TW294700B - - Google Patents

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Publication number
TW294700B
TW294700B TW084111048A TW84111048A TW294700B TW 294700 B TW294700 B TW 294700B TW 084111048 A TW084111048 A TW 084111048A TW 84111048 A TW84111048 A TW 84111048A TW 294700 B TW294700 B TW 294700B
Authority
TW
Taiwan
Prior art keywords
item
boric acid
acid compound
catalyst
curing
Prior art date
Application number
TW084111048A
Other languages
English (en)
Chinese (zh)
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Application granted granted Critical
Publication of TW294700B publication Critical patent/TW294700B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H10W74/47—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H10W70/69—
    • H10W70/695—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/19—Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/55—Boron-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
TW084111048A 1994-10-21 1995-10-19 TW294700B (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9421407A GB9421407D0 (en) 1994-10-21 1994-10-21 Curable epoxy resin accelerated by boric acid and its analogs

Publications (1)

Publication Number Publication Date
TW294700B true TW294700B (en:Method) 1997-01-01

Family

ID=10763298

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084111048A TW294700B (en:Method) 1994-10-21 1995-10-19

Country Status (7)

Country Link
EP (1) EP0787162A2 (en:Method)
JP (1) JPH10507481A (en:Method)
KR (1) KR970707199A (en:Method)
BR (1) BR9509395A (en:Method)
GB (1) GB9421407D0 (en:Method)
TW (1) TW294700B (en:Method)
WO (1) WO1996012752A2 (en:Method)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9421405D0 (en) 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
KR100431440B1 (ko) * 2001-05-04 2004-05-14 주식회사 엘지화학 에폭시 수지 조성물
KR100431439B1 (ko) * 2001-05-08 2004-05-14 주식회사 엘지화학 에폭시 수지 조성물
US7919567B2 (en) 2006-06-07 2011-04-05 Dow Global Technologies Llc Oligomeric halogenated chain extenders for preparing epoxy resins
US20080039595A1 (en) * 2006-06-07 2008-02-14 Joseph Gan Oligomeric halogenated chain extenders for preparing epoxy resins
CN102272190A (zh) * 2009-01-06 2011-12-07 陶氏环球技术有限责任公司 环氧树脂的金属稳定剂和增长方法
DE102009027826A1 (de) * 2009-04-29 2010-11-04 Evonik Degussa Gmbh Katalyse von Epoxidharzformulierungen
WO2012151171A1 (en) * 2011-05-02 2012-11-08 Dow Global Technologies Llc Trimethyl borate in epoxy resins
DE102022118570A1 (de) * 2022-07-25 2024-01-25 Alzchem Trostberg Gmbh Verfahren zur Herstellung einer Epoxidharz-Zusammensetzung zur Vorimprägnierung von Werkstoffen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050371B2 (ja) * 1981-10-30 1985-11-08 株式会社東芝 エポキシ樹脂組成物
JPH02103224A (ja) * 1988-10-12 1990-04-16 Three Bond Co Ltd エポキシ樹脂用潜在性硬化剤
JPH0340459A (ja) * 1989-07-07 1991-02-21 Nitto Denko Corp 半導体装置
SG43193A1 (en) * 1990-05-21 1997-10-17 Dow Chemical Co Latent catalysts cure-inhibited epoxy resin compositions and laminates prepared therfrom
JPH04284652A (ja) * 1991-03-13 1992-10-09 Nitto Denko Corp 半導体装置およびそれに用いる半導体封止用エポキシ樹脂組成物ならびにその製法

Also Published As

Publication number Publication date
EP0787162A2 (en) 1997-08-06
BR9509395A (pt) 1997-09-30
GB9421407D0 (en) 1994-12-07
WO1996012752A3 (en) 1996-07-18
KR970707199A (ko) 1997-12-01
WO1996012752A2 (en) 1996-05-02
JPH10507481A (ja) 1998-07-21

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