TW250597B - - Google Patents

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Publication number
TW250597B
TW250597B TW083105285A TW83105285A TW250597B TW 250597 B TW250597 B TW 250597B TW 083105285 A TW083105285 A TW 083105285A TW 83105285 A TW83105285 A TW 83105285A TW 250597 B TW250597 B TW 250597B
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Taiwan
Prior art keywords
housing
contact
ground contact
connector assembly
connector
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TW083105285A
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English (en)
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Framatome & Cie
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/735—Printed circuits including an angle between each other
    • H01R12/737—Printed circuits being substantially perpendicular to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6589—Shielding material individually surrounding or interposed between mutually spaced contacts with wires separated by conductive housing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/727—Coupling devices presenting arrays of contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6582—Shield structure with resilient means for engaging mating connector

Landscapes

  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

5〇597 —五、發明説明（ A7 B7 本發明偽有關一種用於印刷電路板之連接器總成’其 包括絶緣材料之一第一電連器部分與一第一外殼’並具有 一底部與兩相對側壁’而陽接觸部元件偽安裝於外殼底部 並以橫列及直行方式配置’並具有從外殼底部突出的部分 ，此突出部分可插入對應印刷電路板之孔洞中’以連接器 總成並包括一具有絶緣材料外殼的第二連接器部分’其俱 適於以一插入側及一安装於外殼且以對應之橫列與直行方 式配置之陰接觸部元件插入第一外殼’並具有從外殼下側 突出的部分，此突出部分可插入對應印刷電路板之孔洞中 請 先 聞 面 之 注
事 項 A 貪 經濟部中央棣率局員工消費合作社印製 此一連接器總成揭露於例如EP-A-446980號案中在 此習知之連接器總成中，第二連接器部分包括多數値外部 導體，各個該等外部導體實質上以圓周方向圍繞至少一個 用作訊號接觸的陰接觸部元件，並各自接觸第一連接器部 分之對應訊號接觸部之相鄰接地接觸部.以此方式，即使 在高位元率訊傳被傳輸時路仍可獲得正確的訊號傳輸。此 外，外部導體亦可備置於習知連接器總成中，用作訊號接 觸的陽接觸部元件。雖然吾人瞭解，習知連接器總成亦可 用於高位元率之最適之訊號傳輸，但此結構並不適用於訊 號接觸部必需彼此非常接近的應用| 本發明偽針對提供一種上述型式之連接器總成，其中 高位元率的最適訊號傳輸為可行，且其中訊號接觸部可被 接近地隔開而其結構可被簡化： 基於此目的，根據本發明之連接器總成其特徵在於提 訂 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 83. 3.10,000 經濟部中央橾準局員工消費合作社印製 250597 A7 β B7 五、發明説明（) 供一接地接觸板於至少一行陰接觸部元件之各側，其中， 第二外殼之插入側的接地接觸板沿箸實質上對應於第一外 殼之底部厚度的距離突出於該外殼，而在其中於第_一外殼 之底部備有凹槽，用以承接接地接觸板 以此方式可獲得一連接器總成，其中第二連接器部分 備有操作於連接器總成之_合位置的接地接觸板，其當作 兩連接器部分中之直行接觸元件之屏蔽藉由適當地選擇 各直行中的訊號及接地接觸元件，吾人可瞭解，在此方式 中，以一種相當簡單的結構來逹成最適的操作是可能的 根據本發明之連接器總成之一較佳賁施例，各直行包 括至少兩對由接地接觸部予以分隔的訊號接觸7ύ件•其中 接觸元件之連缠直行間的中間距離較佳地為2 mm ::以此方 式可獲得一連接器總成，其中每公釐可獲得一對不同的訊 號接觸部。 本發明將參考下列圖示而作更進一步的解釋，在其中 顯示根據本發明的某些實施例。 第1圖為耦合位置中之根據本發明之連接器總成之第 一實施例之部分橫截面及部分斷面側視圖。 第2圖為第1画之連接器總成之第-·連接器部分之橫 截面圖。 第3圖為第2圖之第一連接器部分之第一外殼之俯視 圖I 〇 第4圖為耦合位置中之根據本發明之連接器總成之第 二實施例之部分橫截面及部分斷面側視圖。 本紙張尺度適用中國固家標準（CNS ) A4規格（210X297公釐） 83. 3.10,000 | 訂 線-1' (請先閲讀背面之注意事項再填寫本頁) 250597 五、發明説明（） 第5圖為第4圖之連接器總成之第二連接器部分之透 視及部分分解圖1 * (請先閲讀背面之注意事項再填寫本頁) 第6圖為對應於第2圖之橫截面圖，其顯示第一連接 器部分之可選擇實施例_ 第7圖為繙合位置中之根據本發明之連接器總成之第 三實施例之部分橫截面及部分斷面側視圖。 第8圖為第7圖之連接器總成之第一連接器部分之横 截面圖。 第9圖為根據本發明之連接器總成之第一連接器部分 之一可選擇實施例之部分分解及部分斷面透視圖。 第1 0圖為根據本發明之第四實施例之透視圖，其像用 以在中央印刷電路板之兩側連接印刷電路板。 第11圖為適於用於第10圖之連接器總成之第一連接器 部分之透視圖。 第12圖為第11圖之第一連接器部分之元件的透視圖j 第13及14圖顯示適於使用於第1 0圖之連接器總成之第 二連接器部分之透視圖。 經濟部中央標隼局員工消費合作社印製 第15圖為適於使用於第1 0圖之連接器總成之第一連接 器部分之第二實施例之透視画。 第16_顯示第15圖之第一連接器部分之元件— 第17及18圖顯示適於使用於第]0画之連接器總成與第 15圖之第一連接器部分之第二連接器部分之第二實施例之 透視圖。 第1圖顯示一用以連接印刷電路板2至一通常標示為 83. 3.10,000 本纸張尺度適用中國國家揉準（CNS ) A4規格（210X297公嫠） 經濟部中央標準局員工消費合作社印製 A7 γ5〇597__5Ζ_；_ 五、發明説明（） 後嵌板的印刷電路板3之連接器總成1的部分橫截面與部 分分解惻視圖。一以橫截面顯示於第2圖之第一連接器部 分4俗安裝於印刷電路板3。連接器部分4包括一絶緣材 料之外殼5 (其俯視圖顯示於第3圖），其具有底部6與 兩相對之側牆7、8。底部6中形成有孔洞9，當作陽接 觸元件的接觸插銷1 〇固定於其中此等接觸插銷10以橫列 與直行的方式配置，其中，在此實施例中顯示有六行，每 一行具有五値接觸插銷10。根據第2圖之橫截面圖及第3 圖之俯視圔，各接觸插銷直行各自包括四痼訊號接觸插銷 ，其偽由一中央接地接觸插銷分成兩對，此實施例中顯 示，接觸插銷10橫列方向上之距離為2公釐，因此，每公 釐提供有一對訊號接觸插銷。照此方式，各對訊號接觸接 銷可傳輸一對不同的訊號。 若期望，亦可能提供更多横列及直行的接觸插銷10… 還可能，接觸插銷交替地包括有一訊號接觸插銷與一接地 接觸插銷，或訊號及接地接觸插銷之其他配置或甚至僅有 訊號接觸插銷。 連接器總成1還包括一具有絶緣材料外殼〗2之第二連 接器部分11 :此第二外殼1 2以插入側13插入至第一外殼5 :與接觸插銷10相同方式配置的陰接觸元件1 4被安裝於第 二外殼12中，該接觸元件以其本身所熟知的方式與接觸插 銷10嚙合於第1圖中之插入位置：如第1 、2圖中之橫截 面所顯示，接觸插銷10與陰接觸元件14分別具有部分15與 1 6，其偽藉由插人的方式分別經由印刷電路板3與2上的 -----— -7 ·=γ - 本紙張尺度適用中國國家橾率（CNS ) Α4規格（210Χ 297公釐） 83. 3.10,000 (讀先閲讀背面之注意事項再填寫本頁)
A7 250M7五、發明説明（） B7 經濟部中央標準局員工消費合作杜印製 開孔而以所謂的平面配置予以固定。 第二連接器部分11包括一位於陰接觸元件1 4兩側的接 地接觸板17，該接地接觸板沿箸實質上對應於外殼5之底 部6之厚度的距離而突出於外殼1 2之插入側1 3 為承接接 地接觸板17之此等突出部，外殼5之底部6具有凹槽18 : 照此方式，可獲得第二連接器部分11之各直行接觸元 件1 4之屏蔽，亦在連接器總成1之耦合位置中形成第一連 接器部分4之各直行接觸插銷10之間的屏蔽。接地接觸板 ]7可在朝向印刷電路板2的邊綠包括適當的接觸元件，該 接觸元件接觸例如位於印刷電路板2表面上的接地接觸導 體層。這些接觸元件在第5圖中以標號1 7 ’予以標示。當 然，亦可能提供具有插入接觸部之接地接觸板1 7。 第一連接器部分4包括安裝於第一外殼9之側壁7、 8上的屏蔽板19 此等屛蔽板19具有經由側壁7、8中之 孔洞21突出外殼5之接觸彈筈20 :此外，屛蔽板1 9具有接 觸區域22，其接觸印刷電路3之表面上的適當導體在顯 示於第1圖之霄施例中，屛蔽板19更包括接觸彈簧23 ’其 突入外殼5之凹槽18，並在連接器總成1之耦合位置中接 觸接地接觸板1 7 側壁8上之屏蔽板.19之接觸彈簧20接觸 接地接觸板17之邊緣。 連接器部分11更包括一主要呈L形之屛蔽板24 ’其中 短腿沿外殼12之後側延伸而長腿沿外殼之上側延伸。屏® 板24之短腿包括插入印刷電路板2之孔洞的接觸部25 ’並 接觸印刷電路板2之對應導體.在第1圖之插入部分中’ (請先閲讀背面之注意事項再填寫本頁) -訂 本紙張尺度適用中國國家揉率（CNS > A4規格（2丨0X297公釐〉 83. 3.10,000 五、發明説明 () A7 B7 (請先閲讀背面之注意事項再填寫本頁) 側壁7之屏蔽板19之接觸彈簧20接觸屏蔽板24。提供可確 定接地接觸板17與屏蔽板24之間的良好連接之適當連接裝 置之接地接觸板17及/或屛蔽板24是可能的。作為另一選 擇，除了屛蔽板24與各値接地接觸板17之延伸部之間的接 觸•接地接觸板17及屏蔽板24不可彼此接觸。如第1圖所 示，延伸部26突出於外殼12之後側並經由凹槽突出於屏蔽 板24的短腿，這在第1圖中未顯示，在此，延伸部26接觸 屛蔽板24。 如第2、3圖中所顯示，凹槽18間之底部6的部分27 經由一網狀物28相互連接，以強化底部6。 經濟部中央標準局員工消費合作社印製 第4圖顯示一連接器總成29 ·其主要以類似於第1麵 之連接器總成1的方式加以製造。相對應的零件係以相同 的標號予以標示。在第1圖之連接器總成中•位於側壁8 之屏蔽板19之接觸彈簧20接觸接地接觸板17之邊綠，其中 ，為了長期操作，接地接觸板17之此等邊緣之待殊機製將 是期望的。在連接器總成29中，一位於接地接觸板17與接 觸彈簧20之間的接觸藉由一連接板30與弧形接觸裝置31而 避免。該連接板30附著於連接器部分11之下側。此等弧形 接觸裝置31與接觸屏蔽板19之接觸彈簧20接觸於連接器總 成29之耦合位置中。在其位置中安裝於印刷電路板2的連 接板30偽與印刷電路板2之對應導體相連接*亦接觸接地 接觸板17。 