JPWO2024219326A1 - - Google Patents
Info
- Publication number
- JPWO2024219326A1 JPWO2024219326A1 JP2025515201A JP2025515201A JPWO2024219326A1 JP WO2024219326 A1 JPWO2024219326 A1 JP WO2024219326A1 JP 2025515201 A JP2025515201 A JP 2025515201A JP 2025515201 A JP2025515201 A JP 2025515201A JP WO2024219326 A1 JPWO2024219326 A1 JP WO2024219326A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023068300 | 2023-04-19 | ||
| PCT/JP2024/014800 WO2024219326A1 (ja) | 2023-04-19 | 2024-04-12 | 金属積層材及びその製造方法、並びにプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024219326A1 true JPWO2024219326A1 (https=) | 2024-10-24 |
| JPWO2024219326A5 JPWO2024219326A5 (https=) | 2026-01-16 |
Family
ID=93152366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025515201A Pending JPWO2024219326A1 (https=) | 2023-04-19 | 2024-04-12 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024219326A1 (https=) |
| KR (1) | KR20250172614A (https=) |
| CN (1) | CN120936492A (https=) |
| TW (1) | TW202506405A (https=) |
| WO (1) | WO2024219326A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4532713B2 (ja) * | 2000-10-11 | 2010-08-25 | 東洋鋼鈑株式会社 | 多層金属積層フィルム及びその製造方法 |
| JP2005324467A (ja) * | 2004-05-14 | 2005-11-24 | Toyo Kohan Co Ltd | 低熱膨張積層材の製造方法および低熱膨張積層材を用いた部品の製造方法 |
| JP4683646B2 (ja) * | 2006-03-31 | 2011-05-18 | Ｊｘ日鉱日石金属株式会社 | プリント配線基板用銅又は銅合金箔 |
| JP6682516B2 (ja) * | 2015-04-28 | 2020-04-15 | 三井金属鉱業株式会社 | 粗化処理銅箔及びプリント配線板 |
| KR101742978B1 (ko) | 2015-06-18 | 2017-06-05 | 주식회사 그린플러스 | 갑각류 양식시스템 |
| JP6985745B2 (ja) * | 2018-06-20 | 2021-12-22 | ナミックス株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
| JP7618390B2 (ja) * | 2020-04-22 | 2025-01-21 | 東洋鋼鈑株式会社 | 金属積層フィルム及びその製造方法 |
-
2024
- 2024-04-11 TW TW113113552A patent/TW202506405A/zh unknown
- 2024-04-12 JP JP2025515201A patent/JPWO2024219326A1/ja active Pending
- 2024-04-12 KR KR1020257036864A patent/KR20250172614A/ko active Pending
- 2024-04-12 WO PCT/JP2024/014800 patent/WO2024219326A1/ja not_active Ceased
- 2024-04-12 CN CN202480025670.0A patent/CN120936492A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202506405A (zh) | 2025-02-16 |
| CN120936492A (zh) | 2025-11-11 |
| WO2024219326A1 (ja) | 2024-10-24 |
| KR20250172614A (ko) | 2025-12-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251008 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251008 |