resin made by the reaction of heat-resisting resin containing hetero-cyclic compound on a phenoxyl-resin is used as a coating material. CONSTITUTION:A polyimide resin singular, having molecular weight of above 5,000 and containing closed imidic cycle above 40% in a molecule, has superior heat-resisting property but has poor formability of printed film and is scarce of adhesive property. Therefor a phenoxyl resin having the molecular weight of above 1,000 and containing at least two or more hydroxyl group in a molecule is added in 0.1-40wt% of a polyimide resin of 100wt%, solved in an organic solvent, applied to the surface of a semiconductor substrate, etc., and is dried by heating. The protective film obtained by the way keeps the heat-resisting and damp-proof property of heat-resisting resin containing heterocyclic compound, and the improvement of its scarce adhesiveness, the rapid acceleration of paint film formation, making to minute the hardening and shrinkage, and a broad drop of hardening temperature, etc., becomes possible and highly efficient protective film can be obtained.
JP5089579A 1979-04-26 1979-04-26 Manufacture of wiring structure for electronic circuit Granted JPS55143056A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5089579A JPS55143056A (en) 1979-04-26 1979-04-26 Manufacture of wiring structure for electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5089579A JPS55143056A (en) 1979-04-26 1979-04-26 Manufacture of wiring structure for electronic circuit

Publications (2)

Publication Number Publication Date
JPS55143056A true JPS55143056A (en) 1980-11-08
JPS6210015B2 JPS6210015B2 (en) 1987-03-04

Family

ID=12871465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5089579A Granted JPS55143056A (en) 1979-04-26 1979-04-26 Manufacture of wiring structure for electronic circuit

Country Status (1)

Country Link
JP (1) JPS55143056A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6097648A (en) * 1983-11-02 1985-05-31 Hitachi Ltd Semiconductor device
JPS61198634A (en) * 1985-02-27 1986-09-03 Asahi Chem Ind Co Ltd Manufacture of semiconductor device
JPS62263692A (en) * 1986-05-12 1987-11-16 ニツポン高度紙工業株式会社 Heat-resistant printed wiring board and manufacture of the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6097648A (en) * 1983-11-02 1985-05-31 Hitachi Ltd Semiconductor device
JPH0348660B2 (en) * 1983-11-02 1991-07-25 Hitachi Ltd
JPS61198634A (en) * 1985-02-27 1986-09-03 Asahi Chem Ind Co Ltd Manufacture of semiconductor device
JPS62263692A (en) * 1986-05-12 1987-11-16 ニツポン高度紙工業株式会社 Heat-resistant printed wiring board and manufacture of the same
JPH0257713B2 (en) * 1986-05-12 1990-12-05 Nippon Kodoshi Kogyo Kk

Also Published As

Publication number Publication date
JPS6210015B2 (en) 1987-03-04

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