連接器總成29之建接器部分11以透視圖之形式顯示於 第5圖中，其中屏蔽板19與連接板30顯示偽與外殼5分離 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公嫠） 83. 3.10,000 A7 <50597_E_ 五、發明説明（) 。第5圖顯示連接板30具有接觸元件32，其可確定印刷電 路板2之表面導體的良好連接。此外，連接板如包括孔洞 30，用以藉由突出部34之裝置（僅其中的--個顯示於第5 圖中）而附箸於外殼1 2之連接板。 第5圖中還可看到屏蔽板24具有用於接地接觸板1 7之 延伸部26的□槽35，其偽位於外殼1 2之後側部分。各凹槽 35的兩側具有與延伸部26嚙合的接觸唇3¾。 在外殼1 2的上側備置有兩個定位突出部37，其傜與第 一連接器部分4之外殼5之側壁7中的凹槽38其同操作， 因而連接器部分11僅可被插入至連接器部分4的_-値位置 中。屏蔽板24具有承接突出部37的兩凹槽39。唇40形成用 以嚙合於突出部37之突出部分以持住外殼1 2上的屛蔽板24 吾人應注意，接地接觸板7偽於噴射模塑期間安装於 外殼1 2中：接地接觸板1 7在模中波支撑，以製造外殼1 2並 並具有以外殼12之絶緣材料予以充瑱的孔洞41，42，«此 *接地接觸板17被固定於外殼1 2中。 經濟部中央標準局貝工消費合作社印製 如第1 、3圖中所示，外部凹槽1 8與接地接觸板〗7分 別具有一範圍與橫列方向，其為維持凹槽1 8與接地接觸板 17之的範的-半..照此方式，多數個連接器部分4與11可 被分別依次裝置，其中，接觸插銷1 〇之連續直行與接觸元 件1 4之間的距離被維持在與兩連接器部分依次裝置時的相 同距離。 第6圖顯示一第一連接器部分43之橫截面其主要以 83. 3.1〇,〇〇0 (請先閲讀背面之注意事項存填寫本1) 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） 經濟部中央標準局員工消費合作社印製 A7 B7 _五、發明説明（） 相同於連接器部分4的方式予以製造。相對應的零件偽以 相同的檫號予以標示。在此例中*屛蔽板1 9還具有藉由或 其他適當的連接技術而連接於印刷電路板3之導體的接觸 舌部44。 在第1 - 6圖中所顯示之本發明之連接器縐成之宵施 例中，接地接觸板1 7係與屏蔽板19、24相連接。在某些應 用中可能希望屛蔽與接地接觸板不連接。第7圖顯示一連 接器總成45，其中屏蔽與接地接觸板係為分離：關於其他 部分，此實施例與上述實施例一致’其中相對應的元件以 相同的標號予以標示。第8圖顯示連接器總成45之第一連 接器部分4之橫截面。 在此例中，第一連接器部分在底部之各凹槽中具有一 接觸彈簧元件46該彈簧接觸元件46藉由一接觸插銷47與印 刷電路板3之接地導體相連接：在插入位置中，這些接觸 彈簧46與接地接觸板48相連接，此等接地接觸板偽以與接 地接觸板1 7相同的方式予以製造。在此例中*接地接觸板 亦在外殼12之插入侧13突出外殼，並在連接器45之耦合位 置中被外殼5之底部6的凹槽中被承接_然而，接地接觸 板48比接地接觸板1 7短，因此，它們並不接觸第二連接器 部分11之屏蔽板24 此外第一連接器部分4之屏蔽板19在 此例中當然不具有接觸彈簧23，接觸屛蔽板19具有與印刷 電路板3之屏蔽導體相連接的接觸舌部49。當然，第二連 接器部分Π之連接板30在此例中不與接地接觸板48接觸‘： 第9圖顔示第一連接器部分50之透視圖，此連接器主 - .—. ~ 1 1 ~ 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 83. 3.10,000 I---------{------訂------線-{ I (請先閎讀背面之注意事項再填寫本頁) 1^^597_m_ 五、發明説明（） 要以分別與第一連接器部分4、43相同的方式予以製造。 對應的元件傜以相同的標號予以標示。在此例中連接器部 分50具有一接地接觸單元51，其在外殼5之底部6中針對 各凹槽具1 8有具有兩接地接觸板52，接地接觸板52係在鄰 接於對應凹槽18的凹槽中被承接。各接地接觸板52包括一 接觸彈簧53，其突入對應凹槽1 8並在連接器總成之耦合位 置中與對應的接地接觸板接觸。各接地接觸板52主要為Η 形，其中Η形之腿部與訊號接觸插銷10之橫列對齊。 在第9圖之實施例中，接地接觸單元51係以屛蔽板1 9 為單位，因而在使用連接器部分50時，在接地接觸板與屏 蔽板19、24之間形成連接。若希望屏蔽與接地之間分離， 保持接地接觸單元51與屏蔽板1 9分離是可能的，其中，在 此例中，接地接觸單元具有一値或多個適當的接地接觸裝 置 經濟部中央標準局貝工消費合作社印製 接地接觸單元51之應用具有之利益為由安裝条統中之 誤差所導致之受限制之吸收震力位置，在其中連接器與對 應之印刷電路板柬配合，一最適的接地屛蔽保證位於接觸 插銷1 0之直行中。此外，嚙合於接地接觸板1 7之接觸彈簧 54可確保接地接觸單元51與接地接觸板1 7之間的良好的長 時間連接。 注意到僅有一値接地接觸插銷被顯示於第9圖中作為 範例。然而，清楚地，外殼5之底部6中的所有孔洞具有 接觸接銷10。 雖然在上述實施例中一接地接觸板被置於各行陰接觸 83. 3.10,000 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） 經濟部中央標準局員工消費合作社印製 A7 ^50597_B7____ 五、發明説明（） 元件之各側，在每兩個接地接觸板之間提供多於一行的接 觸元件亦是可能的。 第10圖概略地顯示連接至中央印刷電路板或反板3之 多數印刷電路板2之透視圖。在印刷電路板3 —側之印刷 電路板2垂直地延伸至印刷電路板3另外一側的印刷電路 板2 為連接印刷電路板2、3的不同導體’連接器總成 57被應用，其係以與上述連接器總成相當的方式被製造、 連接器總成57之兩連接器部分更詳盡地描繪於第11至14圖 中，而第1 5至1 8圖中顯示連接器總成之選擇性實施例之兩 連接器部分。 連接器總成57包括一顯示於第11画中之第一連接器部 分58與一顯示於第1 3、1 4画中之第二連接器部分59 :第一 連接器部分58包括外殼60，其中具有各自擁有四値接觸插 銷10的群組。接觸插銷10之群組由一位於外殼60之底部6 的主要呈交叉形狀的凹槽6 1予以分隔。接觸插銷實際上以 上述實施例中的方式成行列配置，其中，在此例中，並未 提供中央橫列與中央直行，而在其位置上具有交叉形狀的 凹槽6 1 在此實施例中，凹槽6 1將外殼60之底部6區分為 四個象限，其各自包括有四個接觸插銷1 〇 :擁有不同數量 的直行與橫列是可能的，因此各象限包括不同數量的接觸 插銷10。 在此例中，外殼60之側壁7、8由其他側壁62、63予 以互接，因此可獲得用於第二連接器部分59之密封環繞的 承接空間。各側壁7、8、62、63具有一屏蔽板19 |其接 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 83. 3.1〇,〇〇〇 (請先閱讀背面之注意事項再填寫本頁) 、τ 線夂！ A7 <50597 ------- 五、發明説明（） 觸彈簧經由孔洞突入外殼60 如第1 2圖中所示，屏蔽板1 9 為此實施例中之連接器部分58之接地接觸單元64的一部分 ，其中，接地接觸單元包括具有接觸彈簧54的接地接觸板 65。清楚地，接地接觸板65以相同於接地接觸板52的方式 在鄰接凹槽61的凹槽中被承接。 第二連接器部分5 9包括一具有交叉形狀橫截面的外殼 66，其中安裝有接地接觸單元67。與前述接觸總成相同之 方式，接地接觸板單元67在外殼66之插入側1 3突出外殼’ 其突出部分由在耦合位置之第一連接器部分58之外殼60的 凹槽6 1中被承接此外殼在其上側、後侧與兩側牆上由與 位於插人位置之屏蔽板19之接觸彈簧20相接觸之屏蔽板1 9 所圍繞。在位於外殼66之後侧之屏蔽板68的部分中具有一 凹槽，接地接觸板單元67之延伸部在其中以與接觸舌部70 相同的方式被承接並握持。在外殼66的下側，一具有弧狀 接觸裝置的連接板30以相同於第4圖中之連接器總成的方 式被安裝。接觸装置3 1在圖1 3、1 4中並未顯示· 各組四接觸插銷10與各組四陰接觸元件未顯示於第13 、1 4圖中，其包括兩個接觸插銷/接觸元件以斜角相對以 適用於不同的訊號。 連接器總成更己括一第三外殼，其主要對應於第一連 接器部分58之外殼60。在安裝第一連接器部分58於印刷電 路板2之後，外殼7 1以其底部附接於第一連接器部分58之 接觸插銷上。外殼71與其對應元件形成一第一連接器部分 於印刷電路板2之相對側，其中一第二連接器部分59可以 ~~ 14.一... - ----------Μ------訂------線J— (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） 83. 3.10,000 經濟部中央標準局員工消費合作社印製 A7 _E_ 五、發明説明（) 相同於連接器58的方式被插入此連接器部分中。 注意到根據第】3、1 4圔之第二連接器部分59之接地接 觸板單元67偽由各自具有一凹槽74的兩平板72、73所組成 *僅有其中的一個顯示於第1 4圖中。板72、73.以其凹槽74 滑入對方以獲得接地接觸板單元67。板72之延伸部由凹槽 74分為兩個半邊： 第15 - 18圖中，第一連接器部分75與第二連接器部分 76顯示共同形成一對應於連接器總成57的連接器總成。連 接器部分75、76主要與連接器部分58、59 —致相對應的 元件以相同的標號予以標示。 在此例中，連接器部分75包括一不具有側壁62、63的 外殼。為獲得外殼60之底部6之相對側的良好屛蔽，接地 接觸單元64更特別包括位於第16圖中可見之側面之具有接 觸彈簧54的接地接觸板65 _>此外，在此例中，第二連接器 部分76之屏蔽板68之側壁部分包接圍繞外殼60之開口側的 延伸部77 :接地接觸板單元67以與在連接器部分59中相同 的方式突出外殼66之插入側1 3。在此例中，接地接觸單元 由兩個各自沿90 角而彎曲之彼此相等的接地接觸板78所 組成.各接地接觸板78具有一經由屏賊板60之凹槽而突出 於側壁，並同樣地由對應之接觸舌部70所握持的延伸部70 第17與18圖顯示具有弧狀接觸装置31之連接板30。 注意到在第〗〇 - 1 8圖中之導體總成實施例中，接地接 觸元件64與屏蔽板19、68接觸。然而，在此例中，下如前 ---------{----^---訂------線入 I (請先聞讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210x297公釐） 83.3.10,000 B7 五、發明説明（） 述實施例*亦可將接地與屏蔽予以分隔。為此目的，屏蔽 板19並不形成接地接觸單元的一部分。 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央榡準局員工消費合作社印製 注意到各接觸插銷具有一突出於接觸插銷兩側的肩部 80，其上表面見於第9圖。由於前述接觸總成中之接觸插 銷僅以兩公釐的間距予以安裝*而凹槽18、61分別備置於 直行接觸插銷之間，因此不可能將接觸插銷10如目前常見 的以橫列方向與其扃部80對齊。在所述的連接器總成中， 肩部80如第3、9、11、15圖中所示地朝向直行方向。因 此，突入外殼之接觸插銷部分82之接觸表面81 (其偽以平 行於扃部80的方式延伸於傳統接觸插銷中）亦將伸延至直 行方向。在一般陰接觸元件的應用中，這些陰接觸元件將 不再與接觸插銷10之接觸表面81協同操作。在根據本發明 之連接器總成中，接觸插銷因而用於具有一接觸插銷82之 第一連接器部分，此接觸插銷82相對於維持接觸插銷部分 成9(Γ的杻曲。藉此方式，可使接觸表面81以横列方向延 伸》因而使其以正確的方式接觸陰接觸元件。此等具有彎 曲之接觸插銷部分82的接觸插銷10亦可有利地於於根據第 10 - 1 8圖之連接器總成。藉此，可使接觸插銷10之接觸表 面延伸進入印刷電路板2兩側的正確方向。 用以製造具有彎曲接觸插銷部分之接觸插銷的適當方 法敘述於本案申請人同曰申請之專利申請案中· 雖然以上說明本發明傷為用於印刷電路板總成之申請 案|但本發明亦可應用於其他型式的連接器總成，例如電 纜連接器。 1 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） 83. 3.10,000 ^50597_B7_五、發明説明（）本發明並不侷限於上述實施例，而可在申；請專利範圍 的範疇内施以不同形式的變化。 (請先閣讀背_面之注倉事項再填寫本頁) 訂 經濟部中央標準局員工消費合作社印製 ________ - -1 7 - 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 83.3. 10,000

