TW265368B - - Google Patents

Info

Publication number
TW265368B
TW265368B TW82111252A TW82111252A TW265368B TW 265368 B TW265368 B TW 265368B TW 82111252 A TW82111252 A TW 82111252A TW 82111252 A TW82111252 A TW 82111252A TW 265368 B TW265368 B TW 265368B
Authority
TW
Taiwan
Application number
TW82111252A
Other languages
Chinese (zh)
Original Assignee
Amorphous Techologies Internat Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amorphous Techologies Internat Inc filed Critical Amorphous Techologies Internat Inc
Application granted granted Critical
Publication of TW265368B publication Critical patent/TW265368B/zh

Links

TW82111252A 1992-12-17 1994-03-19 TW265368B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US99204492A 1992-12-17 1992-12-17

Publications (1)

Publication Number Publication Date
TW265368B true TW265368B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1995-12-11

Family

ID=51402118

Family Applications (1)

Application Number Title Priority Date Filing Date
TW82111252A TW265368B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-12-17 1994-03-19

Country Status (1)

Country Link
TW (1) TW265368B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI506727B (zh) * 2012-05-03 2015-11-01 Nat Univ Chung Hsing Semiconductor components High aspect ratio (HAR) hole or trough of the nickel-tungsten alloy filling plating solution and filling process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI506727B (zh) * 2012-05-03 2015-11-01 Nat Univ Chung Hsing Semiconductor components High aspect ratio (HAR) hole or trough of the nickel-tungsten alloy filling plating solution and filling process

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