CN120936492A - 金属层叠材料及其制造方法、印刷线路板 - Google Patents

金属层叠材料及其制造方法、印刷线路板

Info

Publication number
CN120936492A
CN120936492A CN202480025670.0A CN202480025670A CN120936492A CN 120936492 A CN120936492 A CN 120936492A CN 202480025670 A CN202480025670 A CN 202480025670A CN 120936492 A CN120936492 A CN 120936492A
Authority
CN
China
Prior art keywords
metal
layer
dielectric film
foil
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480025670.0A
Other languages
English (en)
Chinese (zh)
Inventor
畠田贵文
南部光司
丸桥由和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Kohan Co Ltd
Original Assignee
Toyo Kohan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Kohan Co Ltd filed Critical Toyo Kohan Co Ltd
Publication of CN120936492A publication Critical patent/CN120936492A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)
CN202480025670.0A 2023-04-19 2024-04-12 金属层叠材料及其制造方法、印刷线路板 Pending CN120936492A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023068300 2023-04-19
JP2023-068300 2023-04-19
PCT/JP2024/014800 WO2024219326A1 (ja) 2023-04-19 2024-04-12 金属積層材及びその製造方法、並びにプリント配線板

Publications (1)

Publication Number Publication Date
CN120936492A true CN120936492A (zh) 2025-11-11

Family

ID=93152366

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480025670.0A Pending CN120936492A (zh) 2023-04-19 2024-04-12 金属层叠材料及其制造方法、印刷线路板

Country Status (5)

Country Link
JP (1) JPWO2024219326A1 (https=)
KR (1) KR20250172614A (https=)
CN (1) CN120936492A (https=)
TW (1) TW202506405A (https=)
WO (1) WO2024219326A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4532713B2 (ja) * 2000-10-11 2010-08-25 東洋鋼鈑株式会社 多層金属積層フィルム及びその製造方法
JP2005324467A (ja) * 2004-05-14 2005-11-24 Toyo Kohan Co Ltd 低熱膨張積層材の製造方法および低熱膨張積層材を用いた部品の製造方法
JP4683646B2 (ja) * 2006-03-31 2011-05-18 Ｊｘ日鉱日石金属株式会社 プリント配線基板用銅又は銅合金箔
JP6682516B2 (ja) * 2015-04-28 2020-04-15 三井金属鉱業株式会社 粗化処理銅箔及びプリント配線板
KR101742978B1 (ko) 2015-06-18 2017-06-05 주식회사 그린플러스 갑각류 양식시스템
JP6985745B2 (ja) * 2018-06-20 2021-12-22 ナミックス株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP7618390B2 (ja) * 2020-04-22 2025-01-21 東洋鋼鈑株式会社 金属積層フィルム及びその製造方法

Also Published As

Publication number Publication date
TW202506405A (zh) 2025-02-16
JPWO2024219326A1 (https=) 2024-10-24
WO2024219326A1 (ja) 2024-10-24
KR20250172614A (ko) 2025-12-09

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