TW243557B - - Google Patents

Info

Publication number
TW243557B
TW243557B TW082105990A TW82105990A TW243557B TW 243557 B TW243557 B TW 243557B TW 082105990 A TW082105990 A TW 082105990A TW 82105990 A TW82105990 A TW 82105990A TW 243557 B TW243557 B TW 243557B
Authority
TW
Taiwan
Application number
TW082105990A
Other languages
Chinese (zh)
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25462860&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW243557(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of TW243557B publication Critical patent/TW243557B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • H10H20/8314Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841Reflective coatings, e.g. dielectric Bragg reflectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142Two-dimensional arrangements, e.g. asymmetric LED layout
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702For plural parts or plural areas of single part
    • Y10T156/1744Means bringing discrete articles into assembled relationship
    • Y10T156/1768Means simultaneously conveying plural articles from a single source and serially presenting them to an assembly station
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53191Means to apply vacuum directly to position or hold work part
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53261Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
TW082105990A 1992-08-20 1993-07-27 TW243557B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/932,754 US5265792A (en) 1992-08-20 1992-08-20 Light source and technique for mounting light emitting diodes

Publications (1)

Publication Number Publication Date
TW243557B true TW243557B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1995-03-21

Family

ID=25462860

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082105990A TW243557B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-08-20 1993-07-27

Country Status (7)

