KR20250172614A - 금속 적층재 및 그 제조 방법, 그리고 프린트 배선판 - Google Patents

금속 적층재 및 그 제조 방법, 그리고 프린트 배선판

Info

Publication number
KR20250172614A
KR20250172614A KR1020257036864A KR20257036864A KR20250172614A KR 20250172614 A KR20250172614 A KR 20250172614A KR 1020257036864 A KR1020257036864 A KR 1020257036864A KR 20257036864 A KR20257036864 A KR 20257036864A KR 20250172614 A KR20250172614 A KR 20250172614A
Authority
KR
South Korea
Prior art keywords
metal
layer
low
film
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257036864A
Other languages
English (en)
Korean (ko)
Inventor
타카후미 하타케다
코우지 난부
요시카즈 마루하시
Original Assignee
도요 고한 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도요 고한 가부시키가이샤 filed Critical 도요 고한 가부시키가이샤
Publication of KR20250172614A publication Critical patent/KR20250172614A/ko
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)
KR1020257036864A 2023-04-19 2024-04-12 금속 적층재 및 그 제조 방법, 그리고 프린트 배선판 Pending KR20250172614A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-068300 2023-04-19
JP2023068300 2023-04-19
PCT/JP2024/014800 WO2024219326A1 (ja) 2023-04-19 2024-04-12 金属積層材及びその製造方法、並びにプリント配線板

Publications (1)

Publication Number Publication Date
KR20250172614A true KR20250172614A (ko) 2025-12-09

Family

ID=93152366

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257036864A Pending KR20250172614A (ko) 2023-04-19 2024-04-12 금속 적층재 및 그 제조 방법, 그리고 프린트 배선판

Country Status (5)

Country Link
JP (1) JPWO2024219326A1 (https=)
KR (1) KR20250172614A (https=)
CN (1) CN120936492A (https=)
TW (1) TW202506405A (https=)
WO (1) WO2024219326A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160149438A (ko) 2015-06-18 2016-12-28 주식회사 그린플러스 갑각류 양식시스템

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4532713B2 (ja) * 2000-10-11 2010-08-25 東洋鋼鈑株式会社 多層金属積層フィルム及びその製造方法
JP2005324467A (ja) * 2004-05-14 2005-11-24 Toyo Kohan Co Ltd 低熱膨張積層材の製造方法および低熱膨張積層材を用いた部品の製造方法
JP4683646B2 (ja) * 2006-03-31 2011-05-18 Ｊｘ日鉱日石金属株式会社 プリント配線基板用銅又は銅合金箔
JP6682516B2 (ja) * 2015-04-28 2020-04-15 三井金属鉱業株式会社 粗化処理銅箔及びプリント配線板
JP6985745B2 (ja) * 2018-06-20 2021-12-22 ナミックス株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP7618390B2 (ja) * 2020-04-22 2025-01-21 東洋鋼鈑株式会社 金属積層フィルム及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160149438A (ko) 2015-06-18 2016-12-28 주식회사 그린플러스 갑각류 양식시스템

Also Published As

Publication number Publication date
TW202506405A (zh) 2025-02-16
CN120936492A (zh) 2025-11-11
JPWO2024219326A1 (https=) 2024-10-24
WO2024219326A1 (ja) 2024-10-24

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