US6590502B1
(en)
|
1992-10-12 |
2003-07-08 |
911Ep, Inc. |
Led warning signal light and movable support
|
US5632631A
(en)
*
|
1994-06-07 |
1997-05-27 |
Tessera, Inc. |
Microelectronic contacts with asperities and methods of making same
|
US5615824A
(en)
*
|
1994-06-07 |
1997-04-01 |
Tessera, Inc. |
Soldering with resilient contacts
|
DE19549726B4
(de)
*
|
1994-12-06 |
2010-04-22 |
Sharp K.K. |
Lichtemittierendes Bauelement und Herstellverfahren für dieses
|
JP3127195B2
(ja)
*
|
1994-12-06 |
2001-01-22 |
シャープ株式会社 |
発光デバイスおよびその製造方法
|
US5760422A
(en)
*
|
1995-06-21 |
1998-06-02 |
Rohm Co., Ltd. |
Light-emitting diode chip and light-emitting diode using the same
|
US6875620B1
(en)
*
|
1996-10-31 |
2005-04-05 |
Agilent Technologies, Inc. |
Tiling process for constructing a chemical array
|
JPH10150223A
(ja)
*
|
1996-11-15 |
1998-06-02 |
Rohm Co Ltd |
チップ型発光素子
|
CN1183024A
(zh)
|
1996-11-15 |
1998-05-27 |
太阳诱电株式会社 |
片状零件供给装置及其所使用的吸附盘
|
US5833903A
(en)
*
|
1996-12-10 |
1998-11-10 |
Great American Gumball Corporation |
Injection molding encapsulation for an electronic device directly onto a substrate
|
JP3337405B2
(ja)
*
|
1996-12-27 |
2002-10-21 |
シャープ株式会社 |
発光表示素子およびその電気配線基板への接続方法ならびに製造方法
|
US5812272A
(en)
*
|
1997-01-30 |
1998-09-22 |
Hewlett-Packard Company |
Apparatus and method with tiled light source array for integrated assay sensing
|
US6087680A
(en)
*
|
1997-01-31 |
2000-07-11 |
Siemens Aktiengesellschaft |
Led device
|
US6093940A
(en)
*
|
1997-04-14 |
2000-07-25 |
Rohm Co., Ltd. |
Light-emitting diode chip component and a light-emitting device
|
US6031958A
(en)
|
1997-05-21 |
2000-02-29 |
Mcgaffigan; Thomas H. |
Optical light pipes with laser light appearance
|
US7365369B2
(en)
|
1997-06-11 |
2008-04-29 |
Nichia Corporation |
Nitride semiconductor device
|
US6081243A
(en)
*
|
1997-09-09 |
2000-06-27 |
Micron Technology, Inc. |
Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices
|
GB2329756A
(en)
|
1997-09-25 |
1999-03-31 |
Univ Bristol |
Assemblies of light emitting diodes
|
GB2330679B
(en)
|
1997-10-21 |
2002-04-24 |
911 Emergency Products Inc |
Warning signal light
|
US6200134B1
(en)
|
1998-01-20 |
2001-03-13 |
Kerr Corporation |
Apparatus and method for curing materials with radiation
|
JP3770014B2
(ja)
|
1999-02-09 |
2006-04-26 |
日亜化学工業株式会社 |
窒化物半導体素子
|
DE60043536D1
(de)
|
1999-03-04 |
2010-01-28 |
Nichia Corp |
Nitridhalbleiterlaserelement
|
JP4061005B2
(ja)
|
1999-03-31 |
2008-03-12 |
シャープ株式会社 |
発光ダイオードおよびその製造方法並びに発光ダイオードの電気配線基板への搭載方法
|
US6462669B1
(en)
|
1999-04-06 |
2002-10-08 |
E. P . Survivors Llc |
Replaceable LED modules
|
US6614359B2
(en)
|
1999-04-06 |
2003-09-02 |
911 Emergency Products, Inc. |
Replacement led lamp assembly and modulated power intensity for light source
|
US6380865B1
(en)
|
1999-04-06 |
2002-04-30 |
911 Emergency Products, Inc. |
Replacement led lamp assembly and modulated power intensity for light source
|
WO2000074973A1
(en)
|
1999-06-08 |
2000-12-14 |
911 Emergency Products, Inc. |
Rotational led reflector
