TW308705B - - Google Patents

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Publication number
TW308705B
TW308705B TW085106244A TW85106244A TW308705B TW 308705 B TW308705 B TW 308705B TW 085106244 A TW085106244 A TW 085106244A TW 85106244 A TW85106244 A TW 85106244A TW 308705 B TW308705 B TW 308705B
Authority
TW
Taiwan
Prior art keywords
chamber
gas
lock chamber
pump
semiconductor
Prior art date
Application number
TW085106244A
Other languages
English (en)
Chinese (zh)
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW308705B publication Critical patent/TW308705B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/01—Manufacture or treatment
    • H10D48/04—Manufacture or treatment of devices having bodies comprising selenium or tellurium in uncombined form
    • H10D48/042—Preparation of foundation plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/18—Vacuum control means
    • H01J2237/184—Vacuum locks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW085106244A 1995-11-21 1996-05-25 TW308705B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950042623A KR100189981B1 (ko) 1995-11-21 1995-11-21 진공 시스템을 구비한 반도체 소자 제조장치

Publications (1)

Publication Number Publication Date
TW308705B true TW308705B (https=) 1997-06-21

Family

ID=19435018

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085106244A TW308705B (https=) 1995-11-21 1996-05-25

Country Status (7)

Country Link
US (2) US5833425A (https=)
EP (2) EP1017085A3 (https=)
JP (1) JP4008515B2 (https=)
KR (1) KR100189981B1 (https=)
CN (2) CN1242456C (https=)
DE (1) DE69616481T2 (https=)
TW (1) TW308705B (https=)

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DE4117969C2 (de) * 1991-05-31 2000-11-09 Balzers Ag Liechtenstein Vakuumkammer
KR100296651B1 (ko) * 1998-07-09 2001-10-26 윤종용 반도체진공설비및이를이용하는방법
US6161311A (en) * 1998-07-10 2000-12-19 Asm America, Inc. System and method for reducing particles in epitaxial reactors
US6016611A (en) * 1998-07-13 2000-01-25 Applied Komatsu Technology, Inc. Gas flow control in a substrate processing system
US6197119B1 (en) 1999-02-18 2001-03-06 Mks Instruments, Inc. Method and apparatus for controlling polymerized teos build-up in vacuum pump lines
US6238514B1 (en) 1999-02-18 2001-05-29 Mks Instruments, Inc. Apparatus and method for removing condensable aluminum vapor from aluminum etch effluent
KR100740905B1 (ko) * 2000-03-16 2007-07-19 엘지.필립스 엘시디 주식회사 고진공 스퍼터 장치
FR2807951B1 (fr) * 2000-04-20 2003-05-16 Cit Alcatel Procede et systeme de pompage des chambres de transfert d'equipement de semi-conducteur
US6568896B2 (en) 2001-03-21 2003-05-27 Applied Materials, Inc. Transfer chamber with side wall port
US6488745B2 (en) 2001-03-23 2002-12-03 Mks Instruments, Inc. Trap apparatus and method for condensable by-products of deposition reactions
US6701972B2 (en) 2002-01-11 2004-03-09 The Boc Group, Inc. Vacuum load lock, system including vacuum load lock, and associated methods
JP2005191494A (ja) * 2003-12-26 2005-07-14 Canon Inc 露光装置、デバイスの製造方法
US7695231B2 (en) * 2004-03-08 2010-04-13 Jusung Engineering Co., Ltd. Vacuum pumping system, driving method thereof, apparatus having the same, and method of transferring substrate using the same
US7253107B2 (en) * 2004-06-17 2007-08-07 Asm International N.V. Pressure control system
JP4335085B2 (ja) * 2004-07-05 2009-09-30 シーケーディ株式会社 真空圧力制御システム
JP4581602B2 (ja) * 2004-09-29 2010-11-17 株式会社島津製作所 真空処理装置
JP2006342688A (ja) * 2005-06-07 2006-12-21 Ebara Corp 真空排気システム
CN100468629C (zh) * 2005-07-20 2009-03-11 台达电子工业股份有限公司 真空控制系统
KR101121419B1 (ko) * 2005-08-30 2012-03-15 주성엔지니어링(주) 기판제조장치 및 이에 이용되는 진공펌핑방법과 벤팅방법
KR100665855B1 (ko) * 2006-02-01 2007-01-09 삼성전자주식회사 반도체 디바이스 제조설비의 진공장치 및 이를 이용한진공방법
EP2003235B1 (en) * 2006-03-31 2011-11-09 Kuraray Kuraflex Co., Ltd. Molded object having nonwoven fibrous structure
US7989173B2 (en) * 2006-12-27 2011-08-02 The Johns Hopkins University Detection and diagnosis of inflammatory disorders
KR101359401B1 (ko) * 2007-06-21 2014-02-10 주성엔지니어링(주) 고효율 박막 태양전지와 그 제조방법 및 제조장치
JP2009252953A (ja) * 2008-04-04 2009-10-29 Hitachi High-Technologies Corp 真空処理装置
JP2010153737A (ja) * 2008-12-26 2010-07-08 Hitachi High-Technologies Corp 真空処理装置
US8623141B2 (en) 2009-05-18 2014-01-07 Taiwan Semiconductor Manufacturing Co., Ltd. Piping system and control for semiconductor processing
WO2011149542A1 (en) * 2010-05-28 2011-12-01 Axcelis Technologies Inc. Active dew point sensing and load lock venting to prevent condensation of workpieces
EP2546300A1 (en) 2011-07-14 2013-01-16 Cytec Surface Specialties, S.A. Radiation curable aqueous dispersions
US20140116336A1 (en) * 2012-10-26 2014-05-01 Applied Materials, Inc. Substrate process chamber exhaust
KR102343637B1 (ko) 2019-06-13 2021-12-28 세메스 주식회사 기판 처리 장치 및 방법
US12523380B2 (en) 2021-08-16 2026-01-13 Applied Materials, Inc. Prevention of contamination of substrates during pressure changes in processing systems
US12278124B2 (en) * 2021-10-28 2025-04-15 Applied Materials, Inc. Model-based controlled load lock pumping scheme
CN119650456B (zh) * 2023-09-15 2025-12-12 北京北方华创微电子装备有限公司 负载锁定组件及半导体工艺设备

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Also Published As

Publication number Publication date
CN1152626A (zh) 1997-06-25
EP1017085A2 (en) 2000-07-05
DE69616481D1 (de) 2001-12-06
US5833425A (en) 1998-11-10
US6071350A (en) 2000-06-06
KR970030243A (ko) 1997-06-26
CN1242456C (zh) 2006-02-15
JP4008515B2 (ja) 2007-11-14
JPH09148265A (ja) 1997-06-06
EP1017085A3 (en) 2002-09-25
EP0776026A1 (en) 1997-05-28
CN1501445A (zh) 2004-06-02
KR100189981B1 (ko) 1999-06-01
DE69616481T2 (de) 2002-07-11
EP0776026B1 (en) 2001-10-31
CN1165637C (zh) 2004-09-08

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