TW202506405A - 金屬層合材及其製造方法，以及印刷配線板 - Google Patents

金屬層合材及其製造方法，以及印刷配線板 Download PDF

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Publication number
TW202506405A
TW202506405A TW113113552A TW113113552A TW202506405A TW 202506405 A TW202506405 A TW 202506405A TW 113113552 A TW113113552 A TW 113113552A TW 113113552 A TW113113552 A TW 113113552A TW 202506405 A TW202506405 A TW 202506405A
Authority
TW
Taiwan
Prior art keywords
metal
layer
dielectric film
low dielectric
foil
Prior art date
Application number
TW113113552A
Other languages
English (en)
Chinese (zh)
Inventor
畠田貴文
南部光司
丸橋由和
Original Assignee
日商東洋鋼鈑股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東洋鋼鈑股份有限公司 filed Critical 日商東洋鋼鈑股份有限公司
Publication of TW202506405A publication Critical patent/TW202506405A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)
TW113113552A 2023-04-19 2024-04-11 金屬層合材及其製造方法，以及印刷配線板 TW202506405A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023068300 2023-04-19
JP2023-068300 2023-04-19

Publications (1)

Publication Number Publication Date
TW202506405A true TW202506405A (zh) 2025-02-16

Family

ID=93152366

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113113552A TW202506405A (zh) 2023-04-19 2024-04-11 金屬層合材及其製造方法，以及印刷配線板

Country Status (5)

Country Link
JP (1) JPWO2024219326A1 (https=)
KR (1) KR20250172614A (https=)
CN (1) CN120936492A (https=)
TW (1) TW202506405A (https=)
WO (1) WO2024219326A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4532713B2 (ja) * 2000-10-11 2010-08-25 東洋鋼鈑株式会社 多層金属積層フィルム及びその製造方法
JP2005324467A (ja) * 2004-05-14 2005-11-24 Toyo Kohan Co Ltd 低熱膨張積層材の製造方法および低熱膨張積層材を用いた部品の製造方法
JP4683646B2 (ja) * 2006-03-31 2011-05-18 Ｊｘ日鉱日石金属株式会社 プリント配線基板用銅又は銅合金箔
JP6682516B2 (ja) * 2015-04-28 2020-04-15 三井金属鉱業株式会社 粗化処理銅箔及びプリント配線板
KR101742978B1 (ko) 2015-06-18 2017-06-05 주식회사 그린플러스 갑각류 양식시스템
JP6985745B2 (ja) * 2018-06-20 2021-12-22 ナミックス株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP7618390B2 (ja) * 2020-04-22 2025-01-21 東洋鋼鈑株式会社 金属積層フィルム及びその製造方法

Also Published As

Publication number Publication date
CN120936492A (zh) 2025-11-11
JPWO2024219326A1 (https=) 2024-10-24
WO2024219326A1 (ja) 2024-10-24
KR20250172614A (ko) 2025-12-09

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