|
US6700502B1
(en)
|
1999-06-08 |
2004-03-02 |
911Ep, Inc. |
Strip LED light assembly for motor vehicle
|
US6705745B1
(en)
|
1999-06-08 |
2004-03-16 |
911Ep, Inc. |
Rotational led reflector
|
US6547410B1
(en)
|
2000-07-28 |
2003-04-15 |
911 Emergency Products, Inc. |
LED alley/take-down light
|
US6367949B1
(en)
|
1999-08-04 |
2002-04-09 |
911 Emergency Products, Inc. |
Par 36 LED utility lamp
|
DE19945131A1
(de)
*
|
1999-09-21 |
2001-04-12 |
Osram Opto Semiconductors Gmbh |
Elektronisches Bauelement und Beschichtungs-Mittel
|
US6885035B2
(en)
*
|
1999-12-22 |
2005-04-26 |
Lumileds Lighting U.S., Llc |
Multi-chip semiconductor LED assembly
|
JP2001320168A
(ja)
|
2000-03-02 |
2001-11-16 |
Murata Mfg Co Ltd |
配線基板およびその製造方法、ならびにそれを用いた電子装置
|
DE10164880B4
(de)
*
|
2000-03-02 |
2005-11-03 |
Murata Mfg. Co., Ltd., Nagaokakyo |
Verdrahtungssubstrat, Verfahren zum Herstellen desselben und elektronische Vorrichtung, die dasselbe verwendet
|
US7320593B2
(en)
|
2000-03-08 |
2008-01-22 |
Tir Systems Ltd. |
Light emitting diode light source for curing dental composites
|
JP2001345485A
(ja)
*
|
2000-06-02 |
2001-12-14 |
Toyoda Gosei Co Ltd |
発光装置
|
WO2001095673A1
(en)
|
2000-06-06 |
2001-12-13 |
911 Emergency Products, Inc. |
Led compensation circuit
|
KR100854295B1
(ko)
*
|
2000-07-07 |
2008-08-26 |
긴파라 시로 |
식물의 생산방법, 재배장치 및 발광패널
|
AT413062B
(de)
*
|
2000-07-12 |
2005-10-15 |
Tridonic Optoelectronics Gmbh |
Verfahren zur herstellung einer led-lichtquelle
|
DE10041328B4
(de)
*
|
2000-08-23 |
2018-04-05 |
Osram Opto Semiconductors Gmbh |
Verpackungseinheit für Halbleiterchips
|
WO2002041276A2
(en)
|
2000-11-15 |
2002-05-23 |
Snowy Village, Inc. |
Led warning light and communication system
|
US7439847B2
(en)
|
2002-08-23 |
2008-10-21 |
John C. Pederson |
Intelligent observation and identification database system
|
US8188878B2
(en)
|
2000-11-15 |
2012-05-29 |
Federal Law Enforcement Development Services, Inc. |
LED light communication system
|
JP2002222992A
(ja)
*
|
2001-01-25 |
2002-08-09 |
Rohm Co Ltd |
Led発光素子、およびled発光装置
|
TW575652B
(en)
*
|
2001-03-07 |
2004-02-11 |
Matsushita Electric Ind Co Ltd |
Light-emitting device
|
US6576488B2
(en)
*
|
2001-06-11 |
2003-06-10 |
Lumileds Lighting U.S., Llc |
Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor
|
US6888167B2
(en)
|
2001-07-23 |
2005-05-03 |
Cree, Inc. |
Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding
|
US6747298B2
(en)
|
2001-07-23 |
2004-06-08 |
Cree, Inc. |
Collets for bonding of light emitting diodes having shaped substrates
|
JP2003309292A
(ja)
*
|
2002-04-15 |
2003-10-31 |
Citizen Electronics Co Ltd |
表面実装型発光ダイオードのメタルコア基板及びその製造方法
|
US7043881B2
(en)
*
|
2002-06-14 |
2006-05-16 |
Tem-Pace, Inc. |
Insulated glass assembly with an internal lighting system
|
DE10228446A1
(de)
*
|
2002-06-26 |
2004-01-15 |
Hella Kg Hueck & Co. |
Anordnung mit elektrischen Bauteilen
|
WO2004011848A2
(en)
|
2002-07-25 |
2004-02-05 |
Dahm Jonathan S |
Method and apparatus for using light emitting diodes for curing
|
US7182597B2
(en)
*
|
2002-08-08 |
2007-02-27 |
Kerr Corporation |
Curing light instrument
|
WO2004038759A2
(en)
*
|
2002-08-23 |
2004-05-06 |
Dahm Jonathan S |
Method and apparatus for using light emitting diodes
|
JP4080843B2
(ja)
|
2002-10-30 |
2008-04-23 |
株式会社東芝 |
不揮発性半導体記憶装置
|
JP2006508514A
(ja)
|
2002-12-02 |
2006-03-09 |
スリーエム イノベイティブ プロパティズ カンパニー |
複数の光源を用いる照明システム
|
US7541152B2
(en)
*
|
2002-12-24 |
2009-06-02 |
Agilent Technologies, Inc. |
Integrated light source for diagnostic arrays
|
JP2004356506A
(ja)
*
|
2003-05-30 |
2004-12-16 |
Stanley Electric Co Ltd |
ガラス封止型発光ダイオード
|
USD502689S1
(en)
*
|
2003-06-05 |
2005-03-08 |
Nichia Corporation |
Light emitting diode
|
USD490384S1
(en)
|
2003-06-05 |
2004-05-25 |
Nichia Corporation |
Light emitting diode
|
USD489690S1
(en)
|
2003-06-05 |
2004-05-11 |
Nichia Corporation |
Light emitting diode (LED)
|
USD489693S1
(en)
|
2003-06-05 |
2004-05-11 |
Nichia Corporation |
Light emitting diode
|
USD509487S1
(en)
*
|
2003-06-05 |
2005-09-13 |
Nichia Corporation |
Light emitting diode (LED)
|
USD489692S1
(en)
|
2003-06-05 |
2004-05-11 |
Nichia Corporation |
Light emitting diode
|
USD490783S1
(en)
|
2003-06-05 |
2004-06-01 |
Nichia Corporation |
Light emitting diode
|
USD489677S1
(en)
|
2003-06-05 |
2004-05-11 |
Nichia Corporation |
Light emitting diode
|
USD490385S1
(en)
|
2003-06-05 |
2004-05-25 |
Nichia Corporation |
Light emitting diode
|
USD490062S1
(en)
|
2003-06-05 |
2004-05-18 |
Nichia Corporation |
Light emitting diode
|
USD493429S1
(en)
|
2003-06-05 |
2004-07-27 |
Nichia Corporation |
Light emitting diode
|
USD489691S1
(en)
|
2003-06-05 |
2004-05-11 |
Nichia Corporation |
Light emitting diode
|
USD490386S1
(en)
|
2003-06-05 |
2004-05-25 |
Nichia Corporation |
Light emitting diode
|
US7280812B2
(en)
*
|
2003-06-06 |
2007-10-09 |
Interdigital Technology Corporation |
Digital baseband receiver with DC discharge and gain control circuits
|
US7915085B2
(en)
*
|
2003-09-18 |
2011-03-29 |
Cree, Inc. |
Molded chip fabrication method
|
US7157744B2
(en)
*
|
2003-10-29 |
2007-01-02 |
M/A-Com, Inc. |
Surface mount package for a high power light emitting diode
|
US7403680B2
(en)
|
2003-12-02 |
2008-07-22 |
3M Innovative Properties Company |
Reflective light coupler
|
US7329887B2
(en)
|
2003-12-02 |
2008-02-12 |
3M Innovative Properties Company |
Solid state light device
|
US20050116235A1
(en)
*
|
2003-12-02 |
2005-06-02 |
Schultz John C. |
Illumination assembly
|
US7456805B2
(en)
|
2003-12-18 |
2008-11-25 |
3M Innovative Properties Company |
Display including a solid state light device and method using same
|
US20050278301A1
(en)
*
|
2004-05-26 |
2005-12-15 |
Castellanos Maria G |
System and method for determining an optimized process configuration
|
ATE553505T1
(de)
|
2004-06-15 |
2012-04-15 |
Data Cloak Llc |
Elektro-optische hochleistungs-led-anordnung
|
ATE549745T1
(de)
*
|
2005-04-21 |
2012-03-15 |
Fiat Ricerche |
Durchsichtige head-up-led-anzeigevorrichtung
|
ATE458276T1
(de)
|
2005-04-21 |
2010-03-15 |
Fiat Ricerche |
Durchsichtige led-anzeigevorrichtung
|
CN100452452C
(zh)
*
|
2005-05-17 |
2009-01-14 |
财团法人工业技术研究院 |
备有发光二极管的翻转侧置结构的发光装置
|
US8113830B2
(en)
*
|
2005-05-27 |
2012-02-14 |
Kerr Corporation |
Curing light instrument
|
FR2892594B1
(fr)
*
|
2005-10-21 |
2007-12-07 |
Saint Gobain |
Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications
|
TWI306652B
(en)
*
|
2005-10-28 |
2009-02-21 |
Chipmos Technologies Inc |
Light emitting diode package structure
|
JP2007234681A
(ja)
*
|
2006-02-27 |
2007-09-13 |
Apic Yamada Corp |
半導体製造装置
|
TWI302043B
(en)
*
|
2006-06-27 |
2008-10-11 |
Everlight Electronics Co Ltd |
Base structure for ultra-thin light-emitting diode and manufacturing method thereof
|
TWI350409B
(en)
*
|
2006-07-06 |
2011-10-11 |
Nat Univ Chung Hsing |
Flexible and could be rolling-up area lights module and the method of producing thereof
|
US8047686B2
(en)
|
2006-09-01 |
2011-11-01 |
Dahm Jonathan S |
Multiple light-emitting element heat pipe assembly
|
KR101456266B1
(ko)
*
|
2006-12-08 |
2014-11-04 |
서울반도체 주식회사 |
발광소자
|
WO2008069605A1
(en)
*
|
2006-12-08 |
2008-06-12 |
Seoul Semiconductor Co., Ltd. |
Light emitting device
|
US8002434B2
(en)
*
|
2007-02-12 |
2011-08-23 |
GE Lighting Solutions, LLC |
LED lighting systems for product display cases
|
US11265082B2
(en)
|
2007-05-24 |
2022-03-01 |
Federal Law Enforcement Development Services, Inc. |
LED light control assembly and system
|
US9258864B2
(en)
|
2007-05-24 |
2016-02-09 |
Federal Law Enforcement Development Services, Inc. |
LED light control and management system
|
WO2008144777A1
(en)
|
2007-05-24 |
2008-11-27 |
Federal Law Enforcement Development Services, Inc. |
Led light dongle communication system
|
US9294198B2
(en)
|
2007-05-24 |
2016-03-22 |
Federal Law Enforcement Development Services, Inc. |
Pulsed light communication key
|
US9100124B2
(en)
|
2007-05-24 |
2015-08-04 |
Federal Law Enforcement Development Services, Inc. |
LED Light Fixture
|
US9455783B2
(en)
|
2013-05-06 |
2016-09-27 |
Federal Law Enforcement Development Services, Inc. |
Network security and variable pulse wave form with continuous communication
|
US9414458B2
(en)
|
2007-05-24 |
2016-08-09 |
Federal Law Enforcement Development Services, Inc. |
LED light control assembly and system
|
EP2009344A1
(de)
*
|
2007-06-25 |
2008-12-31 |
Alcan Technology & Management AG |
Flächige Beleuchtungseinrichtung, Herstellungsverfahren für eine flächige Beleuchtungseinrichtung
|
US8274241B2
(en)
*
|
2008-02-06 |
2012-09-25 |
C. Crane Company, Inc. |
Light emitting diode lighting device
|
US8350499B2
(en)
*
|
2008-02-06 |
2013-01-08 |
C. Crane Company, Inc. |
High efficiency power conditioning circuit for lighting device
|
TWI362769B
(en)
|
2008-05-09 |
2012-04-21 |
Univ Nat Chiao Tung |
Light emitting device and fabrication method therefor
|
DE102008030843B4
(de)
*
|
2008-06-30 |
2021-08-19 |
OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung |
Optoelektronische Anordnung sowie Verfahren zur Herstellung einer optoelektronischen Anordnung
|
FR2937464B1
(fr)
*
|
2008-10-21 |
2011-02-25 |
Commissariat Energie Atomique |
Assemblage d'une puce microelectronique a rainure avec un element filaire sous forme de toron et procede d'assemblage
|
US8890773B1
(en)
|
2009-04-01 |
2014-11-18 |
Federal Law Enforcement Development Services, Inc. |
Visible light transceiver glasses
|
US9066777B2
(en)
|
2009-04-02 |
2015-06-30 |
Kerr Corporation |
Curing light device
|
US9072572B2
(en)
|
2009-04-02 |
2015-07-07 |
Kerr Corporation |
Dental light device
|
TWI556696B
(zh)
*
|
2009-07-14 |
2016-11-01 |
蔡乃成 |
表面黏著型發光元件燈組之製造方法
|
WO2011111516A1
(ja)
|
2010-03-12 |
2011-09-15 |
シャープ株式会社 |
発光装置の製造方法、発光装置、照明装置、バックライト、液晶パネル、表示装置、表示装置の製造方法、表示装置の駆動方法および液晶表示装置
|
JP2011211047A
(ja)
*
|
2010-03-30 |
2011-10-20 |
Sharp Corp |
表示装置、表示装置の製造方法および表示装置の駆動方法
|
US9222645B2
(en)
|
2010-11-29 |
2015-12-29 |
RTC Industries, Incorporated |
LED lighting assembly and method of lighting for a merchandise display
|
US11274808B2
(en)
|
2010-06-17 |
2022-03-15 |
Rtc Industries, Inc. |
LED lighting assembly and method of lighting for a merchandise display
|
CA2824756C
(en)
|
2011-01-14 |
2014-12-23 |
Federal Law Enforcement Development Services, Inc. |
Method of providing lumens and tracking of lumen consumption
|
KR101824011B1
(ko)
|
2011-07-29 |
2018-01-31 |
엘지이노텍 주식회사 |
발광소자 패키지
|
US9194556B1
(en)
|
2012-02-22 |
2015-11-24 |
Theodore G. Nelson |
Method of producing LED lighting apparatus and apparatus produced thereby
|
TW201425795A
(zh)
*
|
2012-12-25 |
2014-07-01 |
Hon Hai Prec Ind Co Ltd |
Led燈條製作方法
|
WO2014160096A1
(en)
|
2013-03-13 |
2014-10-02 |
Federal Law Enforcement Development Services, Inc. |
Led light control and management system
|
US20150198941A1
(en)
|
2014-01-15 |
2015-07-16 |
John C. Pederson |
Cyber Life Electronic Networking and Commerce Operating Exchange
|
US9502625B2
(en)
|
2014-06-06 |
2016-11-22 |
Rohinni, LLC |
Electrophotographic deposition of unpackaged semiconductor device
|
US9989223B1
(en)
*
|
2015-03-09 |
2018-06-05 |
Automated Assembly Corporation |
LED lighting apparatus with LEDs and wires attached to metal sheet member by adhesive
|
US20170048953A1
(en)
|
2015-08-11 |
2017-02-16 |
Federal Law Enforcement Development Services, Inc. |
Programmable switch and system
|
DE102016122810A1
(de)
|
2016-11-25 |
2018-05-30 |
Osram Opto Semiconductors Gmbh |
Bauteil mit einem lichtemittierenden halbleiterchip
|
WO2018132716A1
(en)
*
|
2017-01-12 |
2018-07-19 |
Rohinni, LLC |
Apparatus for high speed printing of semiconductor devices
|
JP6952203B2
(ja)
*
|
2018-03-13 |
2021-10-20 |
アップル インコーポレイテッドApple Inc. |
直接式バックライトユニットを有するディスプレイ
|
US11526051B2
(en)
|
2021-04-16 |
2022-12-13 |
Apple Inc. |
Displays with direct-lit backlight units
|
US11333924B1
(en)
|
2021-04-16 |
2022-05-17 |
Apple Inc. |
Displays with direct-lit backlight units
|
US11513392B1
(en)
|
2021-09-23 |
2022-11-29 |
Apple Inc. |
Direct-lit backlight units with optical films
|