TW311267B - - Google Patents

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Publication number
TW311267B
TW311267B TW083107058A TW83107058A TW311267B TW 311267 B TW311267 B TW 311267B TW 083107058 A TW083107058 A TW 083107058A TW 83107058 A TW83107058 A TW 83107058A TW 311267 B TW311267 B TW 311267B
Authority
TW
Taiwan
Prior art keywords
envelope
patent application
microns
sealed
active electronic
Prior art date
Application number
TW083107058A
Other languages
English (en)
Chinese (zh)
Inventor
Shen Nelson
Von Der Lippe Paul
Original Assignee
Raychem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raychem Ltd filed Critical Raychem Ltd
Application granted granted Critical
Publication of TW311267B publication Critical patent/TW311267B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/068—Hermetically-sealed casings having a pressure compensation device, e.g. membrane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0039—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a tubular housing wherein the PCB is inserted longitudinally
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Combinations Of Printed Boards (AREA)
  • Casings For Electric Apparatus (AREA)
TW083107058A 1994-04-11 1994-08-02 TW311267B (US07923587-20110412-C00022.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US22614994A 1994-04-11 1994-04-11

Publications (1)

Publication Number Publication Date
TW311267B true TW311267B (US07923587-20110412-C00022.png) 1997-07-21

Family

ID=22847763

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083107058A TW311267B (US07923587-20110412-C00022.png) 1994-04-11 1994-08-02

Country Status (4)

Country Link
US (1) US5739463A (US07923587-20110412-C00022.png)
CO (1) CO4410220A1 (US07923587-20110412-C00022.png)
TW (1) TW311267B (US07923587-20110412-C00022.png)
ZA (1) ZA952562B (US07923587-20110412-C00022.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110313222A (zh) * 2017-06-15 2019-10-08 株式会社Lg化学 部分模制基板和部分模制装置和方法