Country Link
US (2) US5265792A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (3) EP0739043B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP3345124B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR100297453B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN (1) CN1050936C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (3) DE69331554T2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW243557B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (130)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6590502B1 (en) 1992-10-12 2003-07-08 911Ep, Inc. Led warning signal light and movable support
US5632631A (en) * 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
DE19549726B4 (de) * 1994-12-06 2010-04-22 Sharp K.K. Lichtemittierendes Bauelement und Herstellverfahren für dieses
JP3127195B2 (ja) * 1994-12-06 2001-01-22 シャープ株式会社 発光デバイスおよびその製造方法
US5760422A (en) * 1995-06-21 1998-06-02 Rohm Co., Ltd. Light-emitting diode chip and light-emitting diode using the same
US6875620B1 (en) * 1996-10-31 2005-04-05 Agilent Technologies, Inc. Tiling process for constructing a chemical array
JPH10150223A (ja) * 1996-11-15 1998-06-02 Rohm Co Ltd チップ型発光素子
CN1183024A (zh) 1996-11-15 1998-05-27 太阳诱电株式会社 片状零件供给装置及其所使用的吸附盘
US5833903A (en) * 1996-12-10 1998-11-10 Great American Gumball Corporation Injection molding encapsulation for an electronic device directly onto a substrate
JP3337405B2 (ja) * 1996-12-27 2002-10-21 シャープ株式会社 発光表示素子およびその電気配線基板への接続方法ならびに製造方法
US5812272A (en) * 1997-01-30 1998-09-22 Hewlett-Packard Company Apparatus and method with tiled light source array for integrated assay sensing
US6087680A (en) * 1997-01-31 2000-07-11 Siemens Aktiengesellschaft Led device
US6093940A (en) * 1997-04-14 2000-07-25 Rohm Co., Ltd. Light-emitting diode chip component and a light-emitting device
US6031958A (en) 1997-05-21 2000-02-29 Mcgaffigan; Thomas H. Optical light pipes with laser light appearance
US7365369B2 (en) 1997-06-11 2008-04-29 Nichia Corporation Nitride semiconductor device
US6081243A (en) * 1997-09-09 2000-06-27 Micron Technology, Inc. Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices
GB2329756A (en) 1997-09-25 1999-03-31 Univ Bristol Assemblies of light emitting diodes
GB2330679B (en) 1997-10-21 2002-04-24 911 Emergency Products Inc Warning signal light
US6200134B1 (en) 1998-01-20 2001-03-13 Kerr Corporation Apparatus and method for curing materials with radiation
JP3770014B2 (ja) 1999-02-09 2006-04-26 日亜化学工業株式会社 窒化物半導体素子
DE60043536D1 (de) 1999-03-04 2010-01-28 Nichia Corp Nitridhalbleiterlaserelement
JP4061005B2 (ja) 1999-03-31 2008-03-12 シャープ株式会社 発光ダイオードおよびその製造方法並びに発光ダイオードの電気配線基板への搭載方法
US6462669B1 (en) 1999-04-06 2002-10-08 E. P . Survivors Llc Replaceable LED modules
US6614359B2 (en) 1999-04-06 2003-09-02 911 Emergency Products, Inc. Replacement led lamp assembly and modulated power intensity for light source
US6380865B1 (en) 1999-04-06 2002-04-30 911 Emergency Products, Inc. Replacement led lamp assembly and modulated power intensity for light source
WO2000074973A1 (en) 1999-06-08 2000-12-14 911 Emergency Products, Inc. Rotational led reflector
US6700502B1 (en) 1999-06-08 2004-03-02 911Ep, Inc. Strip LED light assembly for motor vehicle
US6705745B1 (en) 1999-06-08 2004-03-16 911Ep, Inc. Rotational led reflector
US6547410B1 (en) 2000-07-28 2003-04-15 911 Emergency Products, Inc. LED alley/take-down light
US6367949B1 (en) 1999-08-04 2002-04-09 911 Emergency Products, Inc. Par 36 LED utility lamp
DE19945131A1 (de) * 1999-09-21 2001-04-12 Osram Opto Semiconductors Gmbh Elektronisches Bauelement und Beschichtungs-Mittel
US6885035B2 (en) * 1999-12-22 2005-04-26 Lumileds Lighting U.S., Llc Multi-chip semiconductor LED assembly
JP2001320168A (ja) 2000-03-02 2001-11-16 Murata Mfg Co Ltd 配線基板およびその製造方法、ならびにそれを用いた電子装置
DE10164880B4 (de) * 2000-03-02 2005-11-03 Murata Mfg. Co., Ltd., Nagaokakyo Verdrahtungssubstrat, Verfahren zum Herstellen desselben und elektronische Vorrichtung, die dasselbe verwendet
US7320593B2 (en) 2000-03-08 2008-01-22 Tir Systems Ltd. Light emitting diode light source for curing dental composites
JP2001345485A (ja) * 2000-06-02 2001-12-14 Toyoda Gosei Co Ltd 発光装置
WO2001095673A1 (en) 2000-06-06 2001-12-13 911 Emergency Products, Inc. Led compensation circuit
KR100854295B1 (ko) * 2000-07-07 2008-08-26 긴파라 시로 식물의 생산방법, 재배장치 및 발광패널
AT413062B (de) * 2000-07-12 2005-10-15 Tridonic Optoelectronics Gmbh Verfahren zur herstellung einer led-lichtquelle
DE10041328B4 (de) * 2000-08-23 2018-04-05 Osram Opto Semiconductors Gmbh Verpackungseinheit für Halbleiterchips
WO2002041276A2 (en) 2000-11-15 2002-05-23 Snowy Village, Inc. Led warning light and communication system
US7439847B2 (en) 2002-08-23 2008-10-21 John C. Pederson Intelligent observation and identification database system
US8188878B2 (en) 2000-11-15 2012-05-29 Federal Law Enforcement Development Services, Inc. LED light communication system
JP2002222992A (ja) * 2001-01-25 2002-08-09 Rohm Co Ltd Led発光素子、およびled発光装置
TW575652B (en) * 2001-03-07 2004-02-11 Matsushita Electric Ind Co Ltd Light-emitting device
US6576488B2 (en) * 2001-06-11 2003-06-10 Lumileds Lighting U.S., Llc Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor
US6888167B2 (en) 2001-07-23 2005-05-03 Cree, Inc. Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding
US6747298B2 (en) 2001-07-23 2004-06-08 Cree, Inc. Collets for bonding of light emitting diodes having shaped substrates
JP2003309292A (ja) * 2002-04-15 2003-10-31 Citizen Electronics Co Ltd 表面実装型発光ダイオードのメタルコア基板及びその製造方法
US7043881B2 (en) * 2002-06-14 2006-05-16 Tem-Pace, Inc. Insulated glass assembly with an internal lighting system
DE10228446A1 (de) * 2002-06-26 2004-01-15 Hella Kg Hueck & Co. Anordnung mit elektrischen Bauteilen
WO2004011848A2 (en) 2002-07-25 2004-02-05 Dahm Jonathan S Method and apparatus for using light emitting diodes for curing
US7182597B2 (en) * 2002-08-08 2007-02-27 Kerr Corporation Curing light instrument
WO2004038759A2 (en) * 2002-08-23 2004-05-06 Dahm Jonathan S Method and apparatus for using light emitting diodes
JP4080843B2 (ja) 2002-10-30 2008-04-23 株式会社東芝 不揮発性半導体記憶装置
JP2006508514A (ja) 2002-12-02 2006-03-09 スリーエム イノベイティブ プロパティズ カンパニー 複数の光源を用いる照明システム
US7541152B2 (en) * 2002-12-24 2009-06-02 Agilent Technologies, Inc. Integrated light source for diagnostic arrays
JP2004356506A (ja) * 2003-05-30 2004-12-16 Stanley Electric Co Ltd ガラス封止型発光ダイオード
USD502689S1 (en) * 2003-06-05 2005-03-08 Nichia Corporation Light emitting diode
USD490384S1 (en) 2003-06-05 2004-05-25 Nichia Corporation Light emitting diode
USD489690S1 (en) 2003-06-05 2004-05-11 Nichia Corporation Light emitting diode (LED)
USD489693S1 (en) 2003-06-05 2004-05-11 Nichia Corporation Light emitting diode
USD509487S1 (en) * 2003-06-05 2005-09-13 Nichia Corporation Light emitting diode (LED)
USD489692S1 (en) 2003-06-05 2004-05-11 Nichia Corporation Light emitting diode
USD490783S1 (en) 2003-06-05 2004-06-01 Nichia Corporation Light emitting diode
