TW329037B - Semiconductor memory device - Google Patents
Semiconductor memory deviceInfo
- Publication number
- TW329037B TW329037B TW086107955A TW86107955A TW329037B TW 329037 B TW329037 B TW 329037B TW 086107955 A TW086107955 A TW 086107955A TW 86107955 A TW86107955 A TW 86107955A TW 329037 B TW329037 B TW 329037B
- Authority
- TW
- Taiwan
- Prior art keywords
- memory device
- semiconductor memory
- device includes
- dielectric film
- lower electrode
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000000463 material Substances 0.000 abstract 2
- 239000003990 capacitor Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960021856A KR100234361B1 (ko) | 1996-06-17 | 1996-06-17 | 강유전체 캐패시터를 구비하는 반도체 메모리장치 및그제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW329037B true TW329037B (en) | 1998-04-01 |
Family
ID=19462163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086107955A TW329037B (en) | 1996-06-17 | 1997-06-10 | Semiconductor memory device |
Country Status (6)
Country | Link |
---|---|
US (2) | US5955774A (zh) |
EP (1) | EP0814514B1 (zh) |
JP (1) | JP3955660B2 (zh) |
KR (1) | KR100234361B1 (zh) |
DE (1) | DE69714659T2 (zh) |
TW (1) | TW329037B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6602756B2 (en) | 2000-08-11 | 2003-08-05 | Fujitsu Limited | Semiconductor device and its manufacture |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100244251B1 (ko) * | 1997-06-19 | 2000-02-01 | 김영환 | 반도체 소자의 커패시터 제조 방법 |
EP0893832A3 (en) * | 1997-07-24 | 1999-11-03 | Matsushita Electronics Corporation | Semiconductor device including a capacitor device and method for fabricating the same |
US6700145B1 (en) * | 1998-04-30 | 2004-03-02 | International Business Machines Corporation | Capacitor with high charge storage capacity |
DE19845033A1 (de) * | 1998-09-30 | 2000-04-20 | Siemens Ag | Halbleiterbauelement |
DE19857039A1 (de) * | 1998-12-10 | 2000-06-21 | Siemens Ag | Mikroelektronische Struktur |
KR100324591B1 (ko) * | 1998-12-24 | 2002-04-17 | 박종섭 | 티타늄 알루미늄 질소 합금막을 상부전극의 확산방지막으로서 이용하는 캐패시터 제조 방법 |
JP3539887B2 (ja) | 1999-04-09 | 2004-07-07 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
EP1067605A1 (en) * | 1999-07-05 | 2001-01-10 | STMicroelectronics S.r.l. | Ferroelectric memory cell and corresponding manufacturing method |
JP2001057412A (ja) * | 1999-08-19 | 2001-02-27 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
KR100343287B1 (ko) * | 1999-09-21 | 2002-07-15 | 윤종용 | 고집적 강유전체 메모리 소자의 형성 방법 |
DE19950540B4 (de) * | 1999-10-20 | 2005-07-21 | Infineon Technologies Ag | Verfahren zur Herstellung einer Kondensator-Elektrode mit Barrierestruktur |
JP3505497B2 (ja) * | 1999-11-17 | 2004-03-08 | 三洋電機株式会社 | 誘電体素子 |
JP3464956B2 (ja) * | 1999-12-09 | 2003-11-10 | Necエレクトロニクス株式会社 | 半導体装置 |
US6365927B1 (en) * | 2000-04-03 | 2002-04-02 | Symetrix Corporation | Ferroelectric integrated circuit having hydrogen barrier layer |
KR100517911B1 (ko) * | 2000-05-19 | 2005-10-04 | 주식회사 하이닉스반도체 | 하부전극과 스토리지 노드 콘택간의 오정렬 및확산방지막의 산화를 방지할 수 있는 반도체 장치 제조 방법 |
KR100396879B1 (ko) | 2000-08-11 | 2003-09-02 | 삼성전자주식회사 | 동일 물질로 이루어진 이중막을 포함하는 다중막으로캡슐화된 캐패시터를 구비한 반도체 메모리 소자 및 그의제조 방법 |