Claims (1)

  1. 六、申請專利範圍 A8 B8 C8 D8 經濟部中央標準局員工消費合作社印製 1. 一連接器總成，包括一第一連接器部分，其具有絶線 材料之第一外殼，此外殼具有一底部與兩相對側牆， 並具有安裝於外殼底部而以橫列與直行方式配置的陽 接觸元件，並具有從外毅底部突出的部分，此突出部 分可插入對應印刷電路板之孔洞中，以及 一第二連接器部分，其具有絶緣材料之第二外殼 並適於以一插入側插入第一外殼，並具有安装於外殼 中且以直行與橫列之對應方式配置的陰接觸元件，並 具有從外殼下側突出的部分，此突出部分可插入對應 印刷電路板之孔洞中，其特徵在於： 備置一第三外殼，實質上對應於第一外殼，並可 在該第一連接器安裝於對應之印刷電路板後，以其底 部固定於該第一連接器部分之陽接觸元件， 在第二外殼中至少備置一摑具有交叉形狀橫截面 的接地接觸板單元，該接地接觸板單元將該外殼區分 為最好為四個具有相同數量之陰接觸元件的象限，其 中接地接觸板器單元在第二外殼之插入位置從此外殼 分別沿實質上對應於第一及第三外殼之底部厚度的距 離突出此外殼，以及在於 一交叉形狀凹槽備置於第一及第三外殼之底部， 用以承接接地接觸單元，該凹槽將外殼底部區分為具 有該數量之陽接觸元件的象限。 2. 如申請專利範圍第1項所述之連接器總成，其持徵在 於，第一外殼包插備置於側壁的屏蔽板，該屏蔽板具 1 請 先 閱 讀 背. 面 之 注 意- 事 項 再 訂 本紙張尺度適用中國'國家橾準（CNS ) A4規格（210x297公釐） 250597六、申請專利範圍 A8 B8 C8 D8 有用以連接至一對應印刷電路板之對應導體之接觸裝 置，並具有經由側壁中之孔洞突入此外殼之接觸彈篱 装置。 3. 如申請專利範圍第2項所述之連接器總成’其特歡在 於，第二外殼包括一沿著相對於插入側之外殼之上側 、兩側壁與後側之屏蔽板，並具有用以連接至對應印 刷電路板之對應導髏的接觸裝置’當總成絹合時’該 屛蔽板接觸第一外殼之對應屛蔽板之接觸彈簧裝置° 4. 如申請專利範圍第3項所述之連接器總成，其特徵在 於，第二外殼之屏蔽板之側壁部分沿該距離相對於第 二外殼之插入側而突出。 5. 如申請專利範圍第3項所述之連接器總成，其持徵在 於，該第一外殼還具有兩相對側壁’此等側壁亦備置 具有用以連接至對應印刷電路板之對應導體之接觸裝 置的屏蔽板，並具有經由側壁中之孔洞突外名殼的接 觭彈簧裝置，用以接觸第二外殼之屏蔽板之側壁部分 請 先 閱 面 之 注I* 項 再 訂 線 經濟部中央標準局員工消費合作社印製 6 . 如申請專利範圍第3、4或5項所述之連接器總成， 其持擻在於，接地接觸板單元具有一突出於第二外殼 之後側的延伸部，該延沖部被承接於屏蔽板之後側部 分的凹槽中，並被固持於其中。 7 · 如申請專利範圍第2項所述之連接器總成，其持徵在 於*第一外殼之各屏蔽板具有接觸彈筈帶，各該等接 觸彈簧帶突入外殼底部之凹槽，用以接觸第二外殼之
    CNS ) A4規格（210X297公釐） S50597六、申請專利範圍 A8 B8 C8 D8 接地接觸板單元。 8. 如申請專利範圍第1項所述之連接器總成，其特徵在 於，第-外殼備置一接地接觸單元’該接地接觸單元 具有四個接地接觸板，各接地接觸板被承接於郯交叉 形狀凹槽之支的凹孔中，並各自具有突入凹槽分友中 的接觸裝置，用以接觸第二外殼之接地接觸板單元， 該接觸装置較佳地為一接觸彈簧 9. 如申請專利範圍第2、4或8項所述之連接器總成， 其待徵在於接地接觸單元具有被承接於未使用之底部 側緣之凹孔中的地接觸板，並具有一接觸裝置，較佳 地為一接觸彈簧，用以接觸第二外殼之屛蔽板之突出 側壁部分。 10 .如申請專利範圍第8項所述之連接器總成，其恃擻在 於，接地接觸單元係與第一外殼之屏蔽板成單位 11.如申請專利範圍第1項所述之連接器總成，其持擻在 於，各接觸插銷包括至少一相對於接觸插銷之其他部 分以9(Γ彎曲的接觸插銷部分。 請 先 閲 I 之 注 意' 事 項 再 填 寫 本 頁 訂 線 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐〉 -20-
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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6328601B1 (en) 1998-01-15 2001-12-11 The Siemon Company Enhanced performance telecommunications connector
US6358091B1 (en) 1998-01-15 2002-03-19 The Siemon Company Telecommunications connector having multi-pair modularity
US6780054B2 (en) 1998-01-15 2004-08-24 The Siemon Company Shielded outlet having contact tails shield
US7683458B2 (en) 2004-09-02 2010-03-23 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
US7749899B2 (en) 2006-06-01 2010-07-06 Micron Technology, Inc. Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces
US7759800B2 (en) 2003-11-13 2010-07-20 Micron Technology, Inc. Microelectronics devices, having vias, and packaged microelectronic devices having vias
US7791203B2 (en) 2007-07-12 2010-09-07 Micron Technology, Inc. Interconnects for packaged semiconductor devices and methods for manufacturing such devices
US7795134B2 (en) 2005-06-28 2010-09-14 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
US7829976B2 (en) 2004-06-29 2010-11-09 Micron Technology, Inc. Microelectronic devices and methods for forming interconnects in microelectronic devices
US7830018B2 (en) 2007-08-31 2010-11-09 Micron Technology, Inc. Partitioned through-layer via and associated systems and methods
US7863187B2 (en) 2005-09-01 2011-01-04 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7884015B2 (en) 2007-12-06 2011-02-08 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US7902643B2 (en) 2006-08-31 2011-03-08 Micron Technology, Inc. Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
US7915736B2 (en) 2005-09-01 2011-03-29 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7973411B2 (en) 2006-08-28 2011-07-05 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
US8063492B2 (en) 2009-04-27 2011-11-22 Powertech Technology, Inc. Multi-chip stacked package
US8084866B2 (en) 2003-12-10 2011-12-27 Micron Technology, Inc. Microelectronic devices and methods for filling vias in microelectronic devices
US8322031B2 (en) 2004-08-27 2012-12-04 Micron Technology, Inc. Method of manufacturing an interposer
US8536485B2 (en) 2004-05-05 2013-09-17 Micron Technology, Inc. Systems and methods for forming apertures in microfeature workpieces
US9214391B2 (en) 2004-12-30 2015-12-15 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
TWI583079B (zh) * 2011-01-17 2017-05-11 太谷電子公司 連接器組件

Families Citing this family (222)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5631752A (en) * 1992-12-24 1997-05-20 Casio Computer Co., Ltd. Antiferroelectric liquid crystal display element exhibiting a precursor tilt phenomenon
DE4446098C2 (de) * 1994-12-22 1998-11-26 Siemens Ag Elektrischer Verbinder mit Abschirmung
DE59506232D1 (de) * 1994-12-22 1999-07-22 Siemens Ag Elektrische Verbinderanordnung
CN1096127C (zh) * 1995-02-09 2002-12-11 惠特克公司 用于印刷电路板的电连接器
JP3271178B2 (ja) 1995-03-03 2002-04-02 矢崎総業株式会社 金属シールドの接続構造
AU6174196A (en) 1995-06-12 1997-01-09 Berg Technology, Inc. Low cross talk and impedance controlled electrical connector and electrical cable assembly
TW267265B (en) * 1995-06-12 1996-01-01 Connector Systems Tech Nv Low cross talk and impedance controlled electrical connector
DE69519226T2 (de) * 1995-07-03 2001-08-23 Berg Electronics Manufacturing B.V., S'-Hertogenbosch Verbinder mit integrierter Flachbaugruppe
