TW337618B - Os rectifying shottky and OHMIC junction and W/WC/TiC OHMIC contacts on SiC - Google Patents
Os rectifying shottky and OHMIC junction and W/WC/TiC OHMIC contacts on SiCInfo
- Publication number
- TW337618B TW337618B TW086102725A TW86102725A TW337618B TW 337618 B TW337618 B TW 337618B TW 086102725 A TW086102725 A TW 086102725A TW 86102725 A TW86102725 A TW 86102725A TW 337618 B TW337618 B TW 337618B
- Authority
- TW
- Taiwan
- Prior art keywords
- sic
- ohmic
- sector
- shottky
- rectifying
- Prior art date
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- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Electrodes Of Semiconductors (AREA)
- Thyristors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Junction Field-Effect Transistors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/612,216 US5929523A (en) | 1996-03-07 | 1996-03-07 | Os rectifying Schottky and ohmic junction and W/WC/TiC ohmic contacts on SiC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW337618B true TW337618B (en) | 1998-08-01 |
Family
ID=24452227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW086102725A TW337618B (en) | 1996-03-07 | 1997-03-06 | Os rectifying shottky and OHMIC junction and W/WC/TiC OHMIC contacts on SiC |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US5929523A (show.php) |
| EP (1) | EP0944917A1 (show.php) |
| JP (1) | JP2000507043A (show.php) |
| KR (1) | KR19990087549A (show.php) |
| CN (1) | CN1216635A (show.php) |
| AU (1) | AU2069497A (show.php) |
| CA (1) | CA2248803A1 (show.php) |
| TW (1) | TW337618B (show.php) |
| WO (1) | WO1997033308A1 (show.php) |
Families Citing this family (51)
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| US6027954A (en) * | 1998-05-29 | 2000-02-22 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Gas sensing diode and method of manufacturing |
| DE19925233A1 (de) * | 1998-06-08 | 1999-12-09 | Siemens Ag | Halbleiteranordnung mit ohmscher Kontaktierung und Verfahren zur Kontaktierung einer Halbleiteranordnung |
| JP3361062B2 (ja) | 1998-09-17 | 2003-01-07 | 株式会社東芝 | 半導体装置 |
| TW408411B (en) * | 1999-03-31 | 2000-10-11 | Huang Jr Gung | Semiconductor chip scale package |
| DE50009436D1 (de) * | 1999-09-22 | 2005-03-10 | Siced Elect Dev Gmbh & Co Kg | SiC-Halbleitervorrichtung mit einem Schottky-Kontakt und Verfahren zu deren Herstellung |
| US6303082B1 (en) * | 1999-12-15 | 2001-10-16 | Nanogen, Inc. | Permeation layer attachment chemistry and method |
| DE10005368A1 (de) * | 2000-02-07 | 2001-08-16 | Daimler Chrysler Ag | Bildung legierter ohmscher Kontakte auf Halbleitermaterialien |
| KR20020066578A (ko) * | 2001-02-12 | 2002-08-19 | 광주과학기술원 | 질화물반도체 소자에 사용되는 오믹금속전극 제조방법 |
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| US6599644B1 (en) | 2000-10-06 | 2003-07-29 | Foundation For Research & Technology-Hellas | Method of making an ohmic contact to p-type silicon carbide, comprising titanium carbide and nickel silicide |
| US6759683B1 (en) * | 2001-08-27 | 2004-07-06 | The United States Of America As Represented By The Secretary Of The Army | Formulation and fabrication of an improved Ni based composite Ohmic contact to n-SiC for high temperature and high power device applications |
| US7297626B1 (en) | 2001-08-27 | 2007-11-20 | United States Of America As Represented By The Secretary Of The Army | Process for nickel silicide Ohmic contacts to n-SiC |
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| JP5435922B2 (ja) * | 2008-08-12 | 2014-03-05 | 新電元工業株式会社 | ショットキーバリアダイオードの製造方法 |
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| JP5375497B2 (ja) * | 2009-10-01 | 2013-12-25 | トヨタ自動車株式会社 | 半導体装置、及び、半導体装置の製造方法 |
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| CN103208490A (zh) * | 2012-01-11 | 2013-07-17 | 朱江 | 一种具有导体的半导体装置及其制备方法 |
| TWI484626B (zh) * | 2012-02-21 | 2015-05-11 | 璨圓光電股份有限公司 | 半導體發光元件及具有此半導體發光元件的發光裝置 |
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| CN104037075B (zh) * | 2014-06-12 | 2017-01-04 | 中国电子科技集团公司第五十五研究所 | 耐高温处理的碳化硅背面金属加厚方法 |
| CN104538294A (zh) * | 2015-01-04 | 2015-04-22 | 中国科学院半导体研究所 | 一种碳化硅欧姆接触电极及其制作方法 |
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-
1996
- 1996-03-07 US US08/612,216 patent/US5929523A/en not_active Expired - Lifetime
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1997
- 1997-03-04 CA CA 2248803 patent/CA2248803A1/en not_active Abandoned
- 1997-03-04 EP EP97908902A patent/EP0944917A1/en not_active Withdrawn
- 1997-03-04 JP JP53192997A patent/JP2000507043A/ja active Pending
- 1997-03-04 KR KR1019980706986A patent/KR19990087549A/ko not_active Withdrawn
- 1997-03-04 WO PCT/US1997/003497 patent/WO1997033308A1/en not_active Ceased
- 1997-03-04 AU AU20694/97A patent/AU2069497A/en not_active Abandoned
- 1997-03-04 CN CN97193978A patent/CN1216635A/zh active Pending
- 1997-03-06 TW TW086102725A patent/TW337618B/zh active
-
1999
- 1999-02-19 US US09/251,897 patent/US6150246A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| WO1997033308A1 (en) | 1997-09-12 |
| JP2000507043A (ja) | 2000-06-06 |
| KR19990087549A (ko) | 1999-12-27 |
| EP0944917A1 (en) | 1999-09-29 |
| CN1216635A (zh) | 1999-05-12 |
| CA2248803A1 (en) | 1997-09-12 |
| US6150246A (en) | 2000-11-21 |
| US5929523A (en) | 1999-07-27 |
| EP0944917A4 (show.php) | 1999-09-29 |
| AU2069497A (en) | 1997-09-22 |
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