JPH0257713B2 - - Google Patents
Info
- Publication number
- JPH0257713B2 JPH0257713B2 JP61106698A JP10669886A JPH0257713B2 JP H0257713 B2 JPH0257713 B2 JP H0257713B2 JP 61106698 A JP61106698 A JP 61106698A JP 10669886 A JP10669886 A JP 10669886A JP H0257713 B2 JPH0257713 B2 JP H0257713B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61106698A JPH0257713B2 (en) | 1986-05-12 | 1986-05-12 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61106698A JPH0257713B2 (en) | 1986-05-12 | 1986-05-12 | |
| JP2837390A JPH0767007B2 (en) | 1986-05-12 | 1990-02-09 | Method for manufacturing heat resistant printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62263692A JPS62263692A (en) | 1987-11-16 |
| JPH0257713B2 true JPH0257713B2 (en) | 1990-12-05 |
Family
ID=14440235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61106698A Expired - Lifetime JPH0257713B2 (en) | 1986-05-12 | 1986-05-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0257713B2 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2265021B (en) * | 1992-03-10 | 1996-02-14 | Nippon Steel Chemical Co | Photosensitive materials and their use in forming protective layers for printed circuit and process for preparation of printed circuit |
| US9670306B2 (en) * | 2009-03-16 | 2017-06-06 | Sun Chemical Corporation | Liquid coverlays for flexible printed circuit boards |
| CA2779065A1 (en) | 2009-10-29 | 2011-05-05 | Sun Chemical B.V. | Polyamideimide adhesives for printed circuit boards |
| KR20150143480A (en) | 2013-04-18 | 2015-12-23 | 다이요 잉키 세이조 가부시키가이샤 | Laminate structure, flexible printed wiring board and method for manufacturing same |
| JP6306296B2 (en) | 2013-07-09 | 2018-04-04 | 太陽インキ製造株式会社 | Photosensitive thermosetting resin composition and flexible printed wiring board |
| JP6372988B2 (en) | 2013-10-09 | 2018-08-15 | 太陽インキ製造株式会社 | Photosensitive thermosetting resin composition and flexible printed wiring board |
| JP6441226B2 (en) | 2013-10-30 | 2018-12-19 | 太陽インキ製造株式会社 | Photosensitive thermosetting resin composition and flexible printed wiring board |
| JP6488069B2 (en) | 2013-10-30 | 2019-03-20 | 太陽インキ製造株式会社 | Photosensitive thermosetting resin composition and flexible printed wiring board |
| JP6374521B2 (en) | 2014-10-14 | 2018-08-15 | 太陽インキ製造株式会社 | Laminated structure |
| JP6578295B2 (en) | 2014-10-16 | 2019-09-18 | 太陽インキ製造株式会社 | Laminated structure, dry film and flexible printed wiring board |
| JP6387444B1 (en) | 2017-07-10 | 2018-09-05 | 太陽インキ製造株式会社 | Laminated structure, dry film and flexible printed wiring board |
| JP2020112685A (en) | 2019-01-11 | 2020-07-27 | 太陽インキ製造株式会社 | Laminate structure, dry film, cured product of the same, and electronic component |
| JP2020167352A (en) | 2019-03-29 | 2020-10-08 | 太陽インキ製造株式会社 | Dry film and printed wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55143056A (en) * | 1979-04-26 | 1980-11-08 | Sumitomo Bakelite Co Ltd | Manufacture of wiring structure for electronic circuit |
-
1986
- 1986-05-12 JP JP61106698A patent/JPH0257713B2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55143056A (en) * | 1979-04-26 | 1980-11-08 | Sumitomo Bakelite Co Ltd | Manufacture of wiring structure for electronic circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62263692A (en) | 1987-11-16 |