ZA952562B - Sealed electronic packaging for environmental protection of active electronics - Google Patents
Sealed electronic packaging for environmental protection of active electronicsInfo
- Publication number
- ZA952562B ZA952562B ZA952562A ZA952562A ZA952562B ZA 952562 B ZA952562 B ZA 952562B ZA 952562 A ZA952562 A ZA 952562A ZA 952562 A ZA952562 A ZA 952562A ZA 952562 B ZA952562 B ZA 952562B
- Authority
- ZA
- South Africa
- Prior art keywords
- environmental protection
- electronic packaging
- sealed electronic
- active electronics
- electronics
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/068—Hermetically-sealed casings having a pressure compensation device, e.g. membrane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0039—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a tubular housing wherein the PCB is inserted longitudinally
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US22614994A | 1994-04-11 | 1994-04-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA952562B true ZA952562B (en) | 1995-12-21 |
Family
ID=22847763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA952562A ZA952562B (en) | 1994-04-11 | 1995-03-29 | Sealed electronic packaging for environmental protection of active electronics |
Country Status (4)
Country | Link |
---|---|
US (1) | US5739463A (xx) |
CO (1) | CO4410220A1 (xx) |
TW (1) | TW311267B (xx) |
ZA (1) | ZA952562B (xx) |
Families Citing this family (67)
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US5811050A (en) * | 1994-06-06 | 1998-09-22 | Gabower; John F. | Electromagnetic interference shield for electronic devices |
JP3300254B2 (ja) * | 1997-04-28 | 2002-07-08 | 矢崎総業株式会社 | 樹脂被覆実装基板及びその製造方法 |
US5867371A (en) * | 1997-09-29 | 1999-02-02 | Ericsson Inc. | Cover member for sealed circuit board assembly |
US6097613A (en) * | 1997-12-12 | 2000-08-01 | Nortel Networks Limited | Assemblies of electronic devices and flexible containers therefor |
US6147879A (en) * | 1997-12-12 | 2000-11-14 | Nortel Networks Limited | Assemblies of electrical devices and flexible containers therefor |
US6094361A (en) * | 1997-12-12 | 2000-07-25 | Nortel Networks Corporation | Assemblies of printed circuit boards and flexible containers therefor |
US5968386A (en) * | 1997-12-18 | 1999-10-19 | Ford Motor Company | Method for protecting electronic components |
US6134121A (en) * | 1998-02-02 | 2000-10-17 | Motorola, Inc. | Housing assembly utilizing a heat shrinkable composite laminate |
US6140576A (en) * | 1998-04-06 | 2000-10-31 | Motorola, Inc. | Protective shield tent and method of using same |
US6405139B1 (en) * | 1998-09-15 | 2002-06-11 | Bently Nevada Corporation | System for monitoring plant assets including machinery |
US6219258B1 (en) * | 1999-01-29 | 2001-04-17 | Ericsson Inc. | Electronic enclosure with improved environmental protection |
US6205796B1 (en) * | 1999-03-29 | 2001-03-27 | International Business Machines Corporation | Sub-dew point cooling of electronic systems |
US6974961B1 (en) * | 1999-09-17 | 2005-12-13 | Regenesis Biomedical, Inc. | Cover for electromagnetic treatment applicator |
US6538196B1 (en) | 1999-10-28 | 2003-03-25 | Ericsson Inc. | Electric module structure formed with a polymer shrunk material |
JP3876109B2 (ja) * | 2000-03-29 | 2007-01-31 | 松下電器産業株式会社 | 電子回路形成品の製造方法 |
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CN1463570A (zh) * | 2001-05-25 | 2003-12-24 | 皇家菲利浦电子有限公司 | 具有在其上设置了印刷电路的印刷电路板和与所述印刷电路电连接的电部件的系统 |
US20050098457A1 (en) * | 2002-01-23 | 2005-05-12 | Hamel Steven V. | Packaging |