US7327582B2 (en) * | 2000-09-21 | 2008-02-05 | Ultrasource, Inc. | Integrated thin film capacitor/inductor/interconnect system and method |
US6737728B1 (en) * | 2000-10-12 | 2004-05-18 | Intel Corporation | On-chip decoupling capacitor and method of making same |
JP2002151657A (ja) | 2000-11-08 | 2002-05-24 | Sanyo Electric Co Ltd | 誘電体素子およびその製造方法 |
JP2002231903A (ja) | 2001-02-06 | 2002-08-16 | Sanyo Electric Co Ltd | 誘電体素子およびその製造方法 |
WO2002075780A2 (en) * | 2001-03-21 | 2002-09-26 | Koninklijke Philips Electronics N.V. | Electronic device having dielectric material of high dielectric constant |
JP3892736B2 (ja) * | 2001-03-29 | 2007-03-14 | 株式会社東芝 | 半導体記憶装置 |
US7084080B2 (en) * | 2001-03-30 | 2006-08-01 | Advanced Technology Materials, Inc. | Silicon source reagent compositions, and method of making and using same for microelectronic device structure |
US6900498B2 (en) * | 2001-05-08 | 2005-05-31 | Advanced Technology Materials, Inc. | Barrier structures for integration of high K oxides with Cu and Al electrodes |
DE10125594A1 (de) * | 2001-05-25 | 2002-12-05 | Infineon Technologies Ag | Halbleiterspeichereinrichtung sowie Verfahren zu deren Herstellung |
JP4428500B2 (ja) * | 2001-07-13 | 2010-03-10 | 富士通マイクロエレクトロニクス株式会社 | 容量素子及びその製造方法 |
US6998696B2 (en) * | 2001-09-21 | 2006-02-14 | Casper Michael D | Integrated thin film capacitor/inductor/interconnect system and method |
US7425877B2 (en) * | 2001-09-21 | 2008-09-16 | Ultrasource, Inc. | Lange coupler system and method |
KR20030039893A (ko) * | 2001-11-16 | 2003-05-22 | 주식회사 하이닉스반도체 | 반도체 소자의 캐패시터 및 그 제조방법 |
CA2488755C (en) * | 2002-06-12 | 2011-07-12 | Barry N. Gellman | Medical slings |
KR100449253B1 (ko) * | 2002-07-16 | 2004-09-18 | 주식회사 하이닉스반도체 | 커패시터 제조방법 |
KR100866708B1 (ko) * | 2002-07-18 | 2008-11-03 | 주식회사 하이닉스반도체 | 반도체소자의 제조방법 |
US7326979B2 (en) * | 2002-08-02 | 2008-02-05 | Unity Semiconductor Corporation | Resistive memory device with a treated interface |
US6800890B1 (en) * | 2002-12-30 | 2004-10-05 | Infineon Technologies Aktiengesellschaft | Memory architecture with series grouped by cells |
KR100587669B1 (ko) * | 2003-10-29 | 2006-06-08 | 삼성전자주식회사 | 반도체 장치에서의 저항 소자 형성방법. |
JP2005217044A (ja) * | 2004-01-28 | 2005-08-11 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP4904671B2 (ja) | 2004-06-24 | 2012-03-28 | 日本電気株式会社 | 半導体装置、その製造方法及び電子機器 |
EP1624479A3 (en) * | 2004-08-05 | 2008-07-16 | Samsung Electronics Co, Ltd | Ferroelectric memory and ferroelectric capacitor with Ir-alloy electrode or Ru-alloy electrode and method of manufacturing same |
JP4913994B2 (ja) * | 2004-08-09 | 2012-04-11 | セイコーエプソン株式会社 | 強誘電体キャパシタ、強誘電体メモリ、強誘電体キャパシタの製造方法及び強誘電体メモリの製造方法 |
KR100696766B1 (ko) * | 2004-12-29 | 2007-03-19 | 주식회사 하이닉스반도체 | 차지 트랩 인슐레이터 메모리 장치 |
DE102005017072A1 (de) * | 2004-12-29 | 2006-07-13 | Hynix Semiconductor Inc., Ichon | Ladungsfalle- bzw. Ladung-Trap-Isolator-Speichereinrichtung |
JP2007067096A (ja) * | 2005-08-30 | 2007-03-15 | Fujitsu Ltd | 半導体装置 |
US7750173B2 (en) * | 2007-01-18 | 2010-07-06 | Advanced Technology Materials, Inc. | Tantalum amido-complexes with chelate ligands useful for CVD and ALD of TaN and Ta205 thin films |