USD489677S1 (en) 2003-06-05 2004-05-11 Nichia Corporation Light emitting diode
USD490385S1 (en) 2003-06-05 2004-05-25 Nichia Corporation Light emitting diode
USD490062S1 (en) 2003-06-05 2004-05-18 Nichia Corporation Light emitting diode
USD493429S1 (en) 2003-06-05 2004-07-27 Nichia Corporation Light emitting diode
USD489691S1 (en) 2003-06-05 2004-05-11 Nichia Corporation Light emitting diode
USD490386S1 (en) 2003-06-05 2004-05-25 Nichia Corporation Light emitting diode
US7280812B2 (en) * 2003-06-06 2007-10-09 Interdigital Technology Corporation Digital baseband receiver with DC discharge and gain control circuits
US7915085B2 (en) * 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
US7157744B2 (en) * 2003-10-29 2007-01-02 M/A-Com, Inc. Surface mount package for a high power light emitting diode
US7403680B2 (en) 2003-12-02 2008-07-22 3M Innovative Properties Company Reflective light coupler
US7329887B2 (en) 2003-12-02 2008-02-12 3M Innovative Properties Company Solid state light device
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
US7456805B2 (en) 2003-12-18 2008-11-25 3M Innovative Properties Company Display including a solid state light device and method using same
US20050278301A1 (en) * 2004-05-26 2005-12-15 Castellanos Maria G System and method for determining an optimized process configuration
ATE553505T1 (de) 2004-06-15 2012-04-15 Data Cloak Llc Elektro-optische hochleistungs-led-anordnung
ATE549745T1 (de) * 2005-04-21 2012-03-15 Fiat Ricerche Durchsichtige head-up-led-anzeigevorrichtung
ATE458276T1 (de) 2005-04-21 2010-03-15 Fiat Ricerche Durchsichtige led-anzeigevorrichtung
CN100452452C (zh) * 2005-05-17 2009-01-14 财团法人工业技术研究院 备有发光二极管的翻转侧置结构的发光装置
US8113830B2 (en) * 2005-05-27 2012-02-14 Kerr Corporation Curing light instrument
FR2892594B1 (fr) * 2005-10-21 2007-12-07 Saint Gobain Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications
TWI306652B (en) * 2005-10-28 2009-02-21 Chipmos Technologies Inc Light emitting diode package structure
JP2007234681A (ja) * 2006-02-27 2007-09-13 Apic Yamada Corp 半導体製造装置
TWI302043B (en) * 2006-06-27 2008-10-11 Everlight Electronics Co Ltd Base structure for ultra-thin light-emitting diode and manufacturing method thereof
TWI350409B (en) * 2006-07-06 2011-10-11 Nat Univ Chung Hsing Flexible and could be rolling-up area lights module and the method of producing thereof
US8047686B2 (en) 2006-09-01 2011-11-01 Dahm Jonathan S Multiple light-emitting element heat pipe assembly
KR101456266B1 (ko) * 2006-12-08 2014-11-04 서울반도체 주식회사 발광소자
WO2008069605A1 (en) * 2006-12-08 2008-06-12 Seoul Semiconductor Co., Ltd. Light emitting device
US8002434B2 (en) * 2007-02-12 2011-08-23 GE Lighting Solutions, LLC LED lighting systems for product display cases
US11265082B2 (en) 2007-05-24 2022-03-01 Federal Law Enforcement Development Services, Inc. LED light control assembly and system
US9258864B2 (en) 2007-05-24 2016-02-09 Federal Law Enforcement Development Services, Inc. LED light control and management system
WO2008144777A1 (en) 2007-05-24 2008-11-27 Federal Law Enforcement Development Services, Inc. Led light dongle communication system
US9294198B2 (en) 2007-05-24 2016-03-22 Federal Law Enforcement Development Services, Inc. Pulsed light communication key
US9100124B2 (en) 2007-05-24 2015-08-04 Federal Law Enforcement Development Services, Inc. LED Light Fixture
US9455783B2 (en) 2013-05-06 2016-09-27 Federal Law Enforcement Development Services, Inc. Network security and variable pulse wave form with continuous communication
US9414458B2 (en) 2007-05-24 2016-08-09 Federal Law Enforcement Development Services, Inc. LED light control assembly and system
EP2009344A1 (de) * 2007-06-25 2008-12-31 Alcan Technology & Management AG Flächige Beleuchtungseinrichtung, Herstellungsverfahren für eine flächige Beleuchtungseinrichtung
US8274241B2 (en) * 2008-02-06 2012-09-25 C. Crane Company, Inc. Light emitting diode lighting device
US8350499B2 (en) * 2008-02-06 2013-01-08 C. Crane Company, Inc. High efficiency power conditioning circuit for lighting device
TWI362769B (en) 2008-05-09 2012-04-21 Univ Nat Chiao Tung Light emitting device and fabrication method therefor
DE102008030843B4 (de) * 2008-06-30 2021-08-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Anordnung sowie Verfahren zur Herstellung einer optoelektronischen Anordnung
FR2937464B1 (fr) * 2008-10-21 2011-02-25 Commissariat Energie Atomique Assemblage d'une puce microelectronique a rainure avec un element filaire sous forme de toron et procede d'assemblage
US8890773B1 (en) 2009-04-01 2014-11-18 Federal Law Enforcement Development Services, Inc. Visible light transceiver glasses
US9066777B2 (en) 2009-04-02 2015-06-30 Kerr Corporation Curing light device
US9072572B2 (en) 2009-04-02 2015-07-07 Kerr Corporation Dental light device
TWI556696B (zh) * 2009-07-14 2016-11-01 蔡乃成 表面黏著型發光元件燈組之製造方法
WO2011111516A1 (ja) 2010-03-12 2011-09-15 シャープ株式会社 発光装置の製造方法、発光装置、照明装置、バックライト、液晶パネル、表示装置、表示装置の製造方法、表示装置の駆動方法および液晶表示装置
JP2011211047A (ja) * 2010-03-30 2011-10-20 Sharp Corp 表示装置、表示装置の製造方法および表示装置の駆動方法
US9222645B2 (en) 2010-11-29 2015-12-29 RTC Industries, Incorporated LED lighting assembly and method of lighting for a merchandise display
US11274808B2 (en) 2010-06-17 2022-03-15 Rtc Industries, Inc. LED lighting assembly and method of lighting for a merchandise display
CA2824756C (en) 2011-01-14 2014-12-23 Federal Law Enforcement Development Services, Inc. Method of providing lumens and tracking of lumen consumption
KR101824011B1 (ko) 2011-07-29 2018-01-31 엘지이노텍 주식회사 발광소자 패키지
US9194556B1 (en) 2012-02-22 2015-11-24 Theodore G. Nelson Method of producing LED lighting apparatus and apparatus produced thereby
TW201425795A (zh) * 2012-12-25 2014-07-01 Hon Hai Prec Ind Co Ltd Led燈條製作方法
WO2014160096A1 (en) 2013-03-13 2014-10-02 Federal Law Enforcement Development Services, Inc. Led light control and management system
US20150198941A1 (en) 2014-01-15 2015-07-16 John C. Pederson Cyber Life Electronic Networking and Commerce Operating Exchange
US9502625B2 (en) 2014-06-06 2016-11-22 Rohinni, LLC Electrophotographic deposition of unpackaged semiconductor device
US9989223B1 (en) * 2015-03-09 2018-06-05 Automated Assembly Corporation LED lighting apparatus with LEDs and wires attached to metal sheet member by adhesive
US20170048953A1 (en) 2015-08-11 2017-02-16 Federal Law Enforcement Development Services, Inc. Programmable switch and system
DE102016122810A1 (de) 2016-11-25 2018-05-30 Osram Opto Semiconductors Gmbh Bauteil mit einem lichtemittierenden halbleiterchip
WO2018132716A1 (en) * 2017-01-12 2018-07-19 Rohinni, LLC Apparatus for high speed printing of semiconductor devices
JP6952203B2 (ja) * 2018-03-13 2021-10-20 アップル インコーポレイテッドApple Inc. 直接式バックライトユニットを有するディスプレイ
US11526051B2 (en) 2021-04-16 2022-12-13 Apple Inc. Displays with direct-lit backlight units
US11333924B1 (en) 2021-04-16 2022-05-17 Apple Inc. Displays with direct-lit backlight units
US11513392B1 (en) 2021-09-23 2022-11-29 Apple Inc. Direct-lit backlight units with optical films