US6540558B1 (en) 1995-07-03 2003-04-01 Berg Technology, Inc. Connector, preferably a right angle connector, with integrated PCB assembly
US5685739A (en) * 1996-02-14 1997-11-11 The Whitaker Corporation Shielded electrical connector
NO301254B1 (no) * 1996-02-29 1997-09-29 Telesafe As Kontaktsett for kopling av parkabel til et kretskort
US5823796A (en) * 1996-04-02 1998-10-20 Itt Manufacturing Enterprises, Inc. Audio/power jack for IC card
FR2747516B1 (fr) * 1996-04-12 1998-06-05 Framatome Connectors France Connecteur blinde, notamment du type comprenant une fiche et une embase destinee a etre fixee a un support plan
US5766041A (en) * 1996-05-31 1998-06-16 The Whitaker Corporation Shield member for panel mount connector
WO1997048151A1 (en) * 1996-06-14 1997-12-18 Berg Technology, Inc. Latched and shielded electrical connectors
DE29610780U1 (de) * 1996-06-19 1996-08-29 Siemens AG, 80333 München Federleiste für Steckverbindungen zwischen einer Baugruppenleiterplatte und einer Rückwandverdrahtungsplatte
US5738544A (en) * 1996-06-27 1998-04-14 The Whitaker Corporation Shielded electrical connector
US5755595A (en) * 1996-06-27 1998-05-26 Whitaker Corporation Shielded electrical connector
WO1998002940A1 (de) * 1996-07-12 1998-01-22 Siemens Aktiengesellschaft Geschirmte leiterplattensteckbuchse mit schirmungskontaktierung zu einer gerätewand
US5813871A (en) * 1996-07-31 1998-09-29 The Whitaker Corporation High frequency electrical connector
US5788538A (en) * 1996-07-31 1998-08-04 Berg Technology, Inc. Shield for modular jack
DE69718948T2 (de) * 1996-08-20 2003-12-24 Fci, Paris Hochfrequenz modularer elektrischer steckverbinder
US5797770A (en) * 1996-08-21 1998-08-25 The Whitaker Corporation Shielded electrical connector
US5967806A (en) * 1996-08-30 1999-10-19 The Whitaker Corporation Electrical connector arrangement
DE19640847B4 (de) * 1996-10-03 2007-03-08 Amp-Holland B.V. Rechtwinkliger abgeschirmter elektrischer Verbinder
DE69620179T2 (de) * 1996-10-12 2002-11-07 Molex Inc., Lisle Elektrische Erdungshülle
DE29622003U1 (de) * 1996-12-18 1997-02-20 Stocko Metallwarenfabriken Henkels & Sohn GmbH & Co, 42327 Wuppertal Steckverbinder zum Kontaktieren von Speicher-I/O-Karten
US5876248A (en) * 1997-01-14 1999-03-02 Molex Incorporated Matable electrical connectors having signal and power terminals
US6183301B1 (en) * 1997-01-16 2001-02-06 Berg Technology, Inc. Surface mount connector with integrated PCB assembly
US5915976A (en) * 1997-02-06 1999-06-29 Hon Hai Precision Ind. Co., Ltd. High speed connector
US5993259A (en) 1997-02-07 1999-11-30 Teradyne, Inc. High speed, high density electrical connector
US5980321A (en) * 1997-02-07 1999-11-09 Teradyne, Inc. High speed, high density electrical connector
US6503103B1 (en) 1997-02-07 2003-01-07 Teradyne, Inc. Differential signal electrical connectors
WO1998045904A1 (en) * 1997-04-07 1998-10-15 Berg Technology, Inc. Grounded surface mounted mini coaxial connector
US6024587A (en) * 1997-06-26 2000-02-15 Garth; Emory C. High speed circuit interconnection apparatus
US5961350A (en) * 1997-07-31 1999-10-05 The Whitaker Corporation Modular side-by-side connectors
JP4219088B2 (ja) 1997-08-20 2009-02-04 エフシーアイ・アメリカズ・テクノロジー・インコーポレーテッド 高速度モジュラー電気コネクタに使用されるレセプタクル
ES2170529T3 (es) * 1997-09-15 2002-08-01 Siemens Ag Aparato electrico con un elemento de ajuste.
US5924899A (en) * 1997-11-19 1999-07-20 Berg Technology, Inc. Modular connectors
US6039583A (en) * 1998-03-18 2000-03-21 The Whitaker Corporation Configurable ground plane
US6109976A (en) * 1998-07-10 2000-08-29 Berg Technology, Inc. Modular high speed connector
JP2000106250A (ja) * 1998-09-30 2000-04-11 Hirose Electric Co Ltd シールド板付き多極コネクタ
CA2296953A1 (en) * 1999-01-28 2000-07-28 Berg Technology, Inc. Electrical connector mateable in a plurality of orientations
US6264480B1 (en) * 1999-06-16 2001-07-24 Ericsson Inc. RF emissions shield including resilient fingers and connector assembly and method including the same
US6344975B1 (en) * 1999-08-30 2002-02-05 Lucent Technologies Inc. Modular backplane
SG101926A1 (en) 1999-11-12 2004-02-27 Molex Inc Power connector
CA2392322C (en) * 1999-11-24 2007-12-18 Teradyne, Inc. Differential signal electrical connectors
US6485309B2 (en) * 1999-12-08 2002-11-26 Nortel Networks Limited Virtual midplane to enhance card interconnections using a matrix of interconnecting assemblies
AU2001236600A1 (en) 2000-02-03 2001-08-14 Teradyne, Inc. High speed pressure mount connector
US6171115B1 (en) * 2000-02-03 2001-01-09 Tyco Electronics Corporation Electrical connector having circuit boards and keying for different types of circuit boards
US6267604B1 (en) * 2000-02-03 2001-07-31 Tyco Electronics Corporation Electrical connector including a housing that holds parallel circuit boards
US6364710B1 (en) * 2000-03-29 2002-04-02 Berg Technology, Inc. Electrical connector with grounding system
US6305976B1 (en) * 2000-04-07 2001-10-23 Amp (Japan), Ltd. Electrical connector with planar mounting members
US6354885B1 (en) * 2000-06-05 2002-03-12 Northrop Grumman Corporation Guide system with integral keying and electrostatic discharge paths for separable pin and socket connector systems
US6250944B1 (en) * 2000-06-26 2001-06-26 Hon Hai Precision Ind. Co., Ltd. Latch device for releasably locking mating electrical connectors together
JP3489054B2 (ja) * 2000-10-06 2004-01-19 日本航空電子工業株式会社 コネクタ組付け体