EP1331839B1 (en) * | 2002-01-23 | 2008-05-14 | Advanced Technology Materials, Inc. | Electronic component packaging |
US6674652B2 (en) * | 2002-01-29 | 2004-01-06 | 3Com Corporation | Integrated shield wrap |
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GB2395600B (en) * | 2002-11-19 | 2004-10-20 | Mbm Technology Ltd | Ruggedised solid-state storage device |
JP3979301B2 (ja) * | 2003-02-19 | 2007-09-19 | 株式会社デンソー | インサート成形工法 |
JP2004312622A (ja) * | 2003-04-10 | 2004-11-04 | Alps Electric Co Ltd | 衛星放送受信用コンバータ |
TWI288869B (en) * | 2003-04-11 | 2007-10-21 | Quanta Comp Inc | Front-end bus module of computer |
EP1645172A4 (en) * | 2003-06-26 | 2009-06-24 | Formation Inc | ENVIRONMENTAL PROTECTION OF SERIAL ATA AND OTHER ELECTRONIC EQUIPMENT |
DE502004003168D1 (de) * | 2003-09-01 | 2007-04-19 | Siemens Ag | Schutzvorrichtung für elektronische komponenten |
US20050050854A1 (en) * | 2003-09-09 | 2005-03-10 | Jean-Pascal Zambaux | Sterile, pyrogen-free, polymeric film-based heating bag |
WO2005069462A1 (ja) * | 2004-01-13 | 2005-07-28 | Taisei Plas Co., Ltd. | ジャンクション用電装品とその製造方法 |
US7146721B2 (en) * | 2004-03-15 | 2006-12-12 | Delphi Technologies, Inc. | Method of manufacturing a sealed electronic module |
US7468860B1 (en) | 2004-03-19 | 2008-12-23 | Desai Shrikant M | Hook and loop device applied to control shock and vibration of critical components |
US7070450B2 (en) * | 2004-09-28 | 2006-07-04 | Billionton Systems Inc. | Information device |
US7757384B2 (en) * | 2005-07-13 | 2010-07-20 | Macauley Andrew S | Apparatus for forming a hermetic seal about a cable extending from a waterproof pouch |
US20070062823A1 (en) * | 2005-09-16 | 2007-03-22 | The Lazy Joe Paint Wrapper Company | Wrapper for painting devices |
GB0606108D0 (en) * | 2006-03-28 | 2006-05-03 | Forensic Science Service Ltd | Improvements in and relating to isolation |
US8287991B2 (en) * | 2006-10-04 | 2012-10-16 | Eastman Chemical Company | Using branched polymers to control the dimensional stability of articles in the lamination process |
US20080085390A1 (en) * | 2006-10-04 | 2008-04-10 | Ryan Thomas Neill | Encapsulation of electrically energized articles |
TWI340625B (en) * | 2007-11-07 | 2011-04-11 | Wistron Corp | Shielding device and method of making the same |
US7908742B2 (en) * | 2008-03-25 | 2011-03-22 | Commercial Vehicle Group, Inc. | Method of forming a protective covering for a wire harness |
US7965495B2 (en) * | 2008-10-13 | 2011-06-21 | Apple Inc. | Battery connector structures for electronic devices |
JP2011100718A (ja) * | 2009-10-05 | 2011-05-19 | Yazaki Corp | コネクタ |
US20130125956A1 (en) | 2010-01-07 | 2013-05-23 | Bruce Furman | Moisture-proof expansion chamber for equalizing pressure in sealed concentrator photovoltaic solar modules |
US8723053B2 (en) * | 2011-03-09 | 2014-05-13 | Select Fabricators, Inc. | Electromagnetically shielded enclosure with operable interfaces |
US9150006B2 (en) | 2011-06-23 | 2015-10-06 | Eastman Chemical Company | Lamination process optimization utilizing neopentyl glycol-modified polyesters |
JP5525574B2 (ja) * | 2012-08-07 | 2014-06-18 | ホシデン株式会社 | 部品モジュール及び部品モジュールの製造方法 |
DE102012112220A1 (de) * | 2012-12-13 | 2014-06-18 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG | Steckverbindungseinheit, Sensoreinheit sowie ein Verfahren zur Herstellung einer Steckverbindungseinheit |
US10840536B2 (en) | 2013-02-06 | 2020-11-17 | The Board Of Trustees Of The University Of Illinois | Stretchable electronic systems with containment chambers |
US9613911B2 (en) | 2013-02-06 | 2017-04-04 | The Board Of Trustees Of The University Of Illinois | Self-similar and fractal design for stretchable electronics |
US10497633B2 (en) | 2013-02-06 | 2019-12-03 | The Board Of Trustees Of The University Of Illinois | Stretchable electronic systems with fluid containment |
CN105340369A (zh) * | 2013-02-06 | 2016-02-17 | 伊利诺伊大学评议会 | 具有容纳室的可拉伸的电子系统 |
US20160332107A1 (en) | 2014-01-23 | 2016-11-17 | Stasis Lmps Limited | Flexible panel and sealable bag with sorbent |
DE102014104006A1 (de) * | 2014-03-24 | 2015-09-24 | Phoenix Contact Gmbh & Co. Kg | Gehäuse |
DE102014106840A1 (de) * | 2014-05-15 | 2015-11-19 | Hella Kgaa Hueck & Co. | Steuervorrichtung |
US11060754B2 (en) | 2015-06-05 | 2021-07-13 | Novinium, Inc. | Ventilation system for manhole vault |
US10962253B2 (en) | 2015-06-05 | 2021-03-30 | Novinium, Inc. | Systems for circulating air inside a manhole vault |
US10462904B2 (en) | 2015-11-27 | 2019-10-29 | Kyocera Corporation | Electronic component mounting package and electronic device |
CN107924880B (zh) * | 2015-11-27 | 2020-11-24 | 京瓷株式会社 | 电子部件搭载用封装体以及电子装置 |
WO2017173402A2 (en) | 2016-03-31 | 2017-10-05 | Novinium, Inc. | Smart system for manhole event suppression system |
KR20170123747A (ko) * | 2016-04-29 | 2017-11-09 | 삼성전자주식회사 | 차폐 부재 및 그를 포함하는 전자 장치 |
US20180242970A1 (en) * | 2017-02-28 | 2018-08-30 | Covidien Lp | Reusable powered surgical devices having improved durability |
KR102186090B1 (ko) * | 2017-06-15 | 2020-12-03 | 주식회사 엘지화학 | 부분 몰딩 처리된 기판과 부분 몰딩 장치 및 방법 |
US10517184B2 (en) | 2018-02-09 | 2019-12-24 | Eaton Intelligent Power Limited | Configurable electronics packages |
US10383253B1 (en) * | 2018-03-27 | 2019-08-13 | Nio Usa, Inc. | Sealable multi-surface electronics thermal conduction package |
US11408859B2 (en) * | 2018-09-14 | 2022-08-09 | Shenzhen Lepuyuan Medical Technology Co., Ltd. | Ultrasonic probe coupling assembly and ultrasonic probe assembly |
WO2020079801A1 (ja) * | 2018-10-18 | 2020-04-23 | 三菱電機株式会社 | 基板収納筐体 |
CN110113865A (zh) * | 2019-05-28 | 2019-08-09 | 苏州福莱盈电子有限公司 | 一种防止高频信号泄露的线路板结构及其制作方法 |
US10763612B1 (en) | 2019-08-20 | 2020-09-01 | Honeywell Federal Manufacturing & Technologies, Llc | Electronic connector sealing system |
Family Cites Families (39)
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US3909504A (en) * | 1973-11-05 | 1975-09-30 | Carrier Tel Corp America Inc | Ruggedized package for electronic components and the like |
GB1446541A (en) * | 1975-03-11 | 1976-08-18 | Standard Telephones Cables Ltd | Hermetically sealed hybrid circuit package |
JPS54156023A (en) * | 1978-05-31 | 1979-12-08 | Tokyo Shibaura Electric Co | Sealing air tight container |
US4865905A (en) * | 1983-06-23 | 1989-09-12 | Raychem Corporation | Article for protection of a substrate |
US4572846A (en) * | 1983-11-18 | 1986-02-25 | Motorola, Inc. | Method of hermetically sealing electronic packages |
US4557379A (en) * | 1983-12-16 | 1985-12-10 | Lane Container Company | Circuit board package and method of manufacture |
US4637943A (en) * | 1984-09-17 | 1987-01-20 | Simmonds Precision | Sealed split instrument housing with foil-backed acrylic transfer adhesive tearband |
US4631214A (en) * | 1984-12-24 | 1986-12-23 | Fukuvi Chemical Industry Co., Ltd. | Transparent electromagnetic wave shielding material |
US4774148A (en) * | 1984-12-28 | 1988-09-27 | Showa Laminate Printing Co., Ltd. | Composite sheet material for magnetic and electronic shielding and product obtained therefrom |
SE446924B (sv) * | 1985-02-22 | 1986-10-13 | Devex Sa | Sett vid utforande av en for elektromagnetisk stralning vesentligen opak skerm |
US4695926A (en) * | 1986-07-01 | 1987-09-22 | Bell Of Pennsylvania | Encapsulation and insulation of electronic circuit board structures |
KR960015106B1 (ko) * | 1986-11-25 | 1996-10-28 | 가부시기가이샤 히다찌세이사꾸쇼 | 면실장형 반도체패키지 포장체 |
US4858075A (en) * | 1987-01-30 | 1989-08-15 | Bell Of Pennsylvania | RF shielded and electrically insulated circuit board structure and method of making same |
US4852646A (en) * | 1987-06-16 | 1989-08-01 | Raychem Corporation | Thermally conductive gel materials |
JPH0731513Y2 (ja) * | 1987-09-18 | 1995-07-19 | 矢崎総業株式会社 | 電気接続箱 |
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JPH0278372U (xx) * | 1988-12-06 | 1990-06-15 | ||
JPH0634152Y2 (ja) * | 1988-12-08 | 1994-09-07 | 多機能カード | |
US5226210A (en) * | 1989-01-23 | 1993-07-13 | Minnesota Mining And Manufacturing Company | Method of forming metal fiber mat/polymer composite |
US4965408A (en) * | 1989-02-01 | 1990-10-23 | Borden, Inc. | Composite sheet material for electromagnetic radiation shielding |
KR920701993A (ko) * | 1989-05-10 | 1992-08-12 | 허버트 지. 버카드 | 케이블중의 폴리올레핀계 절연물의 균열을 감소시키는 장치 및 방법 |
US5459729C1 (en) * | 1989-07-25 | 2002-03-19 | Raychem Corp | Digital added main line system |
US5170009A (en) * | 1990-03-22 | 1992-12-08 | Canon Kabushiki Kaisha | Electrically conductive covers and electrically conductive covers of electronic equipment |
FR2666190B1 (fr) * | 1990-08-24 | 1996-07-12 | Thomson Csf | Procede et dispositif d'encapsulation hermetique de composants electroniques. |
US5111497A (en) * | 1990-09-17 | 1992-05-05 | Raychem Corporation | Alarm and test system for a digital added main line |
US5376019A (en) * | 1990-09-17 | 1994-12-27 | Raychem Corporation | Gel filled modular electrical connecting block |
US5246383A (en) * | 1990-09-17 | 1993-09-21 | Raychem Corporation | Gel filled electrical connector |
ES2139592T3 (es) * | 1990-09-18 | 2000-02-16 | Raychem Corp | Miembro de sellado y procedimientos de sellado. |
JP2996507B2 (ja) * | 1990-11-02 | 2000-01-11 | 電気化学工業株式会社 | 金属板ベース回路基板 |
JP2925722B2 (ja) * | 1990-11-30 | 1999-07-28 | 三井化学株式会社 | ハーメチックシール型電気回路装置 |
GB9107864D0 (en) * | 1991-04-12 | 1991-05-29 | Raychem Sa Nv | Environmental sealing |
DE4217837B4 (de) * | 1991-05-29 | 2006-04-27 | Mitsubishi Denki K.K. | Hermetisch abgeschlossenes Gehäuse |
DE4129238A1 (de) * | 1991-09-03 | 1993-03-04 | Bosch Gmbh Robert | Elektrisches geraet, insbesondere schalt- und steuergeraet fuer kraftfahrzeuge |
US5136119A (en) * | 1991-09-18 | 1992-08-04 | The United States Of America As Represented By The Secretaty Of The Navy | Lightweight portable EMI shielding container |
DE4229727A1 (de) * | 1992-09-05 | 1994-03-10 | Bosch Gmbh Robert | Elektrisches Gerät, insbesondere Schalt- oder Steuergerät für Kraftfahrzeuge |
US5285619A (en) * | 1992-10-06 | 1994-02-15 | Williams International Corporation | Self tooling, molded electronics packaging |
US5319522A (en) * | 1992-12-17 | 1994-06-07 | Ford Motor Company | Encapsulated product and method of manufacture |
US5378879A (en) * | 1993-04-20 | 1995-01-03 | Raychem Corporation | Induction heating of loaded materials |
US5436803A (en) * | 1993-12-16 | 1995-07-25 | Schlegel Corporation | Emi shielding having flexible conductive envelope |
-
1994
- 1994-08-02 TW TW083107058A patent/TW311267B/zh active
-
1995
- 1995-03-02 US US08/397,600 patent/US5739463A/en not_active Expired - Lifetime
- 1995-03-29 ZA ZA952562A patent/ZA952562B/xx unknown
- 1995-03-30 CO CO95012883A patent/CO4410220A1/es unknown
Also Published As
Publication number | Publication date |
---|---|
TW311267B (xx) | 1997-07-21 |
CO4410220A1 (es) | 1997-01-09 |
US5739463A (en) | 1998-04-14 |
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