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1407908A (en) * 1972-04-14 1975-10-01 Sony Corp Alpha-numeric character display devices
US3911431A (en) * 1973-01-22 1975-10-07 Tokyo Shibaura Electric Co Light-emitting display device
US3877052A (en) * 1973-12-26 1975-04-08 Bell Telephone Labor Inc Light-emitting semiconductor apparatus for optical fibers
US3936694A (en) * 1973-12-28 1976-02-03 Sony Corporation Display structure having light emitting diodes
US4024627A (en) * 1974-04-29 1977-05-24 Amp Incorporated Package mounting of electronic chips, such as light emitting diodes
US4249299A (en) * 1979-03-05 1981-02-10 Hughes Aircraft Company Edge-around leads for backside connections to silicon circuit die
JPS553690A (en) * 1979-04-04 1980-01-11 Toshiba Corp Semiconductor luminous indicator
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
JPS5749284A (en) * 1980-09-09 1982-03-23 Matsushita Electric Ind Co Ltd Manufacture of light-emitting display device
US4843036A (en) * 1987-06-29 1989-06-27 Eastman Kodak Company Method for encapsulating electronic devices
DE8711105U1 (de) * 1987-08-14 1987-11-26 Siemens AG, 1000 Berlin und 8000 München Leiterplatte für die Elektronik
US4850780A (en) * 1987-09-28 1989-07-25 Kulicke And Soffa Industries Inc. Pre-peel die ejector apparatus
GB2223429B (en) * 1988-08-24 1993-02-17 Tdk Corp Apparatus for and method of automatically mounting electronic component on printed circuit board
FR2637150B1 (fr) * 1988-09-23 1995-07-28 Neiman Sa Reseau de diodes electroluminescentes