JP3491064B2 (ja) 2000-10-20 2004-01-26 日本航空電子工業株式会社 高速伝送用コネクタ
TW491425U (en) * 2000-12-21 2002-06-11 Hon Hai Prec Ind Co Ltd Electrical connector assembly with a device for preventing erroneous insertion
JP2002203623A (ja) * 2000-12-28 2002-07-19 Japan Aviation Electronics Industry Ltd コネクタ装置
DE10065585A1 (de) * 2000-12-28 2002-07-11 Ims Connector Systems Gmbh Steckverbindungsvorrichtung
US6538899B1 (en) 2001-01-02 2003-03-25 Juniper Networks, Inc. Traceless midplane
US6910897B2 (en) 2001-01-12 2005-06-28 Litton Systems, Inc. Interconnection system
US6979202B2 (en) 2001-01-12 2005-12-27 Litton Systems, Inc. High-speed electrical connector
US6843657B2 (en) 2001-01-12 2005-01-18 Litton Systems Inc. High speed, high density interconnect system for differential and single-ended transmission applications
CA2437371A1 (en) * 2001-02-01 2002-08-08 Teradyne, Inc. Matrix connector
US6844747B2 (en) * 2001-03-19 2005-01-18 International Business Machines Corporation Wafer level system for producing burn-in/screen, and reliability evaluations to be performed on all chips simultaneously without any wafer contacting
US6540522B2 (en) 2001-04-26 2003-04-01 Tyco Electronics Corporation Electrical connector assembly for orthogonally mating circuit boards
US6739884B2 (en) * 2001-05-23 2004-05-25 Samtec, Inc. Electrical connector having a ground plane with independently configurable contacts
US7165994B2 (en) * 2001-05-23 2007-01-23 Samtec, Inc. Electrical connector having a ground plane with independently configurable contacts
US6824393B2 (en) * 2001-05-29 2004-11-30 International Business Machines Corporation Fragmented backplane system for I/O applications
DE20117997U1 (de) * 2001-11-05 2002-02-14 Rosenberger Hochfrequenztechnik GmbH & Co, 83413 Fridolfing Federblech zum Kontaktieren eines Bauteils auf einer Leiterplatte sowie Schaltungsanordnung mit kontaktierendem Federblech
WO2003065512A1 (fr) * 2002-01-30 2003-08-07 Fujitsu Component Limited Connecteur
US6655966B2 (en) * 2002-03-19 2003-12-02 Tyco Electronics Corporation Modular connector with grounding interconnect
US6705895B2 (en) 2002-04-25 2004-03-16 Tyco Electronics Corporation Orthogonal interface for connecting circuit boards carrying differential pairs
US6641438B1 (en) 2002-06-07 2003-11-04 Hon Hai Precision Ind. Co., Ltd. High speed, high density backplane connector
US6758695B2 (en) 2002-06-28 2004-07-06 Tyco Electronics Corporation Connector assembly with a floating shield dividing contacts formed in differential pairs
JP2004087348A (ja) 2002-08-28 2004-03-18 Fujitsu Component Ltd コネクタ装置
US6663429B1 (en) * 2002-08-29 2003-12-16 Hon Hai Precision Ind. Co., Ltd. Method for manufacturing high density electrical connector assembly
JP3689849B2 (ja) * 2002-09-30 2005-08-31 日本航空電子工業株式会社 コネクタ
US20040114334A1 (en) * 2002-12-12 2004-06-17 Korsunsky Iosif R. Connector assembly for printed circuit board interconnection
US6890184B2 (en) * 2003-04-10 2005-05-10 Sun Microsystems, Inc. Electrical connector for conveying signals between two circuit boards
US6739910B1 (en) * 2003-07-11 2004-05-25 Hon Hai Precision Ind. Co., Ltd. Cable assembly with internal circuit modules
JP3956920B2 (ja) * 2003-08-26 2007-08-08 松下電工株式会社 コネクタ
US6808419B1 (en) 2003-08-29 2004-10-26 Hon Hai Precision Ind. Co., Ltd. Electrical connector having enhanced electrical performance
TWM251308U (en) * 2003-09-19 2004-11-21 Hon Hai Prec Ind Co Ltd Electrical connector assembly
US6872085B1 (en) * 2003-09-30 2005-03-29 Teradyne, Inc. High speed, high density electrical connector assembly
US7094102B2 (en) * 2004-07-01 2006-08-22 Amphenol Corporation Differential electrical connector assembly
US7108556B2 (en) * 2004-07-01 2006-09-19 Amphenol Corporation Midplane especially applicable to an orthogonal architecture electronic system
US8444436B1 (en) * 2004-07-01 2013-05-21 Amphenol Corporation Midplane especially applicable to an orthogonal architecture electronic system
US7331717B2 (en) * 2004-07-01 2008-02-19 Amphenol Corporation Flexible optical interconnection system
US8733966B2 (en) * 2004-08-20 2014-05-27 Mag Instrument, Inc. LED flashlight
US7281950B2 (en) * 2004-09-29 2007-10-16 Fci Americas Technology, Inc. High speed connectors that minimize signal skew and crosstalk
TWM278126U (en) * 2004-12-24 2005-10-11 Hon Hai Prec Ind Co Ltd Electrical connector
EP1872443A1 (en) * 2005-03-31 2008-01-02 Molex Incorporated High-density, robust connector with castellations
US7914304B2 (en) 2005-06-30 2011-03-29 Amphenol Corporation Electrical connector with conductors having diverging portions
US20090291593A1 (en) 2005-06-30 2009-11-26 Prescott Atkinson High frequency broadside-coupled electrical connector
US7986112B2 (en) 2005-09-15 2011-07-26 Mag Instrument, Inc. Thermally self-stabilizing LED module
US7331802B2 (en) * 2005-11-02 2008-02-19 Tyco Electronics Corporation Orthogonal connector
US7295446B2 (en) * 2005-12-30 2007-11-13 International Business Machines Corporation Midplane connector for blades
US7309257B1 (en) 2006-06-30 2007-12-18 Fci Americas Technology, Inc. Hinged leadframe assembly for an electrical connector
US7318757B1 (en) * 2006-06-30 2008-01-15 Fci Americas Technology, Inc. Leadframe assembly staggering for electrical connectors
CN2932730Y (zh) * 2006-07-14 2007-08-08 富士康(昆山)电脑接插件有限公司 具有屏蔽壳体的电连接器
CN200941493Y (zh) * 2006-07-18 2007-08-29 富士康(昆山)电脑接插件有限公司 具有屏蔽壳体的电连接器
US7670196B2 (en) 2006-08-02 2010-03-02 Tyco Electronics Corporation Electrical terminal having tactile feedback tip and electrical connector for use therewith
US8142236B2 (en) 2006-08-02 2012-03-27 Tyco Electronics Corporation Electrical connector having improved density and routing characteristics and related methods
US7753742B2 (en) * 2006-08-02 2010-07-13 Tyco Electronics Corporation Electrical terminal having improved insertion characteristics and electrical connector for use therewith
US7591655B2 (en) 2006-08-02 2009-09-22 Tyco Electronics Corporation Electrical connector having improved electrical characteristics
US7549897B2 (en) 2006-08-02 2009-06-23 Tyco Electronics Corporation Electrical connector having improved terminal configuration
US7500871B2 (en) 2006-08-21 2009-03-10 Fci Americas Technology, Inc. Electrical connector system with jogged contact tails
US20080062328A1 (en) * 2006-09-11 2008-03-13 Brett Bilbrey Signal format selection based on physical connections
US20080112133A1 (en) * 2006-11-10 2008-05-15 Sun Microsystems, Inc. Switch chassis
CN101632200B (zh) * 2006-12-19 2016-04-20 Fci公司 背板连接器
US7503804B2 (en) * 2006-12-19 2009-03-17 Fci Americas Technology Inc. Backplane connector
US7497736B2 (en) 2006-12-19 2009-03-03 Fci Americas Technology, Inc. Shieldless, high-speed, low-cross-talk electrical connector
US7422444B1 (en) * 2007-02-28 2008-09-09 Fci Americas Technology, Inc. Orthogonal header
CN101335408B (zh) * 2007-06-29 2010-06-09 贵州航天电器股份有限公司 互补屏蔽小方型背板连接器
US7811100B2 (en) 2007-07-13 2010-10-12 Fci Americas Technology, Inc. Electrical connector system having a continuous ground at the mating interface thereof
US7682193B2 (en) * 2007-10-30 2010-03-23 Fci Americas Technology, Inc. Retention member
KR100974275B1 (ko) * 2007-12-17 2010-08-06 볼보 컨스트럭션 이키프먼트 홀딩 스웨덴 에이비 소 선회식 굴삭기의 붐 충격 완화장치 및 그 제어방법
JP5109663B2 (ja) * 2008-01-07 2012-12-26 住友電気工業株式会社 プラガブル光送受信モジュール実装装置
US8469720B2 (en) 2008-01-17 2013-06-25 Amphenol Corporation Electrical connector assembly
US8764464B2 (en) 2008-02-29 2014-07-01 Fci Americas Technology Llc Cross talk reduction for high speed electrical connectors
US7758385B2 (en) 2008-03-07 2010-07-20 Tyco Electronics Corporation Orthogonal electrical connector and assembly
JP4613219B2 (ja) * 2008-03-14 2011-01-12 日本航空電子工業株式会社 コネクタ
US7618283B1 (en) * 2008-04-23 2009-11-17 Tyco Electronics Corporation Bridge connector for connecting circuit boards
US9022612B2 (en) * 2008-08-07 2015-05-05 Mag Instrument, Inc. LED module
WO2010033932A1 (en) * 2008-09-22 2010-03-25 Earlens Corporation Transducer devices and methods for hearing
MY164930A (en) 2008-11-14 2018-02-15 Molex Inc Connector with terminals forming differential pairs
CN102318143B (zh) 2008-12-12 2015-03-11 莫列斯公司 谐振调整连接器
US7988456B2 (en) * 2009-01-14 2011-08-02 Tyco Electronics Corporation Orthogonal connector system
US9247598B2 (en) * 2009-01-16 2016-01-26 Mag Instrument, Inc. Portable lighting devices
US7883366B2 (en) * 2009-02-02 2011-02-08 Tyco Electronics Corporation High density connector assembly
US9277649B2 (en) 2009-02-26 2016-03-01 Fci Americas Technology Llc Cross talk reduction for high-speed electrical connectors
US8366485B2 (en) * 2009-03-19 2013-02-05 Fci Americas Technology Llc Electrical connector having ribbed ground plate
US20100254109A1 (en) 2009-03-19 2010-10-07 Olympus Corporation Mount assembly and method for manufacturing mount assembly
US8079847B2 (en) * 2009-06-01 2011-12-20 Tyco Electronics Corporation Orthogonal connector system with power connection
US8231415B2 (en) 2009-07-10 2012-07-31 Fci Americas Technology Llc High speed backplane connector with impedance modification and skew correction
US8267721B2 (en) 2009-10-28 2012-09-18 Fci Americas Technology Llc Electrical connector having ground plates and ground coupling bar
US8616919B2 (en) 2009-11-13 2013-12-31 Fci Americas Technology Llc Attachment system for electrical connector
US20110185099A1 (en) * 2010-01-28 2011-07-28 Lsi Corporation Modular and Redundant Data-Storage Controller And a Method for Providing a Hot-Swappable and Field-Serviceable Data-Storage Controller
US7967638B1 (en) 2010-03-26 2011-06-28 Hon Hai Precision Ind. Co., Ltd. Mezzanine connector with contact wafers having opposite mounting tails
CN107069274B (zh) 2010-05-07 2020-08-18 安费诺有限公司 高性能线缆连接器
US8187035B2 (en) * 2010-05-28 2012-05-29 Tyco Electronics Corporation Connector assembly
JP2011249279A (ja) * 2010-05-31 2011-12-08 Fujitsu Component Ltd コネクタ
US8632363B2 (en) 2010-08-31 2014-01-21 Apple Inc. Heat sealed connector assembly
CN102593661B (zh) * 2011-01-14 2014-07-02 富士康(昆山)电脑接插件有限公司 电连接器
US8657627B2 (en) 2011-02-02 2014-02-25 Amphenol Corporation Mezzanine connector
WO2013007774A1 (en) 2011-07-13 2013-01-17 Fci Assembly and board mounting connector
EP2624034A1 (en) 2012-01-31 2013-08-07 Fci Dismountable optical coupling device
KR101164114B1 (ko) * 2012-02-29 2012-07-12 주식회사 유니테스트 반도체소자 검사 장비용 커넥터 및 번인 테스터용 테스트보드
USD727268S1 (en) 2012-04-13 2015-04-21 Fci Americas Technology Llc Vertical electrical connector
US8944831B2 (en) 2012-04-13 2015-02-03 Fci Americas Technology Llc Electrical connector having ribbed ground plate with engagement members
USD718253S1 (en) 2012-04-13 2014-11-25 Fci Americas Technology Llc Electrical cable connector
US9257778B2 (en) 2012-04-13 2016-02-09 Fci Americas Technology High speed electrical connector
USD727852S1 (en) 2012-04-13 2015-04-28 Fci Americas Technology Llc Ground shield for a right angle electrical connector
US9543703B2 (en) 2012-07-11 2017-01-10 Fci Americas Technology Llc Electrical connector with reduced stack height
USD751507S1 (en) 2012-07-11 2016-03-15 Fci Americas Technology Llc Electrical connector
US9240644B2 (en) 2012-08-22 2016-01-19 Amphenol Corporation High-frequency electrical connector
USD745852S1 (en) 2013-01-25 2015-12-22 Fci Americas Technology Llc Electrical connector
USD720698S1 (en) 2013-03-15 2015-01-06 Fci Americas Technology Llc Electrical cable connector
US9362646B2 (en) 2013-03-15 2016-06-07 Amphenol Corporation Mating interfaces for high speed high density electrical connector
US9136624B1 (en) * 2013-03-28 2015-09-15 Juniper Networks, Inc. Orthogonal cross-connecting of printed circuit boards without a midplane board
US9196988B2 (en) * 2014-01-08 2015-11-24 Tyco Electronics Corporation Connector assembly
CN112234393B (zh) 2014-01-22 2022-09-13 安费诺有限公司 电连接器、线缆组件、电气组件以及印刷电路板
JP6398354B2 (ja) * 2014-06-13 2018-10-03 ミツミ電機株式会社 コネクタ
US9583852B1 (en) * 2014-11-04 2017-02-28 Universal Lighting Technologies, Inc. PCB holder having a leg with a passageway with a conductive pin therein to electrically connect two PCBs
US9685736B2 (en) 2014-11-12 2017-06-20 Amphenol Corporation Very high speed, high density electrical interconnection system with impedance control in mating region
US9775231B2 (en) 2014-11-21 2017-09-26 Amphenol Corporation Mating backplane for high speed, high density electrical connector
CN105792515A (zh) * 2014-12-25 2016-07-20 台达电子工业股份有限公司 电路板组合及其组装方法
CN111430991B (zh) 2015-07-07 2022-02-11 安费诺富加宜（亚洲）私人有限公司 电连接器
US10141676B2 (en) 2015-07-23 2018-11-27 Amphenol Corporation Extender module for modular connector
US10187972B2 (en) 2016-03-08 2019-01-22 Amphenol Corporation Backplane footprint for high speed, high density electrical connectors
US10201074B2 (en) 2016-03-08 2019-02-05 Amphenol Corporation Backplane footprint for high speed, high density electrical connectors
CN109478748B (zh) 2016-05-18 2020-12-15 安费诺有限公司 受控制的阻抗边缘耦合连接器
US10312638B2 (en) 2016-05-31 2019-06-04 Amphenol Corporation High performance cable termination
CN112151987B (zh) 2016-08-23 2022-12-30 安费诺有限公司 可配置为高性能的连接器
US9787032B1 (en) * 2016-10-14 2017-10-10 Apple Inc. Connector ground springs
US10205286B2 (en) 2016-10-19 2019-02-12 Amphenol Corporation Compliant shield for very high speed, high density electrical interconnection
JP6560182B2 (ja) * 2016-11-17 2019-08-14 Ｎｅｃプラットフォームズ株式会社 被嵌合部材、嵌合部材及び接続構造
KR102461096B1 (ko) * 2017-07-20 2022-10-31 현대두산인프라코어 주식회사 건설기계의 주행 속도 제어 방법 및 장치
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US10777921B2 (en) 2017-12-06 2020-09-15 Amphenol East Asia Ltd. High speed card edge connector
US10665973B2 (en) 2018-03-22 2020-05-26 Amphenol Corporation High density electrical connector
CN114843809A (zh) 2018-03-23 2022-08-02 安费诺有限公司 电连接器、电连接器模块和包括电连接器模块的薄片
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US11870171B2 (en) 2018-10-09 2024-01-09 Amphenol Commercial Products (Chengdu) Co., Ltd. High-density edge connector
CN112930628B (zh) * 2018-10-25 2024-02-20 申泰公司 用于高频信号的混合电连接器
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US10931062B2 (en) 2018-11-21 2021-02-23 Amphenol Corporation High-frequency electrical connector
US11381015B2 (en) 2018-12-21 2022-07-05 Amphenol East Asia Ltd. Robust, miniaturized card edge connector
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WO2020236794A1 (en) 2019-05-20 2020-11-26 Amphenol Corporation High density, high speed electrical connector
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US11588277B2 (en) 2019-11-06 2023-02-21 Amphenol East Asia Ltd. High-frequency electrical connector with lossy member
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US11652307B2 (en) 2020-08-20 2023-05-16 Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd. High speed connector
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US11569613B2 (en) 2021-04-19 2023-01-31 Amphenol East Asia Ltd. Electrical connector having symmetrical docking holes
JP2023007717A (ja) * 2021-07-02 2023-01-19 株式会社オートネットワーク技術研究所 基板用コネクタ
US11664626B2 (en) * 2021-07-29 2023-05-30 Dell Products L.P. Staggered press-fit fish-eye connector
USD1002553S1 (en) 2021-11-03 2023-10-24 Amphenol Corporation Gasket for connector

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4824383A (en) * 1986-11-18 1989-04-25 E. I. Du Pont De Nemours And Company Terminator and corresponding receptacle for multiple electrical conductors
US5169324A (en) * 1986-11-18 1992-12-08 Lemke Timothy A Plug terminator having a grounding member
US4846727A (en) * 1988-04-11 1989-07-11 Amp Incorporated Reference conductor for improving signal integrity in electrical connectors
DE8804802U1 (de) * 1988-04-12 1988-09-01 Hohe Kg, 6981 Collenberg Abklappbarer Außenspiegel für Fahrzeuge
EP0374307B1 (en) * 1988-12-23 1993-08-11 Framatome Connectors Belgium N.V. Connector assembly for printed circuit boards
US5307242A (en) * 1989-08-10 1994-04-26 Siemens Aktiengesellschaft Device for electrically connecting shieldings of multi-pole plugs to the ground layer of a wiring board
NL9000578A (nl) * 1990-03-14 1991-10-01 Burndy Electra Nv Connectorsamenstel voor printkaarten.
US5046960A (en) * 1990-12-20 1991-09-10 Amp Incorporated High density connector system
US5102353A (en) * 1991-06-06 1992-04-07 Molex Incorporated Electrical connectors
FR2685555B1 (fr) * 1991-12-23 1994-03-25 Souriau Cie Connecteur electrique destine a recevoir un support plat.
FR2685554B1 (fr) * 1991-12-23 1994-03-25 Souriau & Cie Element modulaire de connexion electrique.

Cited By (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6358091B1 (en) 1998-01-15 2002-03-19 The Siemon Company Telecommunications connector having multi-pair modularity
US6629858B2 (en) 1998-01-15 2003-10-07 The Siemon Company Enhanced performance telecommunications connector
US6780054B2 (en) 1998-01-15 2004-08-24 The Siemon Company Shielded outlet having contact tails shield
US6328601B1 (en) 1998-01-15 2001-12-11 The Siemon Company Enhanced performance telecommunications connector
US9653420B2 (en) 2003-11-13 2017-05-16 Micron Technology, Inc. Microelectronic devices and methods for filling vias in microelectronic devices
US7759800B2 (en) 2003-11-13 2010-07-20 Micron Technology, Inc. Microelectronics devices, having vias, and packaged microelectronic devices having vias
US8084866B2 (en) 2003-12-10 2011-12-27 Micron Technology, Inc. Microelectronic devices and methods for filling vias in microelectronic devices
US11177175B2 (en) 2003-12-10 2021-11-16 Micron Technology, Inc. Microelectronic devices and methods for filling vias in microelectronic devices
US8748311B2 (en) 2003-12-10 2014-06-10 Micron Technology, Inc. Microelectronic devices and methods for filing vias in microelectronic devices
US9452492B2 (en) 2004-05-05 2016-09-27 Micron Technology, Inc. Systems and methods for forming apertures in microfeature workpieces
US10010977B2 (en) 2004-05-05 2018-07-03 Micron Technology, Inc. Systems and methods for forming apertures in microfeature workpieces
US8536485B2 (en) 2004-05-05 2013-09-17 Micron Technology, Inc. Systems and methods for forming apertures in microfeature workpieces
US8664562B2 (en) 2004-05-05 2014-03-04 Micron Technology, Inc. Systems and methods for forming apertures in microfeature workpieces
US8686313B2 (en) 2004-05-05 2014-04-01 Micron Technology, Inc. System and methods for forming apertures in microfeature workpieces
US7829976B2 (en) 2004-06-29 2010-11-09 Micron Technology, Inc. Microelectronic devices and methods for forming interconnects in microelectronic devices
US8322031B2 (en) 2004-08-27 2012-12-04 Micron Technology, Inc. Method of manufacturing an interposer
US7683458B2 (en) 2004-09-02 2010-03-23 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
US7956443B2 (en) 2004-09-02 2011-06-07 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
US8669179B2 (en) 2004-09-02 2014-03-11 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
US8502353B2 (en) 2004-09-02 2013-08-06 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
US9214391B2 (en) 2004-12-30 2015-12-15 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US8008192B2 (en) 2005-06-28 2011-08-30 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
US9293367B2 (en) 2005-06-28 2016-03-22 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
US7795134B2 (en) 2005-06-28 2010-09-14 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
US7863187B2 (en) 2005-09-01 2011-01-04 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US12014958B2 (en) 2005-09-01 2024-06-18 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US11476160B2 (en) 2005-09-01 2022-10-18 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7915736B2 (en) 2005-09-01 2011-03-29 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7749899B2 (en) 2006-06-01 2010-07-06 Micron Technology, Inc. Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces
US8610279B2 (en) 2006-08-28 2013-12-17 Micron Technologies, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
US7973411B2 (en) 2006-08-28 2011-07-05 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
US9570350B2 (en) 2006-08-31 2017-02-14 Micron Technology, Inc. Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
US9099539B2 (en) 2006-08-31 2015-08-04 Micron Technology, Inc. Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
US7902643B2 (en) 2006-08-31 2011-03-08 Micron Technology, Inc. Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
US8168476B2 (en) 2007-07-12 2012-05-01 Micron Technology, Inc. Interconnects for packaged semiconductor devices and methods for manufacturing such devices
US7791203B2 (en) 2007-07-12 2010-09-07 Micron Technology, Inc. Interconnects for packaged semiconductor devices and methods for manufacturing such devices
US8445330B2 (en) 2007-07-12 2013-05-21 Micron Technology, Inc. Interconnects for packaged semiconductor devices and methods for manufacturing such devices
US7830018B2 (en) 2007-08-31 2010-11-09 Micron Technology, Inc. Partitioned through-layer via and associated systems and methods
US8367538B2 (en) 2007-08-31 2013-02-05 Micron Technology, Inc. Partitioned through-layer via and associated systems and methods
US8536046B2 (en) 2007-08-31 2013-09-17 Micron Technology Partitioned through-layer via and associated systems and methods
US7884015B2 (en) 2007-12-06 2011-02-08 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US9281241B2 (en) 2007-12-06 2016-03-08 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US8247907B2 (en) 2007-12-06 2012-08-21 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US8063492B2 (en) 2009-04-27 2011-11-22 Powertech Technology, Inc. Multi-chip stacked package
TWI583079B (zh) * 2011-01-17 2017-05-11 太谷電子公司 連接器組件

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DE69400676T2 (de) 1997-03-27
EP0627789A1 (en) 1994-12-07
DE69400677T2 (de) 1997-04-03
KR100339766B1 (ko) 2002-09-12
EP0627788A1 (en) 1994-12-07
TW262604B (zh) 1995-11-11
DE69400678D1 (de) 1996-11-14
EP0627790A1 (en) 1994-12-07
JPH07169531A (ja) 1995-07-04
EP0627791A1 (en) 1994-12-07
NL9300971A (nl) 1995-01-02
CN1111832A (zh) 1995-11-15
US5433618A (en) 1995-07-18
DE69400678T2 (de) 1997-02-27
CN1097541A (zh) 1995-01-18
DE69400551D1 (de) 1996-10-24
DE69400676D1 (de) 1996-11-14
EP0627789B1 (en) 1996-10-09
KR950002126A (ko) 1995-01-04
US5433617A (en) 1995-07-18
US5429520A (en) 1995-07-04
EP0627790B1 (en) 1996-10-09
JPH07169532A (ja) 1995-07-04
CN1111837A (zh) 1995-11-15
DE69400551T2 (de) 1997-02-13
US5549481A (en) 1996-08-27
US5429521A (en) 1995-07-04
TW263624B (zh) 1995-11-21
JPH07142124A (ja) 1995-06-02
KR950002123A (ko) 1995-01-04
EP0627791B1 (en) 1996-09-18
KR950002125A (ko) 1995-01-04
DE69400677D1 (de) 1996-11-14
EP0627788B1 (en) 1996-10-09
JPH07142123A (ja) 1995-06-02
CN1097540A (zh) 1995-01-18
KR950002124A (ko) 1995-01-04

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