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811050A (en) * 1994-06-06 1998-09-22 Gabower; John F. Electromagnetic interference shield for electronic devices
JP3300254B2 (ja) * 1997-04-28 2002-07-08 矢崎総業株式会社 樹脂被覆実装基板及びその製造方法
US5867371A (en) * 1997-09-29 1999-02-02 Ericsson Inc. Cover member for sealed circuit board assembly
US6097613A (en) * 1997-12-12 2000-08-01 Nortel Networks Limited Assemblies of electronic devices and flexible containers therefor
US6094361A (en) * 1997-12-12 2000-07-25 Nortel Networks Corporation Assemblies of printed circuit boards and flexible containers therefor
US6147879A (en) * 1997-12-12 2000-11-14 Nortel Networks Limited Assemblies of electrical devices and flexible containers therefor
US5968386A (en) * 1997-12-18 1999-10-19 Ford Motor Company Method for protecting electronic components
US6134121A (en) * 1998-02-02 2000-10-17 Motorola, Inc. Housing assembly utilizing a heat shrinkable composite laminate
US6140576A (en) * 1998-04-06 2000-10-31 Motorola, Inc. Protective shield tent and method of using same
US6405139B1 (en) * 1998-09-15 2002-06-11 Bently Nevada Corporation System for monitoring plant assets including machinery
US6219258B1 (en) * 1999-01-29 2001-04-17 Ericsson Inc. Electronic enclosure with improved environmental protection
US6205796B1 (en) * 1999-03-29 2001-03-27 International Business Machines Corporation Sub-dew point cooling of electronic systems
US6974961B1 (en) * 1999-09-17 2005-12-13 Regenesis Biomedical, Inc. Cover for electromagnetic treatment applicator
US6538196B1 (en) 1999-10-28 2003-03-25 Ericsson Inc. Electric module structure formed with a polymer shrunk material
JP3876109B2 (ja) * 2000-03-29 2007-01-31 松下電器産業株式会社 電子回路形成品の製造方法
US6768654B2 (en) * 2000-09-18 2004-07-27 Wavezero, Inc. Multi-layered structures and methods for manufacturing the multi-layered structures
CN1463570A (zh) * 2001-05-25 2003-12-24 皇家菲利浦电子有限公司 具有在其上设置了印刷电路的印刷电路板和与所述印刷电路电连接的电部件的系统
US20050098457A1 (en) * 2002-01-23 2005-05-12 Hamel Steven V. Packaging
EP1331839B1 (en) * 2002-01-23 2008-05-14 Advanced Technology Materials, Inc. Electronic component packaging
US6674652B2 (en) * 2002-01-29 2004-01-06 3Com Corporation Integrated shield wrap
US7161092B2 (en) * 2002-04-15 2007-01-09 Visteon Global Technologies, Inc. Apparatus and method for protecting an electronic circuit
GB2395600B (en) * 2002-11-19 2004-10-20 Mbm Technology Ltd Ruggedised solid-state storage device
JP3979301B2 (ja) * 2003-02-19 2007-09-19 株式会社デンソー インサート成形工法
JP2004312622A (ja) * 2003-04-10 2004-11-04 Alps Electric Co Ltd 衛星放送受信用コンバータ
TWI288869B (en) * 2003-04-11 2007-10-21 Quanta Comp Inc Front-end bus module of computer
CA2528889C (en) * 2003-06-26 2010-05-11 Formation, Inc. Environmental protection of serial ata and other electronic devices
MXPA06002396A (es) * 2003-09-01 2006-06-20 Siemens Ag Dispositivo de proteccion para componentes electronicos.
US20050050854A1 (en) * 2003-09-09 2005-03-10 Jean-Pascal Zambaux Sterile, pyrogen-free, polymeric film-based heating bag
US7576991B2 (en) * 2004-01-13 2009-08-18 Taisei Plas Co., Ltd. Electrical equipment for junction and method of manufacturing the same
US7146721B2 (en) * 2004-03-15 2006-12-12 Delphi Technologies, Inc. Method of manufacturing a sealed electronic module
US7468860B1 (en) 2004-03-19 2008-12-23 Desai Shrikant M Hook and loop device applied to control shock and vibration of critical components
US7070450B2 (en) * 2004-09-28 2006-07-04 Billionton Systems Inc. Information device
US7757384B2 (en) * 2005-07-13 2010-07-20 Macauley Andrew S Apparatus for forming a hermetic seal about a cable extending from a waterproof pouch
US20070062823A1 (en) * 2005-09-16 2007-03-22 The Lazy Joe Paint Wrapper Company Wrapper for painting devices