Also Published As

Publication number Publication date
EP0843365A3 (en) 1998-11-11
EP0739043A2 (en) 1996-10-23
EP0739043B1 (en) 2002-02-06
DE69329522T2 (de) 2001-05-17
EP0843365B1 (en) 2002-12-11
DE69331554T2 (de) 2002-07-11
JPH06177435A (ja) 1994-06-24
US5265792A (en) 1993-11-30
US5475241A (en) 1995-12-12
DE69331554D1 (de) 2002-03-21
EP0588040B1 (en) 2000-10-04
DE69332570D1 (de) 2003-01-23
EP0843365A2 (en) 1998-05-20
EP0588040A2 (en) 1994-03-23
DE69329522D1 (de) 2000-11-09
CN1086046A (zh) 1994-04-27
EP0588040A3 (en) 1994-04-06
DE69332570T2 (de) 2003-09-25
EP0739043A3 (en) 1997-10-29
JP3345124B2 (ja) 2002-11-18
KR100297453B1 (ko) 2001-10-24
KR940004877A (ko) 1994-03-16
CN1050936C (zh) 2000-03-29

Similar Documents

Publication Publication Date Title
TW243557B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW265374B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DK0598561T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW225480B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW251326B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DK0553875T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IN178308B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW225580B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW262520B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DK0596750T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW225616B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DK0574087T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DK0553681T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DK0581129T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW252074B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DK0571874T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW268000B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP0556594A3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DK0564197T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IN179513B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DK0599441T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DK0576097T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW239842B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DK0590732T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW265368B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent