TW314685B - - Google Patents

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Publication number
TW314685B
TW314685B TW085101691A TW85101691A TW314685B TW 314685 B TW314685 B TW 314685B TW 085101691 A TW085101691 A TW 085101691A TW 85101691 A TW85101691 A TW 85101691A TW 314685 B TW314685 B TW 314685B
Authority
TW
Taiwan
Prior art keywords
plasma
electrode
magnetic field
ring
workpiece
Prior art date
Application number
TW085101691A
Other languages
English (en)
Chinese (zh)
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW314685B publication Critical patent/TW314685B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
TW085101691A 1995-02-13 1996-02-09 TW314685B (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2405095 1995-02-13
JP7340682A JPH08288096A (ja) 1995-02-13 1995-12-27 プラズマ処理装置

Publications (1)

Publication Number Publication Date
TW314685B true TW314685B (https=) 1997-09-01

Family

ID=26361528

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085101691A TW314685B (https=) 1995-02-13 1996-02-09

Country Status (4)

Country Link
US (1) US5733405A (https=)
JP (1) JPH08288096A (https=)
KR (1) KR100223394B1 (https=)
TW (1) TW314685B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI559818B (zh) * 2012-01-18 2016-11-21 東京威力科創股份有限公司 Substrate processing device

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US6000360A (en) * 1996-07-03 1999-12-14 Tokyo Electron Limited Plasma processing apparatus
US6168690B1 (en) * 1997-09-29 2001-01-02 Lam Research Corporation Methods and apparatus for physical vapor deposition
JP3364675B2 (ja) * 1997-09-30 2003-01-08 東京エレクトロンエイ・ティー株式会社 プラズマ処理装置
US6645353B2 (en) * 1997-12-31 2003-11-11 Intel Corporation Approach to optimizing an ILD argon sputter process
US6216632B1 (en) * 1998-01-29 2001-04-17 Anelva Corporation Plasma processing system
US6125789A (en) * 1998-01-30 2000-10-03 Applied Materials, Inc. Increasing the sensitivity of an in-situ particle monitor
US6146462A (en) * 1998-05-08 2000-11-14 Astenjohnson, Inc. Structures and components thereof having a desired surface characteristic together with methods and apparatuses for producing the same
US6287687B1 (en) 1998-05-08 2001-09-11 Asten, Inc. Structures and components thereof having a desired surface characteristic together with methods and apparatuses for producing the same
US5935272A (en) * 1999-02-02 1999-08-10 Milliken & Company Compositions comprising aryloxypolyoxyalkylene naphthalimide derivative colorants
JP4307628B2 (ja) * 1999-05-19 2009-08-05 キヤノンアネルバ株式会社 Ｃｃｐ反応容器の平板型ガス導入装置
JP2001023959A (ja) 1999-07-05 2001-01-26 Mitsubishi Electric Corp プラズマ処理装置
US6610184B2 (en) * 2001-11-14 2003-08-26 Applied Materials, Inc. Magnet array in conjunction with rotating magnetron for plasma sputtering
US10047430B2 (en) 1999-10-08 2018-08-14 Applied Materials, Inc. Self-ionized and inductively-coupled plasma for sputtering and resputtering
US8696875B2 (en) * 1999-10-08 2014-04-15 Applied Materials, Inc. Self-ionized and inductively-coupled plasma for sputtering and resputtering
FR2799921B1 (fr) * 1999-10-19 2002-01-11 Metal Process Procede de production d'un plasma par decharges a barriere multipolaire de type capacitif, et dispositif pour la mise en oeuvre d'un tel procede
JP2002075969A (ja) 2000-08-25 2002-03-15 Hitachi Ltd プラズマ処理装置
JP4606637B2 (ja) * 2001-04-12 2011-01-05 キヤノンアネルバ株式会社 マグネトロン型平行平板表面処理装置
US20030024478A1 (en) 2001-08-06 2003-02-06 Anelva Corporation Surface processing apparatus
US7041201B2 (en) * 2001-11-14 2006-05-09 Applied Materials, Inc. Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith
DE10326135B4 (de) * 2002-06-12 2014-12-24 Ulvac, Inc. Entladungsplasma-Bearbeitungsanlage
JP3823069B2 (ja) * 2002-06-12 2006-09-20 株式会社アルバック 磁気中性線放電プラズマ処理装置
US7504006B2 (en) * 2002-08-01 2009-03-17 Applied Materials, Inc. Self-ionized and capacitively-coupled plasma for sputtering and resputtering
US7032536B2 (en) * 2002-10-11 2006-04-25 Sharp Kabushiki Kaisha Thin film formation apparatus including engagement members for support during thermal expansion
US7273638B2 (en) * 2003-01-07 2007-09-25 International Business Machines Corp. High density plasma oxidation
JP2006073790A (ja) * 2004-09-02 2006-03-16 Tokyo Institute Of Technology プラズマエッチング装置
KR100738875B1 (ko) * 2006-02-15 2007-07-12 주식회사 에스에프에이 평면디스플레이용 화학 기상 증착장치
PT2251454E (pt) 2009-05-13 2014-10-01 Sio2 Medical Products Inc Revestimento e inspeção de vaso
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
JP5711581B2 (ja) * 2011-03-25 2015-05-07 東京エレクトロン株式会社 プラズマ処理装置
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
CA2855353C (en) 2011-11-11 2021-01-19 Sio2 Medical Products, Inc. Passivation, ph protective or lubricity coating for pharmaceutical package, coating process and apparatus
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
JP2013122080A (ja) * 2011-12-12 2013-06-20 Ulvac Japan Ltd スパッタリング装置
JP6009171B2 (ja) * 2012-02-14 2016-10-19 東京エレクトロン株式会社 基板処理装置
EP2846755A1 (en) 2012-05-09 2015-03-18 SiO2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
US20150297800A1 (en) 2012-07-03 2015-10-22 Sio2 Medical Products, Inc. SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS
EP2720059B1 (en) * 2012-10-15 2015-03-11 MagCam NV Devices and methods for determining a magnetic field distribution of a magnet along a main surface of said magnet.
US9664626B2 (en) 2012-11-01 2017-05-30 Sio2 Medical Products, Inc. Coating inspection method
WO2014078666A1 (en) 2012-11-16 2014-05-22 Sio2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
AU2013352436B2 (en) 2012-11-30 2018-10-25 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition on medical syringes, cartridges, and the like
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
US9662450B2 (en) 2013-03-01 2017-05-30 Sio2 Medical Products, Inc. Plasma or CVD pre-treatment for lubricated pharmaceutical package, coating process and apparatus
CN105392916B (zh) 2013-03-11 2019-03-08 Sio2医药产品公司 涂布包装材料
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
EP2971227B1 (en) 2013-03-15 2017-11-15 Si02 Medical Products, Inc. Coating method.
WO2015148471A1 (en) 2014-03-28 2015-10-01 Sio2 Medical Products, Inc. Antistatic coatings for plastic vessels
US9663780B2 (en) 2014-10-15 2017-05-30 Alpaqua Engineering, LLC Solid-core ring-magnet
JP5938809B2 (ja) * 2014-12-15 2016-06-22 国立大学法人名古屋大学 分子線エピタキシー装置
KR102786617B1 (ko) 2015-08-18 2025-03-26 에스아이오2 메디컬 프로덕츠, 엘엘씨 산소 전달률이 낮은, 의약품 및 다른 제품의 포장용기
JP6865417B2 (ja) * 2016-09-23 2021-04-28 国立大学法人茨城大学 除電装置
US10504705B2 (en) * 2017-09-15 2019-12-10 Applied Materials, Inc. Physical vapor deposition chamber with static magnet assembly and methods of sputtering
JP7055054B2 (ja) * 2018-04-11 2022-04-15 東京エレクトロン株式会社 プラズマ処理装置、プラズマ制御方法、及びプラズマ制御プログラム
MA53439A (fr) 2018-08-23 2021-06-30 Alpaqua Eng Llc Aimant à noyau solide
US11242519B2 (en) 2018-08-23 2022-02-08 Alpaqua Engineering, LLC Discontinuous wall hollow core magnet
US12372497B2 (en) 2021-08-18 2025-07-29 Alpaqua Engineering, LLC Plate cushion device having a compression gap lock
KR20240016800A (ko) 2022-07-29 2024-02-06 삼성전자주식회사 플라즈마 처리 장치

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JPS5324303B2 (https=) * 1975-01-31 1978-07-20
JPH0834205B2 (ja) * 1986-11-21 1996-03-29 株式会社東芝 ドライエツチング装置
JPS6473725A (en) * 1987-09-16 1989-03-20 Matsushita Electric Industrial Co Ltd Etching device
DE4018954A1 (de) * 1989-06-15 1991-01-03 Mitsubishi Electric Corp Trockenaetzgeraet
US5279669A (en) * 1991-12-13 1994-01-18 International Business Machines Corporation Plasma reactor for processing substrates comprising means for inducing electron cyclotron resonance (ECR) and ion cyclotron resonance (ICR) conditions

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI559818B (zh) * 2012-01-18 2016-11-21 東京威力科創股份有限公司 Substrate processing device
US10651012B2 (en) 2012-01-18 2020-05-12 Tokyo Electron Limited Substrate processing method

Also Published As

Publication number Publication date
US5733405A (en) 1998-03-31
KR960032626A (ko) 1996-09-17
KR100223394B1 (ko) 1999-10-15
JPH08288096A (ja) 1996-11-01

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MM4A Annulment or lapse of patent due to non-payment of fees