GB0606108D0 (en) * 2006-03-28 2006-05-03 Forensic Science Service Ltd Improvements in and relating to isolation
US20080085390A1 (en) 2006-10-04 2008-04-10 Ryan Thomas Neill Encapsulation of electrically energized articles
US8287991B2 (en) * 2006-10-04 2012-10-16 Eastman Chemical Company Using branched polymers to control the dimensional stability of articles in the lamination process
TWI340625B (en) * 2007-11-07 2011-04-11 Wistron Corp Shielding device and method of making the same
US7908742B2 (en) * 2008-03-25 2011-03-22 Commercial Vehicle Group, Inc. Method of forming a protective covering for a wire harness
US7965495B2 (en) * 2008-10-13 2011-06-21 Apple Inc. Battery connector structures for electronic devices
JP2011100718A (ja) * 2009-10-05 2011-05-19 Yazaki Corp コネクタ
US20130125956A1 (en) 2010-01-07 2013-05-23 Bruce Furman Moisture-proof expansion chamber for equalizing pressure in sealed concentrator photovoltaic solar modules
US8723053B2 (en) * 2011-03-09 2014-05-13 Select Fabricators, Inc. Electromagnetically shielded enclosure with operable interfaces
US9150006B2 (en) 2011-06-23 2015-10-06 Eastman Chemical Company Lamination process optimization utilizing neopentyl glycol-modified polyesters
JP5525574B2 (ja) * 2012-08-07 2014-06-18 ホシデン株式会社 部品モジュール及び部品モジュールの製造方法
DE102012112220A1 (de) * 2012-12-13 2014-06-18 Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG Steckverbindungseinheit, Sensoreinheit sowie ein Verfahren zur Herstellung einer Steckverbindungseinheit
EP2954762B1 (en) * 2013-02-06 2022-04-06 The Board of Trustees of the University of Illinois Stretchable electronic systems with containment chambers
US9613911B2 (en) 2013-02-06 2017-04-04 The Board Of Trustees Of The University Of Illinois Self-similar and fractal design for stretchable electronics
US10840536B2 (en) 2013-02-06 2020-11-17 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with containment chambers
US10497633B2 (en) 2013-02-06 2019-12-03 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with fluid containment
EP3105521B1 (en) 2014-01-23 2020-01-08 Stasis Lmps Limited Flexible panel and sealable bag with sorbent
DE102014104006A1 (de) * 2014-03-24 2015-09-24 Phoenix Contact Gmbh & Co. Kg Gehäuse
DE102014106840A1 (de) * 2014-05-15 2015-11-19 Hella Kgaa Hueck & Co. Steuervorrichtung
US11060754B2 (en) 2015-06-05 2021-07-13 Novinium, Inc. Ventilation system for manhole vault
US10962253B2 (en) 2015-06-05 2021-03-30 Novinium, Inc. Systems for circulating air inside a manhole vault
US10462904B2 (en) 2015-11-27 2019-10-29 Kyocera Corporation Electronic component mounting package and electronic device
US10136517B2 (en) * 2015-11-27 2018-11-20 Kyocera Corporation Electronic component mounting package and electronic device
US10684031B2 (en) 2016-03-31 2020-06-16 Novinium, Inc. Smart system for manhole event suppression system
KR20170123747A (ko) * 2016-04-29 2017-11-09 삼성전자주식회사 차폐 부재 및 그를 포함하는 전자 장치
US20180242970A1 (en) * 2017-02-28 2018-08-30 Covidien Lp Reusable powered surgical devices having improved durability
US10517184B2 (en) 2018-02-09 2019-12-24 Eaton Intelligent Power Limited Configurable electronics packages
US10383253B1 (en) * 2018-03-27 2019-08-13 Nio Usa, Inc. Sealable multi-surface electronics thermal conduction package
US11408859B2 (en) * 2018-09-14 2022-08-09 Shenzhen Lepuyuan Medical Technology Co., Ltd. Ultrasonic probe coupling assembly and ultrasonic probe assembly
US11369043B2 (en) * 2018-10-18 2022-06-21 Mitsubishi Electric Corporation Board housing case
CN110113865A (zh) * 2019-05-28 2019-08-09 苏州福莱盈电子有限公司 一种防止高频信号泄露的线路板结构及其制作方法
US10763612B1 (en) 2019-08-20 2020-09-01 Honeywell Federal Manufacturing & Technologies, Llc Electronic connector sealing system