US8646770B2 (en) | 2009-09-18 | 2014-02-11 | Hid Global Corporation | Card substrate rotator with lift mechanism |
CN109216360B (zh) | 2017-07-07 | 2021-01-12 | 联华电子股份有限公司 | 半导体存储装置 |
CN109427786B (zh) | 2017-08-21 | 2021-08-17 | 联华电子股份有限公司 | 半导体存储装置及其制作工艺 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685431B2 (ja) * | 1985-06-10 | 1994-10-26 | 株式会社日立製作所 | 半導体装置 |
US5005102A (en) * | 1989-06-20 | 1991-04-02 | Ramtron Corporation | Multilayer electrodes for integrated circuit capacitors |
US4982309A (en) * | 1989-07-17 | 1991-01-01 | National Semiconductor Corporation | Electrodes for electrical ceramic oxide devices |
JP3185220B2 (ja) * | 1990-09-28 | 2001-07-09 | セイコーエプソン株式会社 | 半導体装置 |
US5119154A (en) * | 1990-12-03 | 1992-06-02 | Micron Technology, Inc. | Ferroelectric capacitor and method for forming local interconnect |
JPH0513676A (ja) * | 1991-07-02 | 1993-01-22 | Toshiba Corp | 半導体装置 |
JPH0629461A (ja) * | 1992-07-08 | 1994-02-04 | Mitsubishi Electric Corp | 半導体装置のキャパシタ構造およびその製造方法 |
JPH06125057A (ja) * | 1992-10-12 | 1994-05-06 | Olympus Optical Co Ltd | 強誘電体膜を有する半導体メモリ装置 |
JPH0793969A (ja) * | 1993-09-22 | 1995-04-07 | Olympus Optical Co Ltd | 強誘電体容量素子 |
JPH07111318A (ja) * | 1993-10-12 | 1995-04-25 | Olympus Optical Co Ltd | 強誘電体メモリ |
JPH07161931A (ja) * | 1993-12-02 | 1995-06-23 | Nec Corp | 半導体装置の製造方法 |
JP2875733B2 (ja) * | 1994-02-15 | 1999-03-31 | 松下電子工業株式会社 | 半導体装置の製造方法 |
US5585300A (en) * | 1994-08-01 | 1996-12-17 | Texas Instruments Incorporated | Method of making conductive amorphous-nitride barrier layer for high-dielectric-constant material electrodes |
US5716875A (en) * | 1996-03-01 | 1998-02-10 | Motorola, Inc. | Method for making a ferroelectric device |
US5990507A (en) * | 1996-07-09 | 1999-11-23 | Kabushiki Kaisha Toshiba | Semiconductor device having ferroelectric capacitor structures |
JP3157734B2 (ja) * | 1997-02-03 | 2001-04-16 | 松下電子工業株式会社 | 強誘電体メモリ装置及びその製造方法 |
-
1996
- 1996-06-17 KR KR1019960021856A patent/KR100234361B1/ko not_active IP Right Cessation
-
1997
- 1997-06-10 TW TW086107955A patent/TW329037B/zh not_active IP Right Cessation
- 1997-06-12 US US08/873,641 patent/US5955774A/en not_active Expired - Lifetime
- 1997-06-12 JP JP15559897A patent/JP3955660B2/ja not_active Expired - Fee Related
- 1997-06-13 DE DE69714659T patent/DE69714659T2/de not_active Expired - Lifetime
- 1997-06-13 EP EP97304161A patent/EP0814514B1/en not_active Expired - Lifetime
-
1999
- 1999-07-22 US US09/358,668 patent/US6211005B1/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6602756B2 (en) | 2000-08-11 | 2003-08-05 | Fujitsu Limited | Semiconductor device and its manufacture |
US6835976B2 (en) | 2000-08-11 | 2004-12-28 | Fujitsu Limited | Semiconductor device and its manufacture |
Also Published As
Publication number | Publication date |
---|---|
JP3955660B2 (ja) | 2007-08-08 |
DE69714659T2 (de) | 2003-04-10 |
JPH1056144A (ja) | 1998-02-24 |
EP0814514B1 (en) | 2002-08-14 |
KR100234361B1 (ko) | 1999-12-15 |
DE69714659D1 (de) | 2002-09-19 |
US6211005B1 (en) | 2001-04-03 |
US5955774A (en) | 1999-09-21 |
EP0814514A3 (en) | 1998-11-18 |
KR980006312A (ko) | 1998-03-30 |
EP0814514A2 (en) | 1997-12-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |