TW322507B - - Google Patents

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Publication number
TW322507B
TW322507B TW85102432A TW85102432A TW322507B TW 322507 B TW322507 B TW 322507B TW 85102432 A TW85102432 A TW 85102432A TW 85102432 A TW85102432 A TW 85102432A TW 322507 B TW322507 B TW 322507B
Authority
TW
Taiwan
Prior art keywords
resin
component
particles
epoxy resin
weight
Prior art date
Application number
TW85102432A
Other languages
English (en)
Original Assignee
Toshiba Kagaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7079739A external-priority patent/JP2679005B2/ja
Priority claimed from JP10173795A external-priority patent/JPH08276532A/ja
Application filed by Toshiba Kagaku Kk filed Critical Toshiba Kagaku Kk
Application granted granted Critical
Publication of TW322507B publication Critical patent/TW322507B/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/14Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/022Non-woven fabric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/08Ingredients agglomerated by treatment with a binding agent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0005Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
    • B29K2105/0026Flame proofing or flame retarding agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00Layered products
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/021Fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/306Resistant to heat
    • B32B2307/3065Flame resistant or retardant, fire resistant or retardant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/012Flame-retardant; Preventing of inflammation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2984Microcapsule with fluid core [includes liposome]
    • Y10T428/2985Solid-walled microcapsule from synthetic polymer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31515As intermediate layer
    • Y10T428/31518Next to glass or quartz
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31515As intermediate layer
    • Y10T428/31522Next to metal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31525Next to glass or quartz
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31529Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Paints Or Removers (AREA)

Description

五、發明説明(1 ) 本發明係有關於一種不含鹵素之難燃性環氧樹脂組成 物、含有此環氧樹脂組成物之預浸物,以及使用此預浸物 製成之積層板、襯飼積層板及印刷電路板。 近年來,人們除對世界性環.境問題及對人體安全之關 心曰益提高外,對電氣、電子製品*不但要求其難燃性, 對其有害性之減少及安全性之提高的要求更是日益增高; 即,電氣、電子製品不但要難燃,而且要產生之有害氣雔 或發生之澹煙甚少。而·過去搭載電氣、《子製品用之印 刷電路板•基板通常是用玻璃與環氧樹脂所構成,其中所 使用之環氧樹脂一般是使用含有具難燃劑作用之溴的溴化 環氧樹脂•尤其是四溴雙酚A型環氧樹脂。 經濟部中央標準局員工消費合作社印繁 (請先閱讀背面之注意事項再填寫本頁) 此等溴化環氧樹脂雖然具有優良之難燃性•但燃燒時 會產生有害之鹵化氫(溴化氫)氣體,因此被限制使用,職 是之故*人們乃大力開發在一般環氧樹脂中調配非鹵索糸 統之難燃劑所成之組成物,例如調配氮化合物、磷化合物 、無櫬化合物等(例如英國專利第1,112, 138號、日本專利 公開公報特開平2-2697 30號)·但此等賦與難燃性之添加 劑卻不但畲對環氧樹脂組成物之硬化造成不良影響*而且 會造成硬化組成物之耐濕性降低,或使姐成物之玻璃布含 浸性降低等種種問題。 又·與上述難燃性相同地,就提高安全性之觀點而言 *印刷霣路板應具有之重要特性有耐漏電性•耐漏電性在 空調機或電視櫬用印刷電路板等具有高電壓回路之基板要 求特別高。 本紙張尺度適用中國國家標準(CNS ) A4規格(2丨Ο X 297公釐) Α7 Β7 322507 五、發明説明(2 ) 通去,為賦與印刷電路板附漏電性•係在印刷電路板 所用之樹脂組成物中調配鐽狀碳化氫類、環式化合物或無 機材料等難碳化之物質,但鍵狀碳化氫及環式化合物畲使 印刷電路板之耐熱性降低•而無機材料又有必須大量使用 之缺點。 因此,本發明之目的在提供一種環氧樹脂組成物,該 種環氧榭脂組成物不但難燃性良好,而且不含齒素,同時 並具有良好之耐漏電性。 進而,本發明之目的並在提供一種以此等環氧樹脂含 浸之預浸物,以及,一種以此等預浸物製成之積層板、襯 銅積層板及印刷霣路板。 為逹成上述目的,本發明提供了一種不含鹵素之難燃 性環氧樹脂組成物,包含有: (A) 雙酚A型環氧樹脂; (B) 硬化劑; (C) 紅磷顆粒,均為被覆靥所被覆,且被覆曆至少最外層 係由樹脂所構成者;及 (D) 無機填充劑。 本發明並進一步提供了含浸上述本發明不含鹵素之難 燃性環氧樹脂組成物的預浸物,以及•使用此等預浸物製 成之積曆板、襯網積層板及印刷霣路板。本發明之預浸物 係於坡璃基材含浸本發明之環氣樹脂組成物而構成;而本 發明之積層板則係Μ多數之本發明預浸物叠合並使所含之 環氧樹脂組成物硬化而成;本發明之襯銅積層板係於本發 本紙浪尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) 1---....... i -I ^^1 HI m 1^1 t nn In ϋ i i ^ 、v9 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消费合作社印聚 507 B7 i'發明説明(3) 明積層板之至少一面上具有網箔者;至於本發明之印刷轚 路板則為本發明之襯網積層板之鋦箔上形成有配線層者。 以下,詳细說明本發明。 本發明之環氧樹脂組成物含有成分(A)*即雙酚A型 環氧樹脂。雙酚A型環氧樹脂為該技術領域所周知者,係 雙酚A與表氯酵等之反應生成物。本發明中所使用之雙酚 A型環氧樹脂通常具有170M上之環氧當量,但環氧當量_ 超過1QQQ時,所得組成物對玻璃布之含浸性將偏低,宜遴 免。此等雙酚A型環氧樹脂於市面上即有販售,例如曰本 油化蜆殻公司之EPIKOTE系列、汽巴嘉基之ARALDITE系列 。雙酚A型環氧樹脂可單獮使用*亦可姐合二種Μ上使用 Ο 本發明環氧樹脂組成物之成分(Β)為硬化劑,此硬化-劑(Β)只要是通常使用於環氧樹脂之硬化者即可。此等硬 化劑包含胺系硬化劑及酚系硬化劑。胺糸硬化劑舉例言之 可為:雙氰胺、芳香族胺(例如苯甲胺);又,酚系硬化 舉例言之可為:酚型酚醛濟漆樹脂、甲酚型酚醛清漆樹腊 、雙酚A型酚醛清漆樹脂等。 經濟部中央標準局負工消費合作社印製 本發明環氧樹脂姐成物之特有成分〔成分(C)〕為至 少被樹脂被覆之紅磷顆粒。在本發明之環氧樹脂姐成物中 ,該經被覆之;紅磷顆粒不但可作為雞燃性賦與劑•《可賦 與以本發明環氧樹脂組成物製成之印刷電路板射漏轚性。 此等紅磷顆粒之平均粒徑Μ 200 下為宜,形狀則Μ球 形為宜。各紅磷顆粒之被覆層至少最外層為樹脂•尤其是 本纸張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) A7 B7 322507 五、發明説明(4 ) κ熱硬化樹脂所構成。藉此樹脂之被覆•可提髙紅磷顆粒 之耐濕性。又,各紅磷顆粒宜被覆二層,即附著於紅磷顆 粒表面之無櫬粒子所構成的第一層及覆蓋該第一曆之樹脂 (尤其是熱硬化樹脂)所構成的第二層。構成第一層之無櫬 粒子宜為氫氧化鋁及/或氫氧化鋅粒子,而構成第二曆之 熱硬化樹脂則宜為酚/甲醛樹脂、尿素/甲醛樹脂、蜜胺 /甲醛樹脂、呋喃甲酵/甲醛樹脂、苯胺/甲醛樹脂等。 經如此被覆之紅璘顆粒本身及其製造方法可參日本専利特 公平4-37862號及特公平6-27217號,簡言之,可將黃磷加 熱處理轉化成紅磷,得球狀之紅璘顆粒*將之懸瀰於水中 ,在此水之懸濁液中加入鋁或鋅之水溶性鹽(例如确酸鋁 、氯化鋁、疏酸鋅、氛化鋅)的水溶液*並薄氫氧化納中 和或藉重碳酸銨複分解,使氫氧化鋁或氫氧化鋅吸著於紅 磷顆粒上。氫氧化物之量以每100重量份之紅磷調S1〜30 重量份為宜。可在已藉氫氧化物被覆之紅磷顆粒的水懸濁 液中加入上述热硬化性樹脂原料•亦可添加其等之初期縮 合物再加熱處理Μ形成由硬化樹脂構成之第二靥。樹脂硬 化層之量比*相對於100重悬份之紅璘粒子Ml〜30重量份 為宜。 本發明之環氧樹脂組成物中所含之成分(D)為無機充 填劑,藉此_機充填劑賦與環氧樹脂組成物進一步之難燃 性、耐熱性與附濕性,此等充填劑舉例言之可為滑石酚、 矽土、鋁土、氫氧化鋁、氫氧化鎂粉末等*可單獮使用, 亦可姐合二種K上使用。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) 裝· 訂 經濟部中央標準局員工消費合作社印製 吻5〇7 A7 B7 五、發明説明(5 ) 在本發明之環氧樹脂組成物中,樹脂分〔即成分(A) 與成分(B)之合計J之使用量宜佔成分(A)、成分(B)、成 分(C)及成分(D)合計簠董之50乃至90重董%之比例,因此 成分(C)與成分(D)之合計重量宜為成分(A)、成分(B)、成 分(C)及成分(D)合計重董之50〜10重悬%。其次,經被覆 之紅磷〔即成分(C)〕則宜佔成分(A)、成分(B)、成分(C) 及成分(D)合計重量之0.5乃至20重量%。 成分(B)(即環氧樹脂之硬化劑)若為酚樹脂系硬化劑 時,環氧樹脂姐成物〔成分(A)〕與酚樹脂系硬化劑宜配 成酚樹脂系硬化劑之羥基每1當量環氧當量為0.8乃至1.2 ,尤其是0.9乃至1.05。環氧樹脂之硬化劑〔即成分(B)〕 為胺糸硬化劑時,胺系硬化劑宜使用環氧樹腊成分(A)重 置之1乃至10重量%的範圍,尤其當胺系硬化劑為雙氰胺 時,其使用量宜在環氧樹脂成分(A)重量之2乃至3重量 %之範圃。 經濟部中央標準局貝工消費合作社印製 _^ϋ ml In...... -— 1 1-1- -ί- - I 1.^1 XV • { U3. τβ (請先閲讀背面之注意事項再填寫本頁) 又,為縮短組成物之硬化時間,本發明之環氧樹脂組 成物中可加入硬化促進劑•此等硬化促進劑可使用常用於 環氧樹脂硬化之促進者,舉例言之可為2-乙基-4-甲基畔 唑、卜苯甲基-2-甲基眯唑等眯唑化合物。硬化促進劑可 單獮使用、亦可組合二種以上使用。硬化促進劑以足可促 進環氧樹脂蟑化之少量程度即可。 本發明之上述環氧樹脂組成物係以諸如丙二酵單甲醚 等適當之有機溶劑稀釋,製成濟漆,再以一般之方法將之 塗佈於玻璃不織布、玻璃继布等之多孔質玻璃基材,令其 本紙張尺度適用中國國家標隼(CNS ) Α4規格(210Χ297公釐) 經濟部中央標準局貝工消費合作社印策 B7 五、發明説明(6 ) 含浸,並加热之,以製得預浸物。再叠合数枚預浸物•並 於積層構造之軍面或雙面叠合鋦箔,再於一般之條件下加 熱、加壓,即得玻璃-環氧樹脂-期飼稹層板•此時若不使 用鋦箔•所得即為積曆板。多層板亦係Μ—般之方法製造 之,例如於襯鑭積層板(内層板)上形成回路•再鋦箔蝕刻 處理後,於內層板之至少一面上叠合預浸物及鋦箔,再Μ 諸如170t:、40 kg/cn*之壓力加熱、加壓90分鐘即可。而 印刷電路板之製造亦係以一般之方法為之,例如可在襯飼 積層板或多層板上形成貫孔,將貫孔上鍍後,形成預定之 回路。 Μ下Μ實施例說明之。 實施例1 混合260重量份之雙酚Α型環氧樹脂ΕΡΙΚΟΤΕ 1001(油 化蜆殻公司製;環氧當量456、樹脂固形分70重量% )、65 重霣份之甲酚型酚醛濟漆環氧樹脂YDCN-704P (東都化成公 司製;環氧當量2 10、固形分70重量%)、25重量份之經被 覆的紅磷顆粒(Μ氫氧化鋁及酚樹脂被覆 > 紅磷含有率85 重量%)、104重量份之雙酚Α型酚醛清漆樹脂(羥基價118 、固形分7Q重量%)、175簠量份之氫氧化鋁及0.1簠董份 之2-乙基-4-甲基眯唑,再於混合物中加入丙二酵單甲醚( PGM)作溶劑之用,調製樹脂固形分65重量%之環氧樹脂清 漆。 實施例2 混合260重童份之雙酚A型環氧樹脂EPIKOTE 1001(前 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) —^1 i / nn ^^^^1 ^^^^1 n^i - -* j 洚 Ί . (請先閱讀背面之注意事項再填寫本頁) 322507 Α7 Β7 五、發明説明() 出)、65里量份之甲酚型酚醛淸漆樹脂YDCN-704P (前出)、 50重量份之經被覆的紅磷顆粒(以氫氧化鋁及酚樹脂被覆 ;紅磷含有率85重量炻)、104重霣份之雙酚A型酚醛清漆 樹脂(羥基價118、固形分70重量%)、100重悬份之氫氧化 鋁及0.1簠量份之2-乙基-4-甲基咪唑•再於混合物中加入 PGM,調製樹脂固形分65重董%之環氧樹脂濟漆。 實施例3 混合260重悬份之雙酚A型瑁氧樹脂EPIKOTE 1001(前 出)、65重量份之甲酚型酚醛清漆環氧樹脂YDCN-704P(前 出)、35重董份之經被覆的紅璘顆粒(M氫氧化鋁及酚樹脂 被覆,紅磷含有率85重量% )、115重量份之氫氧化鋁、6 重量份之二氰胺及0.1重量份之2-乙基-4-甲基眯唑,再於 混合物中加入丙二酵單甲醚(PGM)作溶劑之用,調製樹脂 固形分65重量%之環氧樹脂清漆。 比較例1 混合283重量份之溴化瓖氧樹脂(大日本印墨化學工業 公司;環氧當量490、固形分75重最% )、34重量份之甲酚 型酚醛清漆樹脂YCDN-704P (前出)、92重量份之雙酚A型 酚醛清漆樹脂(大日本印墨化學工業公司;羥基價118、固 形分70重量%)、200重量份之氬氧化鋁及0.1簠量份之2-乙基-4-甲基咪唑,再於混合物中加入PGM*調製樹脂固形 分65簠量%之環氧樹脂濟漆。 比較例2 混合比較例1所用之溴化環氧樹脂360重Μ份、甲酚 型酚醛清漆樹脂¥00»-704?(前出)43重鼉份、雙氰胺7.5重 本纸張尺度適用中國國家標準(CNS ) A4規把(210X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 裝. 訂 10 A7 B7 五、發明説明(8 ) 量份、氫氧化鋁200重量份及2-乙基-4-甲基眯唑0.1重量 份,再於混合物中加入二甲基甲醣胺,調製樹脂固形分65_ 重量%之環氧樹脂清漆。 將實施例1乃至3,以及比較例1乃至2所得環氧樹 脂清漆連續塗佈並含浸於玻璃不嫌布或玻璃纗布,在160 之溫度下乾煉製成預浸物;將所得預浸物8枚疊合•並 於積層體兩面叠合18 厚之铜箔•在170C之溫度及40 _ kg/cm2之壓力下加熱、加壓90分鐘,得厚度1.6 Μ之玻璃 -環氧樹脂襯銅積層板。 測定所得襯銅積層板之難燃性、附漏霣性、絕緣阻力 、初期及經長期後銅箔之剝離強度、耐热性及射濕性•將 结果列於表1中。 實施例3 · 經濟部中央標準局貝工消費合作社印製 混合260重霣份之雙酚Α型環氧樹脂ΕΡΙΚ0ΤΕ 1001(前 出)、65重量份之甲酚型酚醛濟漆環氣樹腊YDCN-704P (前 出)、35重量份之經被覆的紅磷顆粒(M氫氧化鋁及酚樹 被覆,紅磷含有率85重量% )、115重量份之氫氧化鋁、6 重量份之二氰胺及0.1重量份之2-乙基-4-甲基眯唑,再於 混合物中加入丙二酵單甲醚(PGM)作溶爾之用,調製樹脂 固形分65重量%之瑁氧樹脂清漆。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 11 五、發明説明(9 ) Α7 Β7 表1 組成物 實 腌 例 比較 例 特性 1 2 3 1 2 難燃性-1 V-0 V-0 V-1 V-0 V-0 附漏電性’ • 2 600V 600V 600V 200V 200V 絕緣霣阻(Ω广3 8.0 X 10" 4.0 X 10^8 1.0 X 101 2 2.0 X 10" 2.0 X 1〇18 剝離 初期 1.50 1.50 1.55 1.50 1.60 強度μ 長期 1.45 1.40 1.45 0.90 0.95 5分鐘 〇 〇 〇 〇 〇 耐濕性β5 10分鐘 〇 〇 〇 〇 〇 15分鐘 〇 〇 〇 〇 〇 20分鐘 〇 〇 〇 〇 △ 附濕性·Β 條件A 〇 〇 〇 〇 〇 條件B 〇 〇 〇 〇 〇 (請先閲讀背面之注意事項再填寫本頁) 裝. -Ι訂 註 經濟部中央標準局員工消費合作社印製 12 3 4 5 本本本本孝 依UL94難燃性試驗之方法测定。 依IEC-PB112之方法測定。 依JIS-C-6481之方法測定。 依JIS-C-6481之方法测定。單位為KN/m。 在26Q1C之软焊浴上飄浮表中所示各試料,觀察是 否膨脹,並以下列基準評價。 Ο...無膨脹 ;〇...部份膨脹 △...大部份膨脹;X ...全面膨脹 將試料置於條件Α (煮沸6小時)或條件Β (在120 C、2大氣颸之水蒸氣中放置7小時)下處理後, 浸潢於260t!之軟焊浴中30秒鐘,再觀察其膨脹之 有無*並Μ下列基準評價之。 Ο ...無膨脹 ;〇...部份膨脹 △...大部份膨脹;X ...全面朦脹 本紙張尺度適用中國國家榡準(CNS ) Α4規格(210X29*7公釐) 12 3225Q7 立、發明説明(10) 實施例4 將實施例2所得環氧樹脂清漆連鑛塗佈並含浸於玻璃 不纗布或玻璃纗布,在1601:之溫度下乾燥,製得預浸物 ;將所得預浸物8枚叠合•在170C之溫度及40 kg/c·2之 壓力下加熱、加懕90分鐘·得玻璃-環氧樹脂積層板。 實施例5 Μ實施例4之程序製成預浸物。將預浸物叠合•在其 兩俩叠合35 u·厚之網箔,同樣地加热、加壓製得板厚0.8 道1«之內曆板;繼鑛在内層板之兩面上叠合上述預浸物,其 上並分別叠合18 λβ厚之鋦箔•同樣地加热、加壓•製得 板厚1.6 mm之多曆板。 如上所述·依據本發明可提供一種難燃性優越且不含 鹵素環氧樹脂,藉該環氧樹脂並可提供耐热性、射濕性、 耐漏電性均優越之玻璃-環氧樹脂-襯網積曆板•並可進一 步使用此玻璃-環氧樹脂-襯銅積層板製造各種特性均優越 之印刷電路板。 -----{裝------:-訂—J (請先閱讀背面之注意事項再填寫本頁) 經濟部中央樣準局負工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 13

Claims (1)

  1. 阪丄24修正 年 A a 補尤 322507 六、申請專利範圍 1. 一種不含鹵素之難燃性環氧樹腊組成物,包含有: (A)含有170〜1000環氧當量之雙酚A型環氧樹脂; (B)硬化劑; (C) 紅磷顆粒;及 (D) 無機填充劑; 其中*該紅磷顆粒均為附著於紅磷顆粒表面之無 機材料顆粒所構成之第一層,及,覆於該第一層上之 樹脂所構成之第二層所被覆*且*上述成分(A)與成 分(B)之合計重量為成分(A)、成分(B)、成分(C)、成 分(D)合計重S之50〜90重量%之比率,成分(C)為成 J) 分(A)、成分(B)、成分(C)、成分(D)合計重量之0.5 〜2 0重量%之比率。 2. 如申請專利範圍第1項之姐成物,其中該被覆於紅磷 顆粒上之第一屜無櫬材料顆粒係選自氫氧化鋁顆粒及 氫氧化鋅顆粒所構成之群中。 3. 如申請専利範圍第1項之姐成物,其中被覆於該紅磷 顆粒上之第二層的樹脂係選自酚/甲醛樹脂、尿素/ 甲醛樹脂、三聚氰胺/甲醛樹脂、糠酵/甲醛樹脂及 苯胺/甲醛樹脂所構成之群中的熱硬化樹脂。 4. 如申請專利範圔第1項之姐成物,其中被覆於該紅璘 顆粒上之第一層的無機材料顆粒係選自氩氧化鋁顆粒 及氫氧化鉾顆粒所構成之群中*且被覆於該紅磷顆粒 上之第二層的樹脂係選自酚/甲醛樹脂、尿素/甲醛 樹脂、三聚氰胺/甲醛樹脂、糠酵/甲醛樹脂及苯胺 本紙張尺度逋用中國國家揉準(CNS ) Α4規格(210Χ297公釐) -----------裝------^訂 L-----!·ν (請先閱讀背面之注意事項再填寫本頁) 經濟部中央揉準局男工消費合作社印製 14 322507 A8 B8 C8 D8 六、申請專利範圍 /甲醛樹脂所構成之群中的热硬化樹脂。 5. 如申請専利範圃第1,2,3或4項之組成物,其中 該硬化劑為酚系硬化劑或胺系硬化劑。 6. —種預浸物,包含有含浸了申請專利範圃第1乃至第 5項中任一項所載之環氧樹脂姐成物的玻璃基材。 7. —種積盾板*係由申請專利範園第6項所載之預浸物 多数叠合,且其所含環氧樹脂姐成物並經硬化而構成 者0 8. —種襯铜積曆板,包含有由申請專利範圍第6項所載 之預浸物所構成且其所含環氧樹脂組成物並經硬化之 基板,及,至少接合於該基板之一面上的鋦萡。 9. —種印刷電路板,包含有由申請專利範園第6項所載 之預浸物所構成且其所含環氧樹脂姐成物並經硬化之 基板*及•至少形成於該基板之一面上的配線層。 IU---Ί----一 裝------^訂Γ·------* i (請先閱讀背面之注意事項再填寫本頁) 經濟部中央揉準局負工消費合作社印裝 本紙張尺度適用中國國家揉準(CNS ) A4規格(210X297公釐) 15
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