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3909504A (en) * 1973-11-05 1975-09-30 Carrier Tel Corp America Inc Ruggedized package for electronic components and the like
GB1446541A (en) * 1975-03-11 1976-08-18 Standard Telephones Cables Ltd Hermetically sealed hybrid circuit package
JPS54156023A (en) * 1978-05-31 1979-12-08 Tokyo Shibaura Electric Co Sealing air tight container
US4865905A (en) * 1983-06-23 1989-09-12 Raychem Corporation Article for protection of a substrate
US4572846A (en) * 1983-11-18 1986-02-25 Motorola, Inc. Method of hermetically sealing electronic packages
US4557379A (en) * 1983-12-16 1985-12-10 Lane Container Company Circuit board package and method of manufacture
US4637943A (en) * 1984-09-17 1987-01-20 Simmonds Precision Sealed split instrument housing with foil-backed acrylic transfer adhesive tearband
US4631214A (en) * 1984-12-24 1986-12-23 Fukuvi Chemical Industry Co., Ltd. Transparent electromagnetic wave shielding material
US4774148A (en) * 1984-12-28 1988-09-27 Showa Laminate Printing Co., Ltd. Composite sheet material for magnetic and electronic shielding and product obtained therefrom
SE446924B (sv) * 1985-02-22 1986-10-13 Devex Sa Sett vid utforande av en for elektromagnetisk stralning vesentligen opak skerm
US4695926A (en) * 1986-07-01 1987-09-22 Bell Of Pennsylvania Encapsulation and insulation of electronic circuit board structures
KR960015106B1 (ko) * 1986-11-25 1996-10-28 가부시기가이샤 히다찌세이사꾸쇼 면실장형 반도체패키지 포장체
US4858075A (en) * 1987-01-30 1989-08-15 Bell Of Pennsylvania RF shielded and electrically insulated circuit board structure and method of making same
US4852646A (en) * 1987-06-16 1989-08-01 Raychem Corporation Thermally conductive gel materials
JPH0731513Y2 (ja) * 1987-09-18 1995-07-19 矢崎総業株式会社 電気接続箱
US4912103A (en) * 1988-05-05 1990-03-27 Jefferson Smurfit Corporation Water vapor barrier laminate for packaging
JPH0278372U (US07923587-20110412-C00022.png) * 1988-12-06 1990-06-15
JPH0634152Y2 (ja) * 1988-12-08 1994-09-07 多機能カード
US5226210A (en) * 1989-01-23 1993-07-13 Minnesota Mining And Manufacturing Company Method of forming metal fiber mat/polymer composite
US4965408A (en) * 1989-02-01 1990-10-23 Borden, Inc. Composite sheet material for electromagnetic radiation shielding
ATE146297T1 (de) * 1989-05-10 1996-12-15 Raychem Corp Mit einem säurefänger impregniertes filzmaterial
US5459729C1 (en) * 1989-07-25 2002-03-19 Raychem Corp Digital added main line system
US5170009A (en) * 1990-03-22 1992-12-08 Canon Kabushiki Kaisha Electrically conductive covers and electrically conductive covers of electronic equipment
FR2666190B1 (fr) * 1990-08-24 1996-07-12 Thomson Csf Procede et dispositif d'encapsulation hermetique de composants electroniques.
US5111497A (en) * 1990-09-17 1992-05-05 Raychem Corporation Alarm and test system for a digital added main line
US5376019A (en) * 1990-09-17 1994-12-27 Raychem Corporation Gel filled modular electrical connecting block
US5246383A (en) * 1990-09-17 1993-09-21 Raychem Corporation Gel filled electrical connector
ES2139592T3 (es) * 1990-09-18 2000-02-16 Raychem Corp Miembro de sellado y procedimientos de sellado.
JP2996507B2 (ja) * 1990-11-02 2000-01-11 電気化学工業株式会社 金属板ベース回路基板
JP2925722B2 (ja) * 1990-11-30 1999-07-28 三井化学株式会社 ハーメチックシール型電気回路装置
GB9107864D0 (en) * 1991-04-12 1991-05-29 Raychem Sa Nv Environmental sealing
DE4217837B4 (de) * 1991-05-29 2006-04-27 Mitsubishi Denki K.K. Hermetisch abgeschlossenes Gehäuse
DE4129238A1 (de) * 1991-09-03 1993-03-04 Bosch Gmbh Robert Elektrisches geraet, insbesondere schalt- und steuergeraet fuer kraftfahrzeuge
US5136119A (en) * 1991-09-18 1992-08-04 The United States Of America As Represented By The Secretaty Of The Navy Lightweight portable EMI shielding container
DE4229727A1 (de) * 1992-09-05 1994-03-10 Bosch Gmbh Robert Elektrisches Gerät, insbesondere Schalt- oder Steuergerät für Kraftfahrzeuge
US5285619A (en) * 1992-10-06 1994-02-15 Williams International Corporation Self tooling, molded electronics packaging
US5319522A (en) * 1992-12-17 1994-06-07 Ford Motor Company Encapsulated product and method of manufacture
US5378879A (en) * 1993-04-20 1995-01-03 Raychem Corporation Induction heating of loaded materials
US5436803A (en) * 1993-12-16 1995-07-25 Schlegel Corporation Emi shielding having flexible conductive envelope

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110313222A (zh) * 2017-06-15 2019-10-08 株式会社Lg化学 部分模制基板和部分模制装置和方法
CN110313222B (zh) * 2017-06-15 2022-04-01 株式会社Lg新能源 部分模制基板和部分模制装置和方法

Also Published As

Publication number Publication date
US5739463A (en) 1998-04-14
CO4410220A1 (es) 1997-01-09
ZA952562B (en) 1995